ELECTRICAL CONTACTS TO NANOSTRUCTURED AREAS
First Claim
1. An optoelectronic device comprising (a) a substrate, (b) a nanostructured area on a first surface of the substrate, (c) an electrically insulating layer atop the first surface, (d) a segment of the nanostructured area where the nanostructures are at least partially broken or removed, (e) optionally a covering layer atop the segment, and (f) a conductor atop the electrically insulating layer and optional covering layer.
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Abstract
A process is provided for contacting a nanostructured surface. In that process, a substrate is provided having a nanostructured material on a surface, the substrate being conductive and the nanostructured material being coated with an insulating material. A portion of the nanostructured material is at least partially removed. A conductor is deposited on the substrate in such a way that it is in electrical contact with the substrate through the area where the nanostructured material has been at least partially removed.
5 Citations
12 Claims
- 1. An optoelectronic device comprising (a) a substrate, (b) a nanostructured area on a first surface of the substrate, (c) an electrically insulating layer atop the first surface, (d) a segment of the nanostructured area where the nanostructures are at least partially broken or removed, (e) optionally a covering layer atop the segment, and (f) a conductor atop the electrically insulating layer and optional covering layer.
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11. An optoelectronic device comprising (a) a substrate, (b) a nanostructured area on a first surface of the substrate, (c) a passivation layer atop the first surface, (d) a segment of the nanostructured area where there is a plurality of holes in the passivation layer, (e) an optional covering layer atop the segment, and (f) a conductor atop the passivation layer and optional covering layer.
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12. A process for electroplating a substrate, comprising the steps of (a) depositing alumina on the substrate, (b) patterning the alumina so that the presence of alumina over portions of the substrate is substantially eliminated, (c) placing the substrate in an electroplating solution in a suitable holder, (d) applying an appropriate current to achieve a thickness of electroplated material atop the substrate, wherein electroplating takes place solely or predominantly in the portions of the substrate where the presence of alumina was substantially eliminated.
Specification