FOOD PRINTING ADDITIVE LAYERING SUBSTRATE STRUCTURE INGESTIBLE MATERIAL PREPARATION SYSTEM AND METHOD

• US 20160021925A1
• Filed: 06/25/2015
• Published: 01/28/2016
• Est. Priority Date: 06/12/2012
• Status: Active Grant

• Current Assignee: Elwha LLC (Intellectual Ventures LLC)
• Original Assignee: Elwha LLC (Intellectual Ventures LLC)
• Inventors: Holman, Paul, Levien, Royce A., Malamud, Mark A., Stephenson, Neal, Young, Christopher Charles
• Granted Patent: US 10,239,256 B2
• Time in Patent Office: Days
• US Class Current: 1/1
• CPC Class Codes: A23L 5/00 Preparation or treatment of foods or foodstuffs, in general; Food or foodstuffs obtained thereby; Materials therefor
• CPC Class Codes: A23P 20/00 Coating of foodstuffs; Coatings therefor; Making laminated, multi-layered, stuffed or hollow foodstuffs
• CPC Class Codes: A23P 20/20 Making of laminated, multi-layered, stuffed or hollow foodstuffs, e.g. by wrapping in preformed edible dough sheets or in edible food containers
• CPC Class Codes: A23P 2020/253 Coating food items by printing onto them; Printing layers of food products
• CPC Class Codes: B29C 64/20 Apparatus for additive manufacturing; Details thereof or accessories therefor
• CPC Class Codes: B33Y 30/00 Apparatus for additive manufacturing; Details thereof or accessories therefor
• CPC Class Codes: B33Y 50/02 for controlling or regulating additive manufacturing processes

Abstract

A computationally implemented system and method that is designed to, but is not limited to: electronically directing control of at least partial treatment of the one or more portions of the one or more ingestible substrate structures according to the treatment instructional information regarding the one or more subsequent ingestible substrate structure directed energy operations including directing energy to treat at least in part the one or more portions of the one or more ingestible substrate structures to form at least in part the one or more selected ingestible products subsequent to and based at least in part upon the electronically receiving the user status information and the electronically receiving the selection information. In addition to the foregoing, other method aspects are described in the claims, drawings, and text forming a part of the present disclosure.

Claims

1. A system comprising:

inputter electronic machine circuitry configured for involvement with inputting identifying data related to a user;

receiver electronic machine circuitry configured for involvement with receiving one or more food selections selected from a menu of food items by the user;

force imparter electronic machine circuitry configured for involvement with directing one or more applied forces via one or more objects on to one or more ingestible substrate impacted portions based at least in part on the one or more food selections; and

food printer electronic machine circuitry configured for involvement with food printing one or more layers of food material on to the one or more ingestible substrate impacted portions based at least in part on the one or more food selections.

2. The system of claim 1, wherein the food printer electronic machine circuitry configured for involvement with food printing one or more layers of food material on to the one or more ingestible substrate impacted portions based at least in part on the one or more food selections comprises:

injection electronic machine circuitry configured for involvement with one or more injection operations including at least one or more injections of one or more materials at least partially into the one or more portions of the one or more ingestible substrate impacted portions.

3. The system of claim 2, wherein injection electronic machine circuitry configured for involvement with one or more injection operations including at least one or more injections of one or more materials at least partially into the one or more portions of the one or more ingestible substrate impacted portions comprises:

the one or more injections of one or more materials including gas-based materials.

4. The system of claim 2, wherein the injection electronic machine circuitry configured for involvement with one or more injection operations including at least one or more injections of one or more materials at least partially into the one or more portions of the one or more ingestible substrate impacted portions comprises:

the one or more injection operations including use of needle-based injections.

5. The system of claim 2, wherein injection electronic machine circuitry configured for involvement with one or more injection operations including at least one or more injections of one or more materials at least partially into the one or more portions of the one or more ingestible substrate impacted portions comprises:

the one or more injections of one or more materials including liquid-based materials.

6. The system of claim 2, wherein injection electronic machine circuitry configured for involvement with one or more injection operations including at least one or more injections of one or more materials at least partially into the one or more portions of the one or more ingestible substrate impacted portions comprises:

the one or more injection operations including use of jet-based injections.

