H01L 2224/32225 :
the item being non-metallic...
H01L 2224/73204 :
the bump connector being em...
H01L 2224/83385 :
Shape, e.g. interlocking fe...
H01L 2224/83851 :
being an anisotropic conduc...
H01L 2224/83862 :
Heat curing
H01L 2225/107 :
Indirect electrical connect...
H01L 23/367 :
Cooling facilitated by shap...
H01L 23/4985 :
Flexible insulating substra...
H01L 23/5387 :
Flexible insulating substra...
H01L 24/32 :
of an individual layer conn...
H01L 24/83 :
using a layer connector
H01L 25/0753 :
the devices being arranged ...
H01L 27/156 :
two-dimensional arrays
H01L 2924/00 :
Indexing scheme for arrange...
H01L 2924/00014 :
the subject-matter covered ...
H01L 2924/01005 :
Boron [B]
H01L 2924/01006 :
Carbon [C]
H01L 2924/01013 :
Aluminum [Al]
H01L 2924/01015 :
Phosphorus [P]
H01L 2924/01019 :
Potassium [K]
H01L 2924/0102 :
Calcium [Ca]
H01L 2924/01023 :
Vanadium [V]
H01L 2924/01024 :
Chromium [Cr]
H01L 2924/01029 :
Copper [Cu]
H01L 2924/0103 :
Zinc [Zn]
H01L 2924/01031 :
Gallium [Ga]
H01L 2924/01033 :
Arsenic [As]
H01L 2924/01047 :
Silver [Ag]
H01L 2924/01049 :
Indium [In]
H01L 2924/0105 :
Tin [Sn]
H01L 2924/01051 :
Antimony [Sb]
H01L 2924/01058 :
Cerium [Ce]
H01L 2924/01063 :
Europium [Eu]
H01L 2924/01073 :
Tantalum [Ta]
H01L 2924/01074 :
Tungsten [W]
H01L 2924/01075 :
Rhenium [Re]
H01L 2924/01078 :
Platinum [Pt]
H01L 2924/01079 :
Gold [Au]
H01L 2924/01082 :
Lead [Pb]
H01L 2924/0132 :
Binary Alloys
H01L 2924/014 :
Solder alloys
H01L 2924/07802 :
not being an ohmic electric...
H01L 2924/07811 :
Extrinsic, i.e. with electr...
H01L 2924/10253 :
Silicon [Si]
H01L 2924/10321 :
Aluminium antimonide [AlSb]
H01L 2924/10322 :
Aluminium arsenide [AlAs]
H01L 2924/10323 :
Aluminium nitride [AlN]
H01L 2924/10324 :
Aluminium phosphide [AlP]
H01L 2924/10328 :
Gallium antimonide [GaSb]
H01L 2924/10329 :
Gallium arsenide [GaAs]
H01L 2924/1033 :
Gallium nitride [GaN]
H01L 2924/10331 :
Gallium phosphide [GaP]
H01L 2924/10332 :
Indium antimonide [InSb]
H01L 2924/10333 :
Indium arsenide [InAs]
H01L 2924/10334 :
Indium nitride [InN]
H01L 2924/10335 :
Indium phosphide [InP]
H01L 2924/12041 :
LED
H01L 2924/12042 :
LASER
H01L 2924/14 :
Integrated circuits
H01L 2924/15787 :
Ceramics, e.g. crystalline ...
H01L 2924/3512 :
Cracking
H01L 2924/381 :
Pitch distance
H01L 31/0468 :
comprising specific means f...
H01L 33/0025 :
comprising only AIIIBV comp...
H01L 33/06 :
within the light emitting r...
H01L 33/08 :
with a plurality of light e...
H01L 33/28 :
containing only elements of...
H01L 33/30 :
containing only elements of...
H01L 33/32 :
containing nitrogen
H01L 33/36 :
characterised by the electr...
H01L 33/483 :
Containers
H01L 33/486 :
adapted for surface mounting
H01L 33/502 :
Wavelength conversion mater...
H01L 33/505 :
characterised by the shape,...
H01L 33/58 :
Optical field-shaping elements
H01L 33/60 :
Reflective elements
H01L 33/62 :
Arrangements for conducting...
H02S 30/00 :
Structural details of PV mo...
H05B 45/12 :
using optical feedback
H05B 45/22 :
using optical feedback
H05B 47/11 :
by determining the brightne...
H05B 47/115 :
by determining the presence...
H05B 47/175 :
by remote control
H05K 1/189 :
characterised by the use of...
H05K 2201/09036 :
Recesses or grooves in insu...
H05K 2201/10106 :
Light emitting diode [LED]
H05K 2203/302 :
Bending a rigid substrate; ...
H05K 3/323 :
by applying an anisotropic ...
H10K 77/111 :
Flexible substrates
Y02B 20/40 :
Control techniques providin...
Y02E 10/549 :
Organic PV cells
Y02P 70/50 :
Manufacturing or production...