ACHIEVING POWER SUPPLY AND HEAT DISSIPATION (COOLING) IN THREE-DIMENSIONAL MULTILAYER PACKAGE
First Claim
1. A computer-implemented method for simulating an apparatus that optimizes power supply and heat dissipation for a multilayer chip from an upper surface side of said multilayer chip, comprising the steps of:
- setting a heat conductive thermal via density initial value for said multilayer chip;
preparing a substrate that uses silicon (Si) where a wiring layer, with a thickness, is formed on the bottom surface side facing said upper surface side of said multilayer chip;
setting the initial value of the power supply for said multilayer chip from said wiring layer of said substrate that uses Si;
increasing or decreasing said initial value of the power supply until optimized within a predetermined range; and
increasing or decreasing said heat conductive thermal via density initial value until optimized within a predetermined range.
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Accused Products
Abstract
A computer-implemented structure for optimizing a route for power supply and heat dissipation in a multilayer chip. The method includes: setting a heat conductive thermal value for the multilayer chip by way of density, preparing a substrate that contains silicon where a wiring layer is formed facing the upper surface side of the multilayer chip, setting the power from the wiring layer of the substrate that uses silicon, manipulating the value of the power supply, and manipulating the heat conductive thermal value based on density. Both apparatus'"'"'s include an organic substrate, a multilayer chip, a substrate containing silicon, a wiring layer, and a heat dissipater, wherein the components are configured to perform the steps of the above method. The method of configuring an apparatus ensures that all the multilayer chips are stored in the concave part of the organic substrate.
1 Citation
3 Claims
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1. A computer-implemented method for simulating an apparatus that optimizes power supply and heat dissipation for a multilayer chip from an upper surface side of said multilayer chip, comprising the steps of:
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setting a heat conductive thermal via density initial value for said multilayer chip; preparing a substrate that uses silicon (Si) where a wiring layer, with a thickness, is formed on the bottom surface side facing said upper surface side of said multilayer chip; setting the initial value of the power supply for said multilayer chip from said wiring layer of said substrate that uses Si; increasing or decreasing said initial value of the power supply until optimized within a predetermined range; and increasing or decreasing said heat conductive thermal via density initial value until optimized within a predetermined range. - View Dependent Claims (2, 3)
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Specification