OPTO-ELECTRONIC MICRO-MODULE AND METHOD FOR FORMING THE SAME

• US 20160004019A1
• Filed: 01/29/2015
• Published: 01/07/2016
• Est. Priority Date: 07/04/2014
• Status: Active Grant

• Current Assignee: EZconn Corporation
• Original Assignee: EZconn Corporation
• Inventors: Joerg-Reinhardt, Kropp
• Granted Patent: US 9,448,373 B2
• Time in Patent Office: Days
• US Class Current: 1/1
• CPC Class Codes: G02B 6/4206 Optical features G02B6/4207, G02B6/421 take precedence
• CPC Class Codes: G02B 6/4214 the intermediate optical element having redirecting reflective means, e.g. mirrors, prisms for deflecting the radiation from horizontal to down- or upward direction toward a device G02B6/4246 takes precedence
• CPC Class Codes: G02B 6/4215 the intermediate optical elements being wavelength selective optical elements, e.g. variable wavelength optical modules or wavelength lockers G02B6/4246 takes precedence
• CPC Class Codes: G02B 6/4246 Bidirectionally operating package structures
• CPC Class Codes: G02B 6/43 Arrangements comprising a plurality of opto-electronic elements and associated optical interconnections

Abstract

An opto-electronic micro-module includes a monocrystalline substrate having a first surface and a second surface parallel to said first surface, wherein a through hole passes from said first surface through said monocrystalline substrate to said second surface; and an optical substrate having a first portion in said through hole and a second portion protruding from said through hole.

Claims

1. An opto-electronic micro-module comprising:

a monocrystalline substrate having a first surface and a second surface parallel to said first surface, wherein a through hole passes from said first surface through said monocrystalline substrate to said second surface; and

an optical substrate having a first portion in said through hole and a second portion protruding from said through hole.

2. The opto-electronic micro-module of claim 1, wherein said through hole has a sidewall inclined to said first surface of said monocrystalline substrate.

3. The opto-electronic micro-module of claim 2, wherein an acute angle between said sidewall of said through hole and said first surface of said monocrystalline substrate is substantially 45 degrees.

4. The opto-electronic micro-module of claim 2, wherein an acute angle between said sidewall of said through hole and said first surface of said monocrystalline substrate is between 30 and 60 degrees.

5. The opto-electronic micro-module of claim 1, wherein said monocrystalline substrate comprises a silicon monocrystalline substrate.

6. The opto-electronic micro-module of claim 1, wherein said optical substrate comprises an optical splitter.

7. The opto-electronic micro-module of claim 1, wherein said optical substrate comprises a silicon monocrystalline substrate.

8. The opto-electronic micro-module of claim 1, wherein said optical substrate comprises an optically reflective layer at a surface of said optical substrate projected from said through hole.

9. The opto-electronic micro-module of claim 1, wherein said optical substrate comprises an optical film at a surface of said optical substrate projected from said through hole.

10. The opto-electronic micro-module of claim 1, wherein said optical substrate has a first surface facing a sidewall of said through hole, wherein a first angle between said first surface of said optical substrate and a second surface of said optical substrate is substantially the same as a second angle between said sidewall of said through hole and said first surface of said monocrystalline substrate, wherein said second surface of said optical substrate is substantially parallel to said first surface of said monocrystalline substrate.

11. The opto-electronic micro-module of claim 1 further comprising a light emitting device over said monocrystalline substrate, wherein said light emitting device is configured to emit an optical signal to said optical substrate.

12. The opto-electronic micro-module of claim 11, wherein said light emitting device comprises a laser diode.

13. The opto-electronic micro-module of claim 11 further comprising a patterned circuit layer over said monocrystalline substrate, wherein said patterned circuit layer is connected to said light emitting device.

14. The opto-electronic micro-module of claim 1 further comprising an optical-signal receiver over said monocrystalline substrate, wherein said optical-signal receiver is configured to receive an optical signal from said optical substrate.

15. The opto-electronic micro-module of claim 1, wherein said optical substrate is configured to have an optical signal having a first wavelength to pass therethrough and have an optical signal having a second wavelength to be reflected.

16. The opto-electronic micro-module of claim 1 further comprising an optical-signal receiver configured to receive an optical signal passing through said optical substrate.

17. The opto-electronic micro-module of claim 1 further comprising a first optical-signal receiver configured to receive a first optical signal passing through said optical substrate and a second optical-signal receiver configured to receive a second optical signal reflected from said optical substrate.

18. The opto-electronic micro-module of claim 1, wherein said optical substrate has a first surface and a second surface parallel to said first surface of said optical substrate, wherein said optical substrate has a reflective layer at said first surface of said optical substrate and an anti-reflective layer at said second surface of said optical substrate.

19. The opto-electronic micro-module of claim 1 configured to couple with an optical fiber, further comprising a micro-lens optically coupled between said optical fiber and said optical substrate.

20. The opto-electronic micro-module of claim 19 further comprising a supporting block over said monocrystalline substrate, wherein said supporting block supports said micro-lens with a gap between said micro-lens and said optical substrate.