RFID TRANSPONDER CHIP MODULES

• US 20150269471A1
• Filed: 02/11/2015
• Published: 09/24/2015
• Est. Priority Date: 08/08/2011
• Status: Active Grant

• Current Assignee: AmaTech Group Limited (Paragon Group Limited)
• Original Assignee: Féinics AmaTech Teoranta (Paragon Group Limited)
• Inventors: Finn, David, Lotya, Mustafa, Molloy, Darren
• Granted Patent: US 9,622,359 B2
• Time in Patent Office: Days
• US Class Current: 1/1
• CPC Class Codes: B23K 2101/40 Semiconductor devices
• CPC Class Codes: B23K 2103/50 Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
• CPC Class Codes: B23K 26/0006 taking account of the properties of the material involved B23K26/32, B23K26/40 take precedence
• CPC Class Codes: B23K 26/0622 by shaping pulses
• CPC Class Codes: B23K 26/352 for surface treatment
• CPC Class Codes: G06K 19/07722 the record carrier being multilayered, e.g. laminated sheets flat articles in general, see B32B37/00
• CPC Class Codes: G06K 19/07747 at least one of the integrated circuit chips being mounted as a module
• CPC Class Codes: G06K 19/07754 the connection being galvanic
• CPC Class Codes: G06K 19/07794 the record carrier comprising a booster or auxiliary antenna in addition to the antenna connected directly to the integrated circuit
• CPC Class Codes: H01L 2224/45144 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01Q 1/2225 used in active tags, i.e. provided with its own power source or in passive tags, i.e. deriving power from RF signal
• CPC Class Codes: H01Q 1/38 formed by a conductive layer on an insulating support patch antennas H01Q9/0407; microstrip dipole antennas H01Q9/065; microstrip slot antennas H01Q13/106; transmission line microstrip antennas H01Q13/206; manufacturing reflecting surfaces using insulating material for supporting the reflecting surface H01Q15/142
• CPC Class Codes: H01Q 7/00 Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop
• CPC Class Codes: H05K 3/46 Manufacturing multilayer circuits
• CPC Class Codes: Y10T 29/49018 with other electrical component
• CPC Class Codes: Y10T 29/49124 On flat or curved insulated base, e.g., printed circuit, etc.

Abstract

The planar antenna (PA) of a transponder chip module (TCM) may have a U-shaped portion so that an outer end (OE) of the antenna may be positioned close to an RFID chip (IC) disposed at a central area of a module tape (MT) for the transponder chip module. A module tape (MT2) may have contact pads (CP) on one side thereof and a connection bridge (CBR) on another side thereof, and may be joined with a module tape (MT1) having a planar antenna (PA). Metal of a conductive layer (CL) within a conductive element such as a coupling frame (CF) or a planar antenna (PA) may be scribed to have many small segments. A metal sheet may be stamped to have contact side metallization, and joined with a module tape (MT) having a planar antenna (PA).

Claims

1. A method of making a transponder chip module (TCM), comprising:

stamping a metal sheet (LF) to have a plurality of isolated conductive features (ICF, C1-C8, CBR), at least some of which are contact pads (CP); and

assembling a module tape (MT) having a planar antenna (PA) to the metal sheet.

2. The method of claim 1, further comprising:

providing a central opening (CO) in the module tape for mounting an RFID chip to a central area of the metal sheet.

3. The method of claim 1, further comprising:

providing through holes (TH) through the module tape for making connections to undersides of some of the isolated conductive features.

4. The method of claim 1, wherein:

the planar antenna is formed by laser etching a conductive foil on the module tape.

5. A method of making contact side metallization for a transponder chip module, comprising:

stamping a metal sheet to have a pattern of ISO 7816 contact pads in an inner area thereof and additional isolated conductive features in an outer area thereof.

6. Contact side metallization (CSM) for a transponder chip module (TCM, 1500), comprising:

contact pads (CP, C1-C8) arranged in an inner area of the contact side metallization; and

conductive features disposed in an outer area of the contact side metallization;

characterized in that;

the conductive features in the outer area are electrically isolated from the contact pads in the inner area; and

the conductive features in the outer area comprise at least 50% of the outer area.

7. Contact side metallization, according to claim 6, wherein:

the outer area surrounds and is has approximately the same surface area as the inner area.

8. A transponder chip module (TCM) comprising the contact side metallization of claim 6.

9. A method of making at least one connection through a substrate, comprising:

providing at least one through-hole extending through the substrate; and

deforming a portion of a first conductive layer (CL1) which spans the through-hole on one side of the substrate so that it extends through the through-hole and at least to the opposite side of the substrate whereat it may contact and be joined with a second conductive layer (CL2) on the opposite side of the substrate.

10. The method of claim 9, wherein:

the first conductive layer (CL1) is deformed with the second conductive layer disposed on the substrate.

11. The method of claim 9, wherein:

the second conductive layer is disposed on the substrate after the first conductive layer is deformed.

12. The method of claim 9, further comprising:

prior to deforming the portion of the first conductive layer, cutting or slitting it at the location of the through-hole, then bending it to come into contact with the conductive layer on the top, face-up side of the substrate.