7. The system of claim 2, wherein the injection electronic machine circuitry configured for involvement with one or more injection operations including at least one or more injections of one or more materials at least partially into the one or more portions of the one or more ingestible substrate impacted portions comprises:

the one or more ingestible substance impacted portions including one or more wafer-based substrate portions.

8. The system of claim 1, wherein food printer electronic machine circuitry configured for involvement with food printing one or more layers of food material on to the one or more ingestible substrate impacted portions based at least in part on the one or more food selections comprises:

channeling electronic machine circuitry configured for involvement with one or more ingestible substrate structure duct operations including flowing one or more fluids through one or more ducts to treat at least in part the one or more portions of the one or more ingestible substrate impacted portions.

9. The system of claim 8, wherein the channeling electronic machine circuitry configured for involvement with one or more ingestible substrate structure duct operations including flowing one or more fluids through one or more ducts to treat at least in part the one or more portions of the one or more ingestible substrate impacted portions further comprising:

the one or more ducts having one or more dissolvable surfaces.

10. The system of claim 8, wherein the channeling electronic machine circuitry configured for involvement with one or more ingestible substrate structure duct operations including flowing one or more fluids through one or more ducts to treat at least in part the one or more portions of the one or more ingestible substrate impacted portions comprises:

the one or more ducts configured with one or more matrices.

11. The system of claim 8, wherein the channeling electronic machine circuitry configured for involvement with one or more ingestible substrate structure duct operations including flowing one or more fluids through one or more ducts to treat at least in part the one or more portions of the one or more ingestible substrate impacted portions comprises:

the one or more ducts having tubular duct arrangements.

12. The system of claim 8, wherein the channeling electronic machine circuitry configured for involvement with one or more ingestible substrate structure duct operations including flowing one or more fluids through one or more ducts to treat at least in part the one or more portions of the one or more ingestible substrate impacted portions comprises:

the one or more ingestible substrate impacted portions including one or more wafer portions.

13. The system of claim 8, wherein the channeling electronic machine circuitry configured for involvement with one or more ingestible substrate structure duct operations including flowing one or more fluids through one or more ducts to treat at least in part the one or more portions of the one or more ingestible substrate impacted portions comprises:

the one or more ducts internally located within the one or more ingestible substrate impacted portions.

14. The system of claim 8, wherein the channeling electronic machine circuitry configured for involvement with one or more ingestible substrate structure duct operations including flowing one or more fluids through one or more ducts to treat at least in part the one or more portions of the one or more ingestible substrate impacted portions comprises:

the one or more ducts including externally positioned ducts adjacent the one or more ingestible substrate impacted portions.

15. The system of claim 1, wherein food printer electronic machine circuitry configured for involvement with food printing one or more layers of food material on to the one or more ingestible substrate impacted portions based at least in part on the one or more food selections further comprising:

directed energy electronic machine circuitry configured for involvement with one or more ingestible substrate structure directed energy operations including directed energy to treat at least in part the one or more portions of the one or more substrate impacted structures.

16. The system of claim 15, wherein the directed energy electronic machine circuitry configured for involvement with one or more ingestible substrate structure directed energy operations including directed energy to treat at least in part the one or more portions of the one or more substrate impacted structures comprises:

the one or more ingestible substrate structure directed energy operations including directed laser energy.

17. The system of claim 15, wherein the directed energy electronic machine circuitry configured for involvement with one or more ingestible substrate structure directed energy operations including directed energy to treat at least in part the one or more portions of the one or more substrate impacted structures comprises:

the one or more ingestible substrate structure directed energy operations including patterned energy placement.

18. The system of claim 15, wherein the directed energy electronic machine circuitry configured for involvement with one or more ingestible substrate structure directed energy operations including directed energy to treat at least in part the one or more portions of the one or more substrate impacted structures comprises:

the one or more ingestible substrate structure directed energy operations including directed radiant energy.

19. The system of claim 15, wherein the directed energy electronic machine circuitry configured for involvement with one or more ingestible substrate structure directed energy operations including directed energy to treat at least in part the one or more portions of the one or more substrate impacted structures comprises:

the one or more ingestible substrate structure directed energy operations including directed microwave energy.

20. The system of claim 15, wherein the directed energy electronic machine circuitry configured for involvement with one or more ingestible substrate structure directed energy operations including directed energy to treat at least in part the one or more portions of the one or more substrate impacted structures comprises:

the one or more ingestible substrate structure directed energy operations including directed acoustic energy.