ORGANIC LIGHT EMITTING DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME

• US 20150243711A1
• Filed: 11/06/2014
• Published: 08/27/2015
• Est. Priority Date: 02/21/2014
• Status: Active Grant

• Current Assignee: Samsung Display Company Limited (Samsung Electronics Co. Ltd.)
• Original Assignee: Samsung Display Company Limited (Samsung Electronics Co. Ltd.)
• Inventors: JANG, Yong-Kyu, HWANG, Hyun-Min, HONG, Sang-Min, KIM, Hyun-Young
• Granted Patent: US 9,685,488 B2
• Time in Patent Office: Days
• US Class Current: 1/1
• CPC Class Codes: H10K 50/8426 Peripheral sealing arrangements, e.g. adhesives, sealants
• CPC Class Codes: H10K 59/1201 Manufacture or treatment
• CPC Class Codes: H10K 59/1275 Electrical connections of the two substrates
• CPC Class Codes: H10K 59/40 OLEDs integrated with touch screens
• CPC Class Codes: H10K 71/00 Manufacture or treatment specially adapted for the organic devices covered by this subclass
• CPC Class Codes: H10K 71/50 Forming devices by joining two substrates together, e.g. lamination techniques

Abstract

An organic light emitting display (OLED) device that includes a first substrate and a second substrate. An organic light emitting element and a sealing member are formed between the first substrate and the second substrate. A touch panel, a block pattern, and a protective layer are formed on the second substrate. The block pattern is arranged above the sealing member to prevent a center of the sealing member from being excessively illuminated by a laser beam during a curing process.

Claims

1. An organic light emitting display (OLED) device, comprising:

a first substrate including an emission region, a circuit region that surrounds the emission region, and a peripheral region that surrounds the circuit region;

a second substrate facing the first substrate;

an organic light emitting element arranged within the emission region of the first substrate;

a sealing member arranged within the peripheral region of the first substrate and configured to bond together the first substrate and the second substrate upon being cured by a laser beam;

a sensing cell arranged on the second substrate at a location that corresponds to the organic light emitting element;

a conductive pattern arranged on the second substrate at a location that corresponds to the circuit region;

a block pattern arranged on the second substrate at locations that correspond to the sealing member, the block pattern and the sealing member being arranged on all four sides of the emission region, the block pattern being configured to prevent central axes of the sealing member from receiving more laser radiation than other portions of the sealing member during a curing process by blocking a portion of incident laser radiation directed towards the central axes of the sealing member; and

a protective layer covering the sensing cell, the conductive pattern, and the block pattern on the second substrate.

2. The OLED device of claim 1, wherein a width of the block pattern is smaller than a width of the sealing member.

3. The OLED device of claim 1, wherein the block pattern includes a plurality of metal patterns, and the metal patterns being spaced-apart from each other by a predetermined distance.

4. The OLED device of claim 3, wherein the metal patterns has a shape selected from a polygonal and circular.

5. The OLED device of claim 3, wherein the block pattern and the conductive pattern are concurrently formed.

6. The OLED device of claim 3, wherein the block pattern further includes an inorganic layer that covers the metal patterns, and a transmittance of the inorganic layer is less than 90%.

7. The OLED device of claim 1, wherein the block pattern includes a plurality of inorganic patterns, and the inorganic patterns are spaced-apart from each other by a predetermined distance.

8. The OLED device of claim 7, wherein the inorganic patterns have a shape selected from polygonal and circular.

9. The OLED device of claim 7, wherein the inorganic patterns are formed by patterning an inorganic layer of which transmittance is less than 90%.

10. The OLED device of claim 1, wherein the protective layer includes an inorganic layer through which light is transmitted.

11. A method of manufacturing an organic light emitting display (OLED) device, comprising:

preparing a first substrate that includes an emission region, a circuit region that surrounds the emission region, and a peripheral region that surrounds the circuit region;

forming an organic light emitting element within the emission region of the first substrate;

forming a sealing member within the peripheral region of the first substrate on all four sides of the emission region;

preparing a second substrate;

forming a sensing cell on the second substrate at a location that corresponds to the organic light emitting element;

forming a conductive pattern on the second substrate at a location that corresponds to the circuit region;

forming a block pattern on the second substrate at a location that corresponds to the sealing member on all four sides of the emission region;

forming a protective layer on the second substrate to cover the sensing cell, the conductive patter, and the block pattern;

arranging the second substrate to face the first substrate; and

bonding together the first substrate and the second substrate by illuminating a laser beam onto the sealing member, the block pattern to provide for a more uniform heat distribution across a width of the sealing member during the bonding by being interposed between a laser source of the laser beam and the sealing member and by blocking a portion of the laser beam that corresponds to the central axes of the sealing member.

12. The method of claim 11, wherein a width of the block pattern is smaller than a width of the sealing member.

13. The method of claim 11, wherein the block pattern includes a plurality of metal patterns, and the metal patterns are spaced-apart from each other by a predetermined distance.

14. The method of claim 13, wherein the metal patterns have a shape selected from polygonal and circular.

15. The method of claim 13, wherein the block pattern and the conductive pattern are comprised of a same material.

16. The method of claim 13, wherein the forming of the block pattern includes forming an inorganic layer having a transmittance of the laser beam of less than 90% onto the metal patterns to cover the metal patterns.

17. The method of claim 11, wherein the block pattern includes a plurality of inorganic patterns, and the inorganic patterns are spaced-apart from each other by a predetermined distance.

18. The method of claim 17, wherein the inorganic patterns have a shape selected from polygonal and circular.

19. The method of claim 17, wherein the inorganic patterns are formed by patterning an inorganic layer of which a transmittance of the laser beam is below 90%.

20. The method of claim 11, wherein the protective layer includes an inorganic layer through which light is transmitted.