METHOD OF MANUFACTURING PRESSURE SENSOR, DEPOSITION SYSTEM, AND ANNEALING SYSTEM

• US 20150268116A1
• Filed: 03/18/2015
• Published: 09/24/2015
• Est. Priority Date: 03/19/2014
• Status: Active Grant

• Current Assignee: Kabushiki Kaisha Toshiba (Toshiba Corporation)
• Original Assignee: Kabushiki Kaisha Toshiba (Toshiba Corporation)
• Inventors: FUJI, Yoshihiko, Fukuzawa, Hideaki, Kaji, Shiori
• Granted Patent: US 9,853,209 B2
• Time in Patent Office: Days
• US Class Current: 1/1
• CPC Class Codes: C23C 14/50 Substrate holders
• CPC Class Codes: C23C 16/458 characterised by the method used for supporting substrates in the reaction chamber
• CPC Class Codes: G01L 1/125 by using magnetostrictive means magnetostrictive sensors H10N35/101
• CPC Class Codes: G01L 9/0042 Constructional details associated with semiconductive diaphragm sensors, e.g. etching, or constructional details of non-semiconductive diaphragms details about the integration or bonding of piezoresistor in or on the diaphragm G01L9/0052 and G01L9/0057 respectively
• CPC Class Codes: G01L 9/16 by making use of variations in the magnetic properties of material resulting from the application of stress
• CPC Class Codes: G03F 7/707 Chucks, e.g. chucking or un-chucking operations or structural details
• CPC Class Codes: H01L 21/67288 Monitoring of warpage, curvature, damage, defects or the like
• CPC Class Codes: H01L 21/6838 with gripping and holding devices using a vacuum; Bernoulli devices
• CPC Class Codes: H01L 21/68728 characterised by a plurality of separate clamping members, e.g. clamping fingers
• CPC Class Codes: H01L 21/68742 characterised by a lifting arrangement, e.g. lift pins
• CPC Class Codes: H01L 21/6875 characterised by a plurality of individual support members, e.g. support posts or protrusions
• CPC Class Codes: H10N 50/01 Manufacture or treatment

Abstract

A method of manufacturing a pressure sensor comprises: above a film portion formed on one surface of a substrate, depositing a first magnetic layer, a second magnetic layer and an intermediate layer between the first and second magnetic layers on one surface of a substrate; removing the deposited layers leaving a part thereof; and removing a part of the substrate from another surface of the substrate. By removing the deposited layers leaving a part thereof, a strain detecting element is formed in a part of a first region, the strain detecting element comprising the first magnetic layer, the second magnetic layer and the intermediate layer. By removing a part of the substrate, a part of the first region of the substrate is removed. In addition, the deposition of the first magnetic layer is performed with the substrate being bended.

Claims

1. A method of manufacturing a pressure sensor comprising:

above a film portion formed on one surface of a substrate, depositing a first magnetic layer, a second magnetic layer and an intermediate layer between the first and second magnetic layers;

removing the first magnetic layer, the second magnetic layer and the intermediate layer leaving a part thereof; and

removing apart of the substrate from another surface of the substrate,

by removing the first magnetic layer, the second magnetic layer and the intermediate layer leaving the part thereof, a strain detecting element being formed in a part of a first region, the strain detecting element comprising the first magnetic layer, the second magnetic layer and the intermediate layer,

by removing a part of the substrate from the another surface of the substrate, a part of the first region of the substrate being removed from the another surface, and

the deposition of the first magnetic layer being performed with the substrate bended.

2. The method of manufacturing a pressure sensor according to claim 1, wherein

the substrate is bended so that a relative angle of a straight line joining the centroid of the strain detecting element and the outer edge of the first region by the shortest path and the magnetization direction of the first magnetic layer becomes larger than 0°

and smaller than 90°

.

3. The method of manufacturing a pressure sensor according to claim 1, further comprising:

bending the substrate;

depositing the first magnetic layer on the one surface of the substrate on which the film portion is formed; and

releasing the bend of the substrate.

