SULFUR DOPED CARBON HARD MASKS
First Claim
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1. A method of forming an ashable hard mask on a first layer to be etched on a semiconductor substrate, comprising:
- providing a precursor gas comprising a carbon source and a sulfur source to a deposition chamber housing the semiconductor substrate, andgenerating a plasma from the precursor gas to thereby deposit a sulfur-doped ashable hard mask on the first layer by a plasma enhanced chemical vapor deposition (PECVD) process.
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Abstract
Provided are methods of forming ashable hard masks (AHMs) with high etch selectivity and low hydrogen content using plasma enhanced chemical vapor deposition. Methods involve exposing a first layer to be etched on a semiconductor substrate to a carbon source and sulfur source, and generating a plasma to deposit a sulfur-doped AHM or amorphous carbon-based film on the first layer.
6 Citations
18 Claims
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1. A method of forming an ashable hard mask on a first layer to be etched on a semiconductor substrate, comprising:
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providing a precursor gas comprising a carbon source and a sulfur source to a deposition chamber housing the semiconductor substrate, and generating a plasma from the precursor gas to thereby deposit a sulfur-doped ashable hard mask on the first layer by a plasma enhanced chemical vapor deposition (PECVD) process. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14)
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15. A method of forming a sulfur-doped amorphous carbon-based film on a semiconductor substrate, comprising:
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providing the semiconductor substrate in a deposition chamber, exposing the substrate to a precursor gas comprising a carbon source and a sulfur source, and depositing a sulfur-doped amorphous carbon-based film on the substrate by a plasma enhanced chemical vapor deposition (PECVD) process. - View Dependent Claims (16, 17)
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18. An apparatus configured to process a semiconductor substrate, the apparatus comprising:
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(a) a deposition chamber comprising; a showerhead, a plasma generator, a substrate support, and one or more gas inlets; and (b) a controller for controlling the operations in the apparatus, comprising machine-readable instructions for; flowing a precursor gas comprising a carbon source and a sulfur source to the deposition chamber housing the semiconductor substrate, and applying power to the plasma generator to generate plasma from the precursor gas to thereby deposit a sulfur-doped ashable hard mask on the substrate by a plasma enhanced chemical vapor deposition (PECVD) process.
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Specification