Self-Supporting Thermal Tube Structure for Electronic Assemblies

• US 20150261265A1
• Filed: 04/03/2014
• Published: 09/17/2015
• Est. Priority Date: 03/14/2014
• Status: Active Grant

• Current Assignee: SanDisk Technologies LLC (Western Digital Corporation)
• Original Assignee: SanDisk Enterprise IP LLC (Western Digital Corporation)
• Inventors: Dean, David, Ellis, Robert W.
• Granted Patent: US 9,519,319 B2
• Time in Patent Office: Days
• US Class Current: 1/1
• CPC Class Codes: G01R 1/0408 Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets G01R1/067 takes precedence; mass production testing systems G01R31/59; testing of connections G01R31/66; for testing printed circuit boards G01R31/2808
• CPC Class Codes: G01R 31/2601 Apparatus or methods therefor G01R31/2607, G01R31/2642 take precedence
• CPC Class Codes: G01R 31/2834 Automated test systems [ATE]; using microprocessors or computers G01R31/317 takes precedence; ATE for detection of defective computer hardware G06F11/2736
• CPC Class Codes: G01R 31/2887 involving moving the probe head or the IC under test; docking stations moving single probes G01R1/06705; moving individual probes in multiple probes G01R1/07392
• CPC Class Codes: G01R 31/2891 related to sensing or controlling of force, position, temperature G01R31/2874 takes precedence; sensing of force G01L; sensing of position G01B, G01D; sensing of temperature G01K; controlling in general G05
• CPC Class Codes: G06F 1/20 Cooling means
• CPC Class Codes: H01L 23/467 by flowing gases, e.g. air H01L23/473 takes precedence
• CPC Class Codes: H01L 23/49833 the chip support structure consisting of a plurality of insulating substrates
• CPC Class Codes: H01L 23/4985 Flexible insulating substrates H01L23/49572 and H01L23/49855 take precedence
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H05K 1/0201 Thermal arrangements, e.g. for cooling, heating or preventing overheating
• CPC Class Codes: H05K 1/147 at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit H05K1/148 takes precedence
• CPC Class Codes: H05K 2201/042 Stacked spaced PCBs; Planar parts of folded flexible circuits having mounted components in between or spaced from each other
• CPC Class Codes: H05K 7/20727 within server blades for removing heat from heat source

Abstract

Various embodiments described herein include systems, methods and/or devices for dissipating heat generated by electronic components in an electronic system (e.g., a memory system that includes closely spaced memory modules). In one aspect, an electronic assembly includes a first circuit board, a second circuit board flexibly coupled to the first circuit board, a connecting module coupled to the second circuit board, and a fastener. The fastener is configured to couple the first circuit board to the connecting module such that the first circuit board and the second circuit board are substantially parallel and are separated by a space, wherein the space forms at least part of a channel that is configured to direct airflow through the space between the first circuit board, second circuit board, and connecting module.

Claims

1. An electronic assembly for dissipating heat, comprising:

a first circuit board;

a second circuit board flexibly coupled to the first circuit board;

a connecting module coupled to the second circuit board; and

a fastener;

wherein the fastener is configured to couple the first circuit board to the connecting module such that the first circuit board and the second circuit board are substantially parallel and are separated by a space, wherein the space forms at least part of a channel that is configured to direct airflow through the space between the first circuit board, second circuit board, and connecting module.

2. The electronic assembly of claim 1, wherein the first circuit board is flexibly coupled to the second circuit board with a flexible interconnect.

3. The electronic assembly of claim 2, wherein the flexible interconnect electrically couples the first circuit board to the second circuit board.

4. The electronic assembly of claim 3, wherein a first side of the channel comprises the connecting module, and a second side of the channel comprises the flexible interconnect.

5. The electronic assembly of claim 1, wherein the first circuit board is flexibly coupled to the second circuit board with one or more flexible interconnects and one or more additional circuit boards.

6. The electronic assembly of claim 1, wherein the second circuit board is flexibly coupled to the connecting module.

7. The electronic assembly of claim 6, wherein the second circuit board is flexibly coupled to the connecting module with a flexible interconnect.

8. The electronic assembly of claim 1, wherein at least one of the first circuit board and the second circuit board includes one or more three-dimensional (3D) memory devices.

9. The electronic assembly of claim 7, wherein the flexible interconnect electrically couples the second circuit board to the connecting module.

10. The electronic assembly of claim 1, wherein the fastener is affixed to the first circuit board.

11. The electronic assembly of claim 1, wherein the fastener is affixed to the connecting module.

12. The electronic assembly of claim 1, wherein the fastener comprises a first sub-fastener affixed to the first circuit board and a second sub-fastener affixed to the connecting module.

13. The electronic assembly of claim 12, wherein the first and the second sub-fasteners each comprise one or more solder pads.

14. The electronic assembly of claim 1, wherein the first circuit board includes a hole in a substrate of the first circuit board, and the connecting module includes a protrusion configured to mate with the hole in the first circuit board.

15. The electronic assembly of claim 1, wherein the connecting module includes a hole in a substrate of the connecting module, and the first circuit board includes a protrusion configured to mate with the hole in the connecting module.

16. The electronic assembly of claim 1, wherein the first circuit board includes a notch in a substrate of the first circuit board, and the connecting module includes a protrusion configured to mate with the notch in the first circuit board.

17. The electronic assembly of claim 1, wherein the connecting module includes a notch in a substrate of the connecting module, and the first circuit board includes a protrusion configured to mate with the notch in the connecting module.

18. The electronic assembly of claim 1, wherein the fastener is configured to mechanically and electrically couple the first circuit board to the second circuit board.

19. The electronic assembly of claim 1, wherein the second circuit board includes one or more second fasteners configured to couple the second circuit board to a base board.

20. The electronic assembly of claim 1, wherein at least one of the first circuit board, second circuit board, and connecting module comprises one or more solid state drives (SSDs) or energy hold capacitor circuitry.

21. A method of manufacturing an electronic assembly for dissipating heat, comprising:

providing an electronic assembly, comprising;

a first circuit board;

a second circuit board flexibly coupled to the first circuit board;

a connecting module coupled to the second circuit board; and

a fastener; and

coupling the first circuit board to the connecting module with the fastener, such that the first circuit board and the second circuit board are substantially parallel and are separated by a space, wherein the space forms at least part of a channel that is configured to direct airflow through the space between the first circuit board, second circuit board, and connecting module.

22. The method of claim 21, further comprising, prior to coupling the first circuit board to the connecting module:

while the first circuit board and the second circuit board are not substantially parallel, coupling the second circuit board to a base circuit board; and

manipulating the electronic assembly so as to cause the first circuit board to be positioned substantially parallel to the second circuit board, wherein manipulating the electronic assembly so as to cause the first circuit board to be positioned substantially parallel to the second circuit board causes at least a portion of a first flexible interconnect coupling the first circuit board and the second circuit board to be deformed.

23. The method of claim 22, wherein the connecting module is flexibly coupled to the second circuit board, the method further comprising, prior to manipulating the first circuit board:

manipulating the electronic assembly so as to cause the connecting module to be positioned substantially perpendicular to the second circuit board, wherein manipulating the electronic assembly causes at least a portion of a second flexible interconnect coupling the connecting module to the second circuit board to be deformed.

24. The method of claim 21, wherein at least one of the first circuit board and the second circuit board comprises one or more three-dimensional (3D) memory devices, one or more solid state drives (SSDs), or energy hold capacitor circuitry.