INTRACRANIAL SENSING & MONITORING DEVICE WITH MACRO AND MICRO ELECTRODES

• US 20150157236A1
• Filed: 01/29/2015
• Published: 06/11/2015
• Est. Priority Date: 03/29/2012
• Status: Active Grant

• Current Assignee: AD-Tech Medical Instrument Corp.
• Original Assignee: AD-Tech Medical Instrument Corp.
• Inventors: Putz, David A.
• Granted Patent: US 9,155,486 B2
• Time in Patent Office: Days
• US Class Current: 1/1
• CPC Class Codes: A61B 2562/043 in a linear array
• CPC Class Codes: A61B 2562/08 Sensors provided with means for identification, e.g. barcodes or memory chips
• CPC Class Codes: A61B 2562/164 the sensor is mounted in or on a conformable substrate or carrier
• CPC Class Codes: A61B 5/24 Detecting, measuring or recording bioelectric or biomagnetic signals of the body or parts thereof
• CPC Class Codes: A61B 5/291 for electroencephalography [EEG]
• CPC Class Codes: A61B 5/4064 Evaluating the brain A61B5/031, A61B5/369, A61B5/14553 take precedence
• CPC Class Codes: A61B 5/6868 Brain
• CPC Class Codes: A61B 5/6879 Means for maintaining contact with the body A61B5/6847 takes precedence

Abstract

A cortical sensing device for contact with the surface of the brain is provided that includes a support member, at least one macroelectrode sensing element secured with respect to the support member and at least one microelectrode sensing element secured with respect to the macroelectrode. The support member is substantially thin and made from flexibly-conformable material to accurately and safely place the sensing device upon the brain surface. The microelectrode sensing element is surrounded by the macroelectrode brain-contact surface of the macroelectrode sensing element. The first surface of the support member, the macroelectrode brain-contact surface and the microelectrode brain-contact surface are substantially co-planar to abut the surface of the brain for sensoring and monitoring.

Claims

1. A sensing device for contact with brain tissue comprising:

a flexible support sleeve having an outer surface and inner surface defining a cavity;

at least one macroelectrode sensing element secured with respect to the outer surface and having a macroelectrode brain-contact surface;

a lead wire secured to each macroelectrode sensing element and extending into and along the cavity;

at least one microelectrode sensing element secured with respect to the macroelectrode sensing element and having a microelectrode brain-contact surface surrounded by the macroelectrode brain-contact surface; and

a micro-wire secured to each macroelectrode sensing element and extending into and along the cavity, wherein the macroelectrode brain-contact surface and the microelectrode brain-contact surface are in substantially the same curved surface to abut brain tissue for sensoring and monitoring.

2. The sensing device of claim 1 wherein the micro-wire is insulated therealong with a bio-compatible material to prevent electrical interaction between the microelectrode sensing element and macroelectrode sensing element.

3. The sensing device of claim 1 wherein the microelectrode sensing element is adapted to monitor cellular neuron activity signals within the brain, while the macroelectrode sensing element is adapted to monitor EEG brain activity signals from the brain.

4. The sensing device of claim 1 further including a plurality of the microelectrode sensing elements spaced from one another on the macroelectrode sensing element.

5. The sensing device of claim 1 wherein the macroelectrode sensing element is comprised of a single layer of material having a thickness of about 0.0005-0.004 inches and a diameter of about 0.3 mm.-5.0 mm.

6. The sensing device of claim 5 wherein the macroelectrode sensing element is stainless steel or a noble alloy selected from the group consisting of platinum, gold, palladium, iridium and ruthenium alloys and combinations thereof.

7. The sensing device of claim 1 wherein the microelectrode brain-contact surface has a diameter of about 10-250 microns.

8. The sensing device of claim 7 wherein the microelectrode sensing element is comprised of a noble alloy selected from the group consisting of platinum, gold, palladium, iridium and ruthenium alloys and combinations thereof.