Packages with Thermal Interface Material on the Sidewalls of Stacked Dies

• US 20150108628A1
• Filed: 10/17/2013
• Published: 04/23/2015
• Est. Priority Date: 08/02/2013
• Status: Active Grant

• Current Assignee: Taiwan Semiconductor Manufacturing Company Limited
• Original Assignee: Taiwan Semiconductor Manufacturing Company Limited
• Inventors: Yu, Chen-Hua, Hung, Wensen, Huang, Szu-Po, Su, An-Jhih, Lee, Hsiang-Fan, Chen, Kim Hong, Wu, Chi-Hsi, Jeng, Shin-Puu
• Granted Patent: US 9,583,415 B2
• Time in Patent Office: Days
• US Class Current: 257/712
• CPC Class Codes: H01L 2224/16145 the bodies being stacked
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/73204 the bump connector being embedded into the layer connector
• CPC Class Codes: H01L 23/10 characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
• CPC Class Codes: H01L 23/3128 the substrate having spherical bumps for external connection
• CPC Class Codes: H01L 23/36 Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks H01L23/28, H01L23/40, H01L23/42, H01L23/44, H01L23/46 take precedence; heating H01L23/345
• CPC Class Codes: H01L 23/3675 characterised by the shape of the housing
• CPC Class Codes: H01L 23/42 Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
• CPC Class Codes: H01L 23/49816 Spherical bumps on the substrate for external connection, e.g. ball grid arrays [BGA]
• CPC Class Codes: H01L 23/5385 Assembly of a plurality of insulating substrates
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 2924/15174 in different layers of the multilayer substrate
• CPC Class Codes: H01L 2924/15311 being a ball array, e.g. BGA
• CPC Class Codes: H01L 2924/18161 of a flip chip

Abstract

A package includes a die stack that includes at least two stacked dies, and a Thermal Interface Material (TIM). The TIM includes a top portion over and contacting a top surface of the die stack, and a sidewall portion extending from the top portion down to lower than at least one of the at least two stacked dies. A first metallic heat-dissipating feature is over and contacting the top portion of TIM. A second metallic heat-dissipating feature has a sidewall contacting a sidewall of the sidewall portion of the TIM.

Claims

1. A package comprising:

a die stack comprising at least two stacked dies;

a Thermal Interface Material (TIM) comprising;

a top portion over and contacting a top surface of the die stack; and

a sidewall portion extending from the top portion down to lower than at least one of the at least two stacked dies;

a first metallic heat-dissipating feature over and contacting the top portion of the TIM; and

a second metallic heat-dissipating feature comprising a sidewall contacting a first sidewall of the sidewall portion of the TIM.

2. The package of claim 1, wherein the second metallic heat-dissipating feature forms a ring encircling the die stack.

3. The package of claim 1, wherein the first metallic heat-dissipating feature and the second metallic heat-dissipating feature are portions of an integrated metallic heat-dissipating feature.

4. The package of claim 1, wherein the first metallic heat-dissipating feature and the second metallic heat-dissipating feature are separated from each by an adhesive.

5. The package of claim 4, wherein the adhesive comprise a first portion forming a first ring, and a second portion forming a second ring encircling the first ring, wherein the first ring and the second ring are separated from each other.

6. The package of claim 1 further comprising a molding compound comprising:

a first sidewall contacting the die stack; and

a second sidewall contacting a second sidewall of the sidewall portion of the TIM.

7. The package of claim 6, wherein the die stack comprises:

a first die; and

a second die underlying and bonded to the first die, wherein the second die comprises;

a first portion overlapped by the first die; and

a second portion not overlapped by the first die, wherein the molding compound overlaps the second portion of the second die.

8. A package comprising:

a package component;

a die stack over and bonded to the package component, wherein the die stack comprises at least two stacked dies;

a molding compound encircling and contacting the die stack;

a Thermal Interface Material (TIM) comprising;

a top portion over and contacting a top surface of the die stack; and

a ring portion encircling and contacting sidewalls of the molding compound;

a first metallic heat-dissipating feature over and contacting the top portion of the TIM; and

a second metallic heat-dissipating feature encircling and contacting the ring portion of the TIM.

9. The package of claim 8, wherein the second metallic heat-dissipating feature comprises a chamfer contacting the ring portion of the TIM.

10. The package of claim 8 further comprising:

an additional die stack comprising an additional top surface higher than the top surface of the die stack, wherein the second metallic heat-dissipating feature further encircles the additional die stack; and

an additional TIM over the additional top surface, wherein the first metallic heat-dissipating feature is over and contacting the additional TIM.

11. The package of claim 8 further comprising a heat pipe in one of the first metallic heat-dissipating feature and the second metallic heat-dissipating feature.

12. The package of claim 8 further comprising a heat sink in the first metallic heat-dissipating feature.

13. The package of claim 8 further comprising an adhesive over and contacting the package component, wherein the second metallic heat-dissipating feature comprises a bottom over and contacting the adhesive, and wherein the adhesive comprises:

an inner portion forming a first ring; and

an outer portion forming a second ring encircling the first ring.

14. The package of claim 8, wherein the die stack comprises:

a first die; and

a second die underlying and bonded to the first die, wherein the second die comprises;

a first portion overlapped by the first die; and

a second portion not overlapped by the first die, wherein the molding compound overlaps the second portion of the second die.

15. A package comprising:

a package substrate;

a die stack over and bonded to the package substrate, wherein the die stack comprises at least two stacked dies;

a molding compound encircling and contacting a portion of the die stack;

an adhesive over and contacting the package substrate;

a Thermal Interface Material (TIM) comprising;

a top portion over and contacting a top surface of the die stack; and

a ring portion encircling and contacting sidewalls of the molding compound; and

a heat dissipating lid comprising;

a top portion over and contacting the top portion of the TIM; and

a ring portion connected to the top portion of the heat dissipating lid, wherein the ring portion of the heat dissipating lid encircles and contacts sidewalls of the ring portion of the TIM, and wherein a bottom surface of the ring portion of the heat dissipating lid is over and contacting the adhesive.

16. The package of claim 15, wherein the adhesive comprises:

an inner portion forming a first ring; and

an outer portion forming a second ring encircling the first ring.

17. The package of claim 15, wherein the ring portion of the heat dissipating lid comprises a chamfer contacting the ring portion of the TIM.

18. The package of claim 17, wherein the chamfer forms a ring encircling the die stack.

19. The package of claim 17, wherein the heat dissipating lid comprises a heat sink, with the heat sink comprising a plurality of fins separated by trenches.

20. The package of claim 15 further comprising:

an additional die stack comprising an additional top surface higher than the top surface of the die stack, wherein the heat dissipating lid further comprises an additional ring portion encircling the additional die stack; and

an additional TIM over the additional top surface, wherein the top portion of the heat dissipating lid is over and contacting the additional TIM.