DISK HAVING AN ELECTRICAL CONNECTION ELEMENT

• US 20150162677A1
• Filed: 05/16/2013
• Published: 06/11/2015
• Est. Priority Date: 06/06/2012
• Status: Active Grant

• Current Assignee: Saint-Gobain Glass France (Compagnie De Saint-Gobain)
• Original Assignee: Saint-Gobain Glass France (Compagnie De Saint-Gobain)
• Inventors: REUL, Bernhard, SCHMALBUCH, Klaus, LESMEISTER, Lothar, RATEICZAK, Mitja
• Granted Patent: US 9,496,632 B2
• Time in Patent Office: Days
• US Class Current: 1/1
• CPC Class Codes: B23K 1/0004 Resistance soldering
• CPC Class Codes: B23K 1/0008 specially adapted for particular articles or work
• CPC Class Codes: B23K 1/0016 Brazing of electronic components
• CPC Class Codes: B23K 1/002 Soldering by means of induction heating
• CPC Class Codes: B23K 1/005 Soldering by means of radiant energy
• CPC Class Codes: B23K 1/012 Soldering with the use of hot gas
• CPC Class Codes: B23K 2101/36 Electric or electronic devices
• CPC Class Codes: B23K 35/0222 for use in soldering, brazing B23K35/0205 takes precedence
• CPC Class Codes: B23K 35/0238 layered
• CPC Class Codes: B23K 35/3006 Ag as the principal constituent
• CPC Class Codes: C22C 12/00 Alloys based on antimony or bismuth
• CPC Class Codes: C22C 38/04 containing manganese
• CPC Class Codes: C22C 38/26 with niobium or tantalum
• CPC Class Codes: C22C 38/28 with titanium or zirconium
• CPC Class Codes: H01R 12/57 surface mounting terminals
• CPC Class Codes: H01R 12/718 Contact members provided on the PCB without an insulating housing contacts for abutting H01R12/714
• CPC Class Codes: H01R 13/03 characterised by the material, e.g. plating, or coating materials
• CPC Class Codes: H01R 13/111 co-operating with pins having a circular transverse section
• CPC Class Codes: H01R 2101/00 One pole
• CPC Class Codes: H01R 4/02 Soldered or welded connections H01R4/625, H01R4/723, H01R12/59 take precedence
• CPC Class Codes: H01R 43/02 : for soldered or welded connections
• CPC Class Codes: H01R 43/0235 : for applying solder H01R43/0228 takes precedence
• CPC Class Codes: H05B 2203/016 : Heaters using particular connecting means
• CPC Class Codes: H05K 1/111 : Pads for surface mounting, e.g. lay-out

Abstract

A pane with at least one electrical connection element, having: a substrate, an electrically conductive structure on a region of the substrate, a connection element that is implemented as a snap and contains at least one chromium-containing steel, and a layer of a soldering compound, which electrically connects the connection element to a subregion of the electrically conductive structure.

Claims

1. A pane with at least one electrical connection element, comprising:

a substrate,

an electrically conductive structure on a region of the substrate,

a connection element that is implemented as a snap and contains chromium-containing steel, and

a layer of a soldering compound, which electrically connects the connection element at least to a subregion of the electrically conductive structure,

wherein the substrate contains soda lime glass.

2. The pane according to claim 1, wherein the difference between the coefficient of thermal expansion of the substrate and the coefficient of thermal expansion of the connection element is <

5×

10<sup>−

6</sup>/°

C.

3. The pane according to claim 1, wherein the connection element contains at least 50 wt.-% to 89.5 wt.-% iron, 10.5 wt.-% to 20 wt.-% chromium, 0 wt.-% to 1 wt.-% carbon, 0 wt.-% to 5 wt.-% nickel, 0 wt.-% to 2 wt.-% manganese, 0 wt.-% to 2.5 wt.-% molybdenum, or 0 wt.-% to 1 wt.-% titanium.

4. The pane according to claim 3, wherein the connection element contains at least 75 wt.-% to 84 wt.-% iron, 16 wt.-% to 18.5 wt.-% chromium, 0 wt.-% to 0.1 wt.-% carbon, 0 wt.-% to 1 wt.-% manganese, or 0 wt.-% to 1 wt.-% titanium.

5. The pane according to claim 1, wherein the electrically conductive structure contains silver.

6. The pane according to claim 1, wherein the layer thickness of the soldering compound is less than or equal to 6.0×

10<sup>−

4</sup> m.

7. The pane according to claim 1, wherein the soldering compound contains tin and bismuth, indium, zinc, copper, silver, or compositions thereof.

8. The pane according to claim 7, wherein the proportion of tin in the solder composition is 3 wt.-% to 99.5 wt.-% and the proportion of bismuth, indium, zinc, copper, silver, or compositions thereof is 0.5 wt.-% to 97 wt.-%.

9. The pane according to claim 1, wherein the connection element is coated with nickel, tin, copper, and/or silver.

10. The pane according to claim 9, wherein the connection element is coated with 0.1 μ

m to 0.3 μ

m nickel and/or 3 μ

m to 20 μ

m silver.

11. The pane according to claim 1, wherein the connection element is connected to the subregion of the electrically conductive structure via a contact surface over its entire surface.

12. The pane according to claim 11, wherein the contact surface has no corners.

13. A method for producing a pane with at least one electrical connection element according to claim 1, wherein:

a soldering compound is applied on a connection element as a platelet,

an electrically conductive structure is applied on a substrate,

the connection element with the soldering compound is arranged on the electrically conductive structure, and

the connection element is soldered to the electrically conductive structure.

14. Use of a pane with at least one electrical connection element according to claim 1, for motor vehicles with electrically conductive structures, preferably with heating conductors and/or antenna conductors.