SUPPORT STRUCTURE AND METHOD OF FORMING A SUPPORT STRUCTURE

• US 20150251285A1
• Filed: 03/06/2014
• Published: 09/10/2015
• Est. Priority Date: 03/06/2014
• Status: Active Grant

• Current Assignee: Infineon Technologies AG
• Original Assignee: Infineon Technologies AG
• Inventors: Dehe, Alfons, Gabl, Reinhard, Krumbein, Ulrich
• Granted Patent: US 10,322,481 B2
• Time in Patent Office: Days
• US Class Current: 1/1
• CPC Class Codes: B23Q 3/18 for positioning only
• CPC Class Codes: B81B 2201/0257 Microphones or microspeakers
• CPC Class Codes: B81B 2201/0264 Pressure sensors
• CPC Class Codes: B81B 2203/0127 Diaphragms, i.e. structures separating two media that can control the passage from one medium to another; Membranes, i.e. diaphragms with filtering function
• CPC Class Codes: B81B 3/0072 For controlling internal stress or strain in moving or flexible elements, e.g. stress compensating layers
• CPC Class Codes: B81C 1/00158 Diaphragms, membranes manufacture process for semi-permeable inorganic membranes B01D67/0039
• CPC Class Codes: H01L 2924/1461 MEMS
• CPC Class Codes: H04R 17/00 Piezoelectric transducers; Electrostrictive transducers piezoelectric or electrostrictive elements in general H10N30/00; details of piezoelectric or electrostrictive motors, generators or positioners H10N30/00
• CPC Class Codes: H04R 19/005 using semiconductor materials
• CPC Class Codes: H04R 2201/003 Mems transducers or their use of the electrostatic type H04R19/005
• CPC Class Codes: H04R 2307/207 Shape aspects of the outer suspension of loudspeaker diaphragms
• CPC Class Codes: H04R 2499/11 Transducers incorporated or for use in hand-held devices, e.g. mobile phones, PDA's, camera's
• CPC Class Codes: H04R 31/003 for diaphragms or their outer suspension
• CPC Class Codes: H04R 7/18 at the periphery

Abstract

A structure for fixing a membrane to a carrier including a carrier; a suspended structure; and a holding structure with a rounded concave shape which is configured to fix the suspended structure to the carrier and where a tapered side of the holding structure physically connects to the suspended structure is disclosed. A method of forming the holding structure on a carrier to support a suspended structure is further disclosed. The method may include: forming a holding structure on a carrier; forming a suspended structure on the holding structure; shaping the holding structure such that it has a concave shape; and arranging the holding structure such that a tapered side of the holding structure physically connects to the suspended structure.

Claims

1. A structure, comprising:

a carrier;

a suspended structure;

a holding structure configured to fix the suspended structure to the carrier;

wherein the holding structure has a concave shape;

wherein a tapered side of the holding structure physically connects to the suspended structure.

2. The structure of claim 1,

wherein a surface of the holding structure is fixed to a surface of the carrier.

3. The structure of claim 1,

wherein a surface of the suspended structure is fixed to a surface of the holding structure.

4. The structure of claim 1,

wherein the carrier comprises a semiconductor substrate.

5. The structure of claim 1,

wherein the carrier comprises a silicon-on-insulator substrate.

6. The structure of claim 1,

wherein the carrier comprises a glass substrate.

7. The structure of claim 1,

wherein the holding structure is compositionally graded.

8. The structure of claim 1,

wherein the holding structure comprises a material with changing compositions.

9. The structure of claim 1,

wherein the holding structure comprises a first material and a second material different from the first material;

wherein the concentration of the second material in the first material is continuously varied as a function of location within the first material relative to the carrier.

10. The structure of claim 1,

wherein the suspended structure comprises a membrane material.

11. The structure of claim 10,

wherein the membrane material comprises a semiconductor membrane material.

12. A structure, comprising:

a carrier;

a suspended structure;

a holding structure configured to fix the suspended structure to the carrier;

wherein the holding structure is compositionally graded.

13. The structure of claim 12,

wherein a surface of the holding structure is fixed to a surface of the carrier;

and

wherein a surface of the suspended structure is fixed to a surface of the holding structure.

14. The structure of claim 12,

wherein the carrier comprises a semiconductor substrate.

15. The structure of claim 12,

wherein the suspended structure comprises a membrane material.

16. The structure of claim 12,

wherein the membrane material comprises a semiconductor membrane material.

17. A method of forming a structure, the method comprising:

forming a suspended structure over a carrier;

forming a holding structure to fix the suspended structure to the carrier;

wherein the holding structure has a concave shape;

wherein a tapered side of the holding structure physically connects to the suspended structure.

18. The method of claim 17, further comprising:

shaping the holding structure such that it has a concave shape.

19. The method of claim 17, further comprising:

arranging the holding structure such that the tapered side of the holding structure physically connects to the suspended structure.

20. The method of claim 18,

wherein the holding structure is shaped after the suspended structure is formed on the holding structure.

21. The method of claim 19,

wherein the holding structure is shaped by means of an etching process such that the etching process does not etch the suspended structure.

22. The method of claim 19,

wherein the shape of the holding structure is determined by a first material and a second material different from the first material.

23. A method for manufacturing a structure, the method comprising:

forming a holding structure over a carrier by varying the material composition of the holding structure, such that an etch rate of the holding structure varies when etching the holding structure;

forming a suspended structure over the holding structure, wherein the holding structure fixes the suspended structure to the carrier; and

removing a portion of the holding structure by etching the holding structure.