MOLDED CAMERA

• US 20160006908A1
• Filed: 07/03/2014
• Published: 01/07/2016
• Est. Priority Date: 07/03/2014
• Status: Abandoned Application

• Current Assignee: Delphi Technologies, Inc. (BorgWarner Incorporated)
• Original Assignee: Delphi Technologies, Inc. (BorgWarner Incorporated)
• Inventors: PAN, BINGHUA, LOW, YEW KWANG, YONG, SIM YING, ONG, LAY BOON, ZHANG, ZHIWU
• Application Number:
  US14/323,558
• Publication Number:
  US 20160006908A1
• Time in Patent Office: Days
• US Class Current: 1/1
• CPC Class Codes: B60R 11/04 Mounting of cameras operative during drive; Arrangement of controls thereof relative to the vehicle
• CPC Class Codes: B60R 2011/004 outside the vehicle
• CPC Class Codes: G03B 17/08 Waterproof bodies or housings
• CPC Class Codes: H04N 23/51 Housings
• CPC Class Codes: H04N 23/55 Optical parts specially adapted for electronic image sensors; Mounting thereof
• CPC Class Codes: H04N 23/57 Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
• CPC Class Codes: H04N 7/183 for receiving images from a single remote source

Abstract

A molded camera suitable for use on a vehicle to capture an image of a field-of-view about the vehicle includes a circuit board assembly, a pigtail connector, an imager device, a lens assembly, and a polymeric compound. The pigtail connector is attached to the circuit board assembly. The imager device is attached to the circuit board assembly. The lens assembly is configured to focus the image of the field-of-view about the vehicle on the imager device. The polymeric compound is configured to encapsulate the circuit board assembly, seal/protect the molded camera and define an external portion of an exterior surface of the molded camera.

Claims

1. A molded camera suitable for use on a vehicle to capture an image of a field-of-view about the vehicle, said molded camera comprising:

a circuit board assembly;

a pigtail connector attached to the circuit board assembly;

an imager device attached to the circuit board assembly;

a lens assembly configured to focus the image of the field-of-view about the vehicle on the imager device; and

a polymeric compound configured to encapsulate the circuit board assembly and define an external portion of an exterior surface of the molded camera.

2. The molded camera in accordance with claim 1, wherein the molded camera includes a holder that defines a slot configured to receive the circuit board assembly.

3. The molded camera in accordance with claim 1, wherein the molded camera includes a holder that defines a cavity configured to contain an internal portion of the polymeric compound.

4. The molded camera in accordance with claim 1, wherein the molded camera is formed when the circuit board assembly and the lens assembly are installed into a mold, and the polymeric compound is injected into the mold.

5. The molded camera in accordance with claim 4, wherein the holder defines a mold-stop configured to cooperate with the mold to prevent leakage while the polymeric compound is injected into the mold.

6. The molded camera in accordance with claim 5, wherein the molded camera is over-molded with a ridged material after the polymeric compound is injected into the mold to adapt the molded camera for different applications.

7. The molded camera in accordance with claim 1, wherein the polymeric compound is formed in a manner effective to form a connector seal around the pigtail connector.

8. The molded camera in accordance with claim 1, wherein the polymeric compound extends a manner effective to form a support for the pigtail connector.

9. The molded camera in accordance with claim 1, wherein the polymeric compound is formed in a manner effective to form a lens seal around the lens assembly.