EMBEDDED PACKAGING WITH PREFORMED VIAS
First Claim
1. A method of forming a microelectronic assembly, comprising:
- forming a structure including a microelectronic element having a front surface, edge surfaces bounding the front surface, and contacts at the front surface, and substantially rigid metal posts extending in the first direction, the posts disposed between at least one of the edge surfaces and a corresponding edge of the structure, each metal post having a sidewall separating first and second end surfaces of such metal post from one another, the sidewalls of the metal posts having a root mean square (rms) surface roughness of less than about 1 micron;
forming a encapsulation having a second thickness extending in the first direction between first and second surfaces of the encapsulation, the encapsulation contacting at least the edge surfaces of the microelectronic element and the sidewalls of the metal posts, wherein the metal posts extend at least partly through the second thickness, and the encapsulation electrically insulates adjacent metal posts from one another;
depositing an insulation layer overlying the first surface of the encapsulation and having thickness extending away from the first surface of the encapsulation;
forming connection elements extending away from the first end surfaces of the metal posts and through the thickness of the first insulation layer, wherein at least some connection elements have cross sections smaller than cross sections of the metal posts;
depositing an electrically conductive redistribution structure on the insulation layer, the redistribution layer electrically connecting at least some metal posts with the contacts of the microelectronic element; and
forming terminals at a first side of the microelectronic assembly adjacent to the first surface of the encapsulation, wherein the first connection elements electrically connect at least some first end surfaces with corresponding first terminals.
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Accused Products
Abstract
Microelectronic assemblies and methods of making the same are disclosed. In some embodiments, a microelectronic assembly includes a microelectronic element having edge surfaces bounding a front surface and contacts at the front surface; rigid metal posts disposed between at least one edge surface and a corresponding edge of the assembly, each metal post having a sidewall separating first and second end surfaces, the sidewalls have a root mean square (rms) surface roughness of less than about 1 micron; a encapsulation contacting at least the edge surfaces and the sidewalls; an insulation layer overlying the encapsulation; connection elements extending through the insulation layer, wherein at least some connection elements have cross sections smaller than those of the metal posts; a redistribution structure deposited on the insulation layer and electrically connecting first terminals with corresponding metal posts through the first connection elements, some metal posts electrically coupled with contacts of microelectronic element.
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Citations
12 Claims
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1. A method of forming a microelectronic assembly, comprising:
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forming a structure including a microelectronic element having a front surface, edge surfaces bounding the front surface, and contacts at the front surface, and substantially rigid metal posts extending in the first direction, the posts disposed between at least one of the edge surfaces and a corresponding edge of the structure, each metal post having a sidewall separating first and second end surfaces of such metal post from one another, the sidewalls of the metal posts having a root mean square (rms) surface roughness of less than about 1 micron; forming a encapsulation having a second thickness extending in the first direction between first and second surfaces of the encapsulation, the encapsulation contacting at least the edge surfaces of the microelectronic element and the sidewalls of the metal posts, wherein the metal posts extend at least partly through the second thickness, and the encapsulation electrically insulates adjacent metal posts from one another; depositing an insulation layer overlying the first surface of the encapsulation and having thickness extending away from the first surface of the encapsulation; forming connection elements extending away from the first end surfaces of the metal posts and through the thickness of the first insulation layer, wherein at least some connection elements have cross sections smaller than cross sections of the metal posts; depositing an electrically conductive redistribution structure on the insulation layer, the redistribution layer electrically connecting at least some metal posts with the contacts of the microelectronic element; and forming terminals at a first side of the microelectronic assembly adjacent to the first surface of the encapsulation, wherein the first connection elements electrically connect at least some first end surfaces with corresponding first terminals. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12)
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Specification