CMP PAD DRESSERS HAVING LEVELED TIPS AND ASSOCIATED METHODS

• US 20150133036A1
• Filed: 10/03/2014
• Published: 05/14/2015
• Est. Priority Date: 05/16/2005
• Status: Active Grant

• Current Assignee: Chien-Min Sung
• Original Assignee: Chien-Min Sung
• Inventors: Sung, Chien-Min
• Granted Patent: US 9,724,802 B2
• Time in Patent Office: Days
• US Class Current: 451/56
• CPC Class Codes: B24B 53/017 Devices or means for dressing, cleaning or otherwise conditioning lapping tools
• CPC Class Codes: B24B 53/12 Dressing tools; Holders therefor
• CPC Class Codes: B24D 3/00 Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents

Abstract

CMP pad dressers having leveled tips and associated methods are provided. In one aspect, for example, a CMP pad dresser can include a support substrate and a plurality of superabrasive particles secured to the support substrate with each superabrasive particle extending away from the support substrate to a protrusion distance, where a highest protruding tip of each of the plurality of superabrasive particles align along a designated profile with a tip variation of from about 5 microns to about 100 microns.

Claims

1. A CMP pad dresser, comprising:

a support substrate; and

a plurality of superabrasive particles secured to the support substrate with each superabrasive particle extending away from the support substrate to a protrusion distance, wherein a highest protruding tip of each of the plurality of superabrasive particles align along a designated profile with a tip variation of from about 5 microns to about 100 microns.

2. The dresser of claim 1, wherein the highest protruding tip of each of the plurality of superabrasive particles align along the designated profile with a tip variation of from about 10 microns to about 50 microns.

3. The dresser of claim 1, wherein the highest protruding tip of each of the plurality of superabrasive particles align along the designated profile with a tip variation of from about 20 microns to about 40 microns.

4. The dresser of claim 1, wherein the highest protruding tip of each of the plurality of superabrasive particles align along the designated profile with a tip variation of less than about 20 microns.

5. The dresser of claim 1, wherein the protrusions of the plurality of superabrasive particles produce cutting depths of less than about 20 microns when used to abrade a CMP pad.

6. The dresser of claim 1, wherein the protrusions of the plurality of superabrasive particles produce cutting depths of from about 1 micron to about 20 microns when used to abrade a CMP pad.

7. The dresser of claim 1, wherein the protrusions of the plurality of superabrasive particles produce cutting depths of from about 10 microns to about 20 microns when used to abrade a CMP pad.

8. The dresser of claim 1, wherein the designated profile includes a configuration selected from the group consisting of a plane, a slope, a curved shape, a dome shape, and combinations thereof.

9. The dresser of claim 1, wherein the plurality of superabrasive particles is arranged across the support substrate in a predetermined pattern.

10. The dresser of claim 9, wherein the predetermined pattern includes an even distribution of the plurality of superabrasive particles spaced at a distance of from about 100 microns to about 800 microns.

11. A CMP pad dresser, comprising:

a rigid support substrate; and

a monolayer of a plurality of superabrasive particles coupled to the support substrate, wherein each superabrasive particle in the monolayer extends away from the support substrate to a protrusion distance, and wherein the difference in protrusion distance between the highest protruding tip and the second highest protruding tip of the monolayer of superabrasive particles is less than or equal to about 50 microns, and the difference in protrusion distance between the highest 1% of the protruding tips of the monolayer of superabrasive particles are within about 80 microns or less.

12. The dresser of claim 11, wherein the difference in protrusion distance between the highest protruding tip and the second highest protruding tip is less than or equal to about 10 microns.

13. The dresser of claim 11, wherein the difference in protrusion distance between the highest protruding tip and the second highest protruding tip is less than or equal to about 10 microns.

14. The dresser of claim 11, wherein the difference in protrusion distance between the highest protruding tip and the 10^th highest protruding tip is less than or equal to about 20 microns.

15. The dresser of claim 11, wherein the difference in protrusion distance between the highest protruding tip and the 100^th highest protruding tip is less than or equal to about 40 microns.

16. A CMP pad dresser, comprising:

a rigid support substrate; and

a monolayer of a plurality of superabrasive particles coupled to the support substrate, wherein the plurality of superabrasive particles includes a plurality of working superabrasive particles, such that rotating the dresser against a CMP pad cuts asperities into the CMP pad having a cutting depth of less than or equal to about 50 microns.

17. The dresser of claim 16, wherein the cutting depth is from about 10 microns to about 50 microns.

18. The dresser of claim 16, wherein the plurality of working superabrasive particles includes at least 100 working superabrasive particles.

19. The dresser of claim 16, wherein the plurality of working superabrasive particles includes at least 1000 working superabrasive particles.

20. The dresser of claim 16, wherein the plurality of working superabrasive particles includes from about 1000 to about 6000 working superabrasive particles.

21. The dresser of claim 16, wherein the plurality of working superabrasive particles includes from about 2000 to about 5000 working superabrasive particles.

22. The dresser of claim 16, wherein the plurality of working superabrasive particles include at least about 1000 working superabrasive particles that protrude from the rigid support substrate to distances within about 30 microns of one another.

23. A method of dressing a CMP pad, comprising:

applying the CMP pad dresser of claim 16 to a CMP pad;

moving at least one of the CMP pad or the CMP pad dresser with respect to one another to cut asperities into the CMP pad having a cutting depth of from about 10 microns to about 50 microns.

24. A CMP pad dresser, comprising:

a support substrate; and

a plurality of superabrasive particles secured to the support substrate and positioned to engage and dress a CMP pad, wherein the plurality of superabrasive particles cut to depths of less than 50 microns into a CMP pad during a dressing procedure.