Apparatus and Method for Decapsulating Packaged Integrated Circuits

  • US 20150262850A1
  • Filed: 06/01/2015
  • Published: 09/17/2015
  • Est. Priority Date: 12/19/2011
  • Status: Active Grant
First Claim
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1. A system for decapsulating a portion of an encapsulated integrated circuit that includes copper elements, comprising:

  • one or more containers holding specific etchant solutions;

    a pump having an inlet port connected to the one or more containers holding specific etchant solutions, and an outlet port;

    a temperature-controlled metal block having a fluid inlet connected to the pump outlet port, and an outlet port from the block;

    control circuitry enabling control of temperature of the metal block and operation of the pump; and

    flow and temperature sensors coupled to the control circuitry;

    wherein etchant temperature at the outlet of the metal block is controlled to be at or below ambient temperature by controlling the pump and temperature of the metal block, and etchant mixture is delivered via a delivery conduit to an encapsulation surface of an encapsulated integrated circuit, decapsulating a portion of encapsulated circuit, minimizing damage to the copper elements.

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