ELECTRONIC DEVICE WITH LAMINATED STRUCTURE AND MANUFACTURING METHOD THEREOF

• US 20160009065A1
• Filed: 09/21/2015
• Published: 01/14/2016
• Est. Priority Date: 10/15/2011
• Status: Active Grant

• Current Assignee: TPK Touch Solutions (Xiamen) Inc. (TPK Holding Co., Ltd.)
• Original Assignee: Optera Technology Company Limited (TPK Holding Co., Ltd.)
• Inventors: Lin, Yuezhan, Zhang, Xu, Huang, Wei
• Granted Patent: US 10,926,522 B2
• Time in Patent Office: Days
• US Class Current: 1/1
• CPC Class Codes: B32B 17/10761 containing vinyl acetal
• CPC Class Codes: B32B 17/10807 Making laminated safety glass or glazing; Apparatus therefor
• CPC Class Codes: B32B 2037/1253 curable adhesive
• CPC Class Codes: B32B 2307/20 having particular electrical or magnetic properties, e.g. piezoelectric
• CPC Class Codes: B32B 2307/40 having particular optical properties light or UV resistant B32B2307/71
• CPC Class Codes: B32B 2329/06 PVB, i.e. polyinylbutyral
• CPC Class Codes: B32B 2457/20 Displays, e.g. liquid crystal displays, plasma displays
• CPC Class Codes: B32B 2457/208 Touch screens
• CPC Class Codes: B32B 37/1009 using vacuum and fluid pressure
• CPC Class Codes: B32B 37/12 characterised by using adhesives
• CPC Class Codes: B32B 38/0036 Heat treatment for heating or cooling of layers during lamination B32B37/06, B32B37/08
• CPC Class Codes: B32B 7/10 at least one layer having inter-reactive properties
• CPC Class Codes: B32B 7/12 using interposed adhesives or interposed materials with bonding properties
• CPC Class Codes: Y10T 156/10 Methods of surface bonding and/or assembly therefor
• CPC Class Codes: Y10T 428/31855 Of addition polymer from unsaturated monomers

Abstract

The present disclosure relates to an electronic device, and more particularly, to an electronic device with laminated structure and a manufacturing method thereof. The electronic device comprises: a first substrate; a second substrate; and a solid-state adhesive layer, wherein the adhesive layer is disposed between the first substrate and the second substrate. The solid-state adhesive layer reacts with the first substrate and the second substrate to form a chemically linked chain for bonding the first substrate and the second substrate. The present disclosure further selects a solid-state adhesive with both physical and chemical cohesiveness to laminate the two substrates; thereby making an electronic device more firm with higher shock resistance.

Claims

1. A manufacturing method for an electronic device with a laminated structure, comprising the following steps of:

disposing a solid-state adhesive layer between a first substrate and a second substrate; and

forming chemically linked chains between the solid-state adhesive layer and the first substrate and between the solid-state adhesive layer and the second substrate.

2. The manufacturing method of claim 1, wherein the step of forming the chemically linked chains comprises a heating and a pressurizing process.

3. The manufacturing method of claim 2, wherein the step before the heating and pressurizing process comprises:

fixing the first substrate and the second substrate by a fixture;

putting the fixed first substrate, the solid-state adhesive layer, and the second substrate together into a vacuum packaging bag;

conducting vacuum packaging machine; and

conducting a cool-exhaust and heat-exhaust process to exclude air from spaces between the solid-state adhesive layer and the first substrate and between the solid-state adhesive layer and the second substrate.

4. The manufacturing method of claim 2, wherein the steps after the heating and pressurizing process comprises:

cooling the first substrate, the solid-state adhesive layer, and the second substrate; and

removing the vacuum packaging bags.

5. The manufacturing method of claim 2, wherein the pressurizing and heating process is conducted in a high-pressure furnace.

6. The manufacturing method of claim 1, wherein the chemically linked chains are formed by hydrogen bonds.

7. The manufacturing method of claim 1, wherein the solid-state adhesive layer is a PVB adhesive layer.

8. The manufacturing method of claim 1, wherein tensile strength of the solid-state adhesive layer is more than or equal to 200 kg/cm².

9. The manufacturing method of claim 1, wherein shrinking rate of the solid-state adhesive layer is less than 3%.

10. The manufacturing method of claim 1, wherein the electronic device is a display device.

11. The manufacturing method of claim 1, wherein the electronic device is a touch display device.