4. A method of manufacturing a pressure sensor comprising:

above a film portion formed on one surface of a substrate, depositing a first magnetic layer, a second magnetic layer and an intermediate layer between the first and second magnetic layers;

annealing the first magnetic layer;

removing the first magnetic layer, the second magnetic layer and the intermediate layer leaving a part thereof; and

removing apart of the substrate from another surface of the substrate,

by removing the first magnetic layer, the second magnetic layer and the intermediate layer leaving a part thereof, a strain detecting element being formed in a part of a first region, the strain detecting element comprising the first magnetic layer, the second magnetic layer and the intermediate layer,

by removing a part of the substrate from the another surface of the substrate, a part of the first region of the substrate being removed from the another surface, and

the annealing of the first magnetic layer being performed with the substrate bended.

5. The method of manufacturing a pressure sensor according to claim 4, wherein

the substrate is bended so that a relative angle of a straight line joining the centroid of the strain detecting element and the outer edge of the first region by the shortest path and the magnetization direction of the first magnetic layer becomes larger than 0°

and smaller than 90°

.

6. The method of manufacturing a pressure sensor according to claim 4, further comprising:

bending the substrate;

annealing the first magnetic layer; and

releasing the bend of the substrate.

7. A method of manufacturing a pressure sensor, comprising:

forming a film portion on one surface of a substrate;

above the film portion, depositing a first magnetic layer, a second magnetic layer, and an intermediate layer between the first and second magnetic layers;

removing the first magnetic layer, the second magnetic layer and the intermediate layer leaving a part thereof; and

removing apart of the substrate from another surface of the substrate,

by removing the first magnetic layer, the second magnetic layer and the intermediate layer leaving a part thereof, a strain detecting element being formed in a part of a first region, the strain detecting element comprising the first magnetic layer, the second magnetic layer and the intermediate layer,

by removing a part of the substrate from the another surface of the substrate, a part of the first region of the substrate being removed from another surface, and

the forming of the film portion being performed with the substrate bended.

8. The method of manufacturing a pressure sensor according to claim 7, wherein

the substrate is bended around a predetermined point.

9. The method of manufacturing a pressure sensor according to claim 7, further comprising:

bending the substrate;

depositing the film portion on one surface of the substrate; and

releasing the bend of the substrate.

10. A method of manufacturing a pressure sensor, comprising:

annealing a film portion formed on one surface of a substrate;

above the film portion, depositing a first magnetic layer, a second magnetic layer and an intermediate layer between the first and second magnetic layers;

removing the first magnetic layer, the second magnetic layer and the intermediate layer leaving a part thereof; and

removing a part of the substrate from another surface of the substrate,

by removing the first magnetic layer, the second magnetic layer and the intermediate layer leaving a part thereof, a strain detecting element being formed in a part of a first region, the strain detecting element comprising the first magnetic layer, the second magnetic layer and the intermediate layer,

by removing a part of the substrate from another surface of the substrate, a part of the first region of the substrate being removed from the another surface, and

the annealing of the film portion being performed with the substrate bended.

11. The method of manufacturing a pressure sensor according to claim 10, wherein

the substrate is bended around a predetermined point.

12. The method of manufacturing a pressure sensor according to claim 10, further comprising:

bending the substrate;

annealing the film portion; and

releasing the bend of the substrate.

13. A deposition system comprising:

a substrate holder holding a substrate; and

a deposition portion performing deposition on the substrate held by the substrate holder,

the substrate holder comprising a mechanism to bend the substrate.

14. The deposition system according to claim 13, wherein

the substrate holder comprises:

a support mechanism supporting the substrate on a support surface; and

a holding mechanism holding the substrate on the support surface,

the support mechanism comprises a plurality of movable support members independently operatable in a direction generally perpendicular to the support surface,

the movable support members form unevenness on the support surface, and

the holding mechanism bends the substrate according to the unevenness of the support surface.

15. An annealing system comprising:

a substrate holder holding a substrate; and

an annealing portion annealing the substrate supported on the substrate holder,

the substrate holder comprising a mechanism to bend the substrate.

16. The annealing system according to claim 15, wherein

the substrate holder comprises:

a support mechanism supporting the substrate on a support surface; and

a holding mechanism holding the substrate on the support surface,

the support mechanism comprises a plurality of movable support members independently operatable in a direction generally perpendicular to the support surface,

the movable support members form unevenness on the support surface, and

the holding mechanism bends the substrate according to the unevenness of the support surface.