DIMENSIONALLY TOLERANT MULTIBAND CONFORMAL ANTENNA ARRAYS

• US 20150303554A1
• Filed: 08/25/2014
• Published: 10/22/2015
• Est. Priority Date: 01/09/2012
• Status: Active Grant

• Current Assignee: Lockheed Martin Corporation (Martin Marietta Corporation)
• Original Assignee: Lockheed Martin Corporation (Martin Marietta Corporation)
• Inventors: VOS, DAVID L., Baldwin, Carl, Darling, David R., Kaplun, Brian W., Dorough, David R.
• Granted Patent: US 9,673,514 B2
• Time in Patent Office: Days
• US Class Current: 1/1
• CPC Class Codes: B32B 2457/00 Electrical equipment
• CPC Class Codes: B32B 37/12 characterised by using adhesives
• CPC Class Codes: H01Q 1/287 integrated in a wing or a stabiliser
• CPC Class Codes: H01Q 1/38 formed by a conductive layer on an insulating support patch antennas H01Q9/0407; microstrip dipole antennas H01Q9/065; microstrip slot antennas H01Q13/106; transmission line microstrip antennas H01Q13/206; manufacturing reflecting surfaces using insulating material for supporting the reflecting surface H01Q15/142
• CPC Class Codes: H01Q 21/28 Combinations of substantially independent non-interacting antenna units or systems multiple beam H01Q25/00

Abstract

Some embodiments relate to a multiband antenna array formed on a flexible substrate. Low frequency antenna elements may be formed using nanoink. High frequency elements may be provided on a prefabricated antenna chip. The antenna array may be heated in a low temperature oven to sinter the nanoink into a solid antenna element. In some embodiments, an adhesive insulation layer may be provided which allows the antenna array to be attached to any surface. In other embodiments, the antenna array may be embedded in a composite material.

Claims

1. A method for fabricating a multiband antenna array, the method comprising:

applying nanoink traces to a substrate, wherein the nanoink traces comprise at least one low-frequency antenna element and at least one interconnection;

placing at least one high-frequency antenna chip in contact with the at least one interconnection; and

heating the multiband antenna array.

2. The method of claim 1, wherein:

heating multiband antenna array is performed in an oven with a temperature of less than 300 degrees Celsius.

3. The method of claim 1, wherein the substrate is a flexible substrate.

4. The method of claim 3, further comprising:

prior to heating the multiband antenna array, applying a flexible insulation layer over the nanoink traces on the flexible substrate.

5. The method of claim 4, wherein:

at least one surface of the flexible insulation layer is adhesive.

6. The method of claim 5, further comprising:

attaching the multiband antenna array to an object using the at least one adhesive surface of the flexible insulation layer.

7. The method of claim 6, wherein the object is a vehicle.

8. The method of claim 1, wherein:

applying the nanoink traces to the substrate comprises using an ink jet nozzle.

9. The method of claim 1, wherein:

applying the nanoink traces to the substrate comprises using a micropen dispenser.

10. The method of claim 1, wherein:

the nanoink traces are formed using nanoink comprising nanoparticles formed from at least one electrically conductive material.

11. The method of claim 10, wherein:

the electrically conductive material is comprised of a metal selected from the metallic group consisting of silver, copper, gold and platinum.

12. The method of claim 1, wherein the at least one high-frequency antenna chip comprises an inflexible substrate.

13. The method of claim 1, wherein the substrate is an inflexible substrate.

14. The method of claim 10, wherein the nanoparticles comprise carbon nanotubes or buckminsterfullerene.

15. The method of claim 1, wherein applying nanoink traces is performed using an inkjet nozzle.

16. The method of claim 1, wherein the at least one high-frequency antenna chip includes at least one integrated circuit configured to process a signal received from the multiband antenna array.

17. The method of claim 1, wherein:

heating multiband antenna array is performed in an oven with a temperature of less than 200 degrees Celsius.

18. The method of claim 6, wherein attaching the multiband antenna array to the object comprises attaching the multiband antenna to a curved surface of the object.

19. The method of claim 7, wherein the vehicle is an aircraft.

20. The method of claim 1, further comprising:

enclosing the multiband antenna array between a top composite layer and a bottom composite layer.

21. The method of claim 20, wherein the top composite layer and the bottom composite layer comprise carbon fiber.

22. The method of claim 20, wherein at least one of the top composite layer and the bottom composite layer comprises a radiofrequency transparent material.