ADAPTIVE PROCESSES FOR IMPROVING INTEGRITY OF SURFACES

• US 20160026176A1
• Filed: 07/23/2014
• Published: 01/28/2016
• Est. Priority Date: 07/23/2014
• Status: Active Grant

• Current Assignee: Apple Inc.
• Original Assignee: Apple Inc.
• Inventors: Leggett, William F., Lancaster-Larocque, Simon Regis Louis
• Granted Patent: US 10,162,343 B2
• Time in Patent Office: Days
• US Class Current: 1/1
• CPC Class Codes: G05B 19/41875 characterised by quality surveillance of production
• CPC Class Codes: G06F 1/1613 for portable computers cooling arrangements therefor G06F1/203; constructional details or arrangements for pocket calculators, electronic agendas or books G06F15/0216; constructional details of portable telephone sets: with several bodies H04M1/0202
• CPC Class Codes: H05K 13/00 Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
• CPC Class Codes: Y02P 90/02 Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]

Abstract

A process for performing localized corrective actions to structure of an electronic device is described. The structure may include a mating surface configured to receive another structure such that the two structures may be, for example, adhesively bonded together. The localized corrective actions are configured not to improve the mating surface but to also prevent light within the electronic device from escaping in undesired areas of the electronic device. In some embodiments, the corrective action includes using a removal tool to remove identified portions of the surface. In other embodiments, the corrective action includes using a different tool to add material identified portions of the surface. The identified means may include an automated inspection system.

Claims

1. A method for providing a corrective action to an enclosure of an electronic device, the method comprising:

scanning the enclosure with an automated inspection system, the automated inspection system capable of locating a dimension of the enclosure, the dimension not within a predetermined tolerance of the enclosure;

forming a comparison between the dimension and the predetermined tolerance; and

sending the comparison to a tool, the comparison signaling a tool to perform the corrective action to the dimension based on the comparison, wherein performing the corrective action to the dimension causes the dimension to be least within the predetermined tolerance, wherein the dimension is;

(1) a first surface that receives a display of the electronic device, and (2) an inner portion of a lid having a first cutting area and a second cutting area having a portion that overlaps the first cutting area and having a depth different from the first cutting area.

3. The method as recited in claim 1, wherein the tool comprises a laser that removes a protrusion from the first surface, the protrusion located by the automated inspection system.

4. The method as recited in claim 1, wherein the dimension is a second surface having a non-level portion.

5. The method as recited in claim 4, wherein the corrective action comprises laser ablating the non-level portion of the second surface such that the second surface is approximately level.

6. The method as recited in claim 5, wherein the automated inspection system selects a reference surface on the second surface, and wherein the laser ablating removes the non-level portion such that the second surface is level with respect to the reference surface.

7. The method as recited in claim 6, wherein the second surface is a surface that receives a hinge assembly that pivotally connects the enclosure to a base, the base being part of the electronic device.

9. The method as recited in claim 1, wherein the tool is a print head that prints a material into the second cutting area such that the depth of the second cutting area with the material is approximately co-planar with the first cutting area.

10. The method as recited in claim 1, wherein the dimension is a second surface that receives a hinge assembly, the second surface having a non-level portion, and wherein the tool is a print head that prints a material onto the non-level portion such that the second surface and the material form a substantially level surface.

11. The method as recited in claim 1, wherein:

the dimension is a third surface that receives an indicium, the third surface having a non-level portion;

the tool is a print head that prints a plurality of prints segments onto the third surface, the plurality of print segments comprising a first print segment and a second print segment; and

a portion of the first print segment overlaps a portion of the second print segment.

12. The method as recited in claim 1, further comprising, subsequent to the signaling the tool to perform the corrective action, performing a second scan with the automated inspection system, the second scan providing feedback based on the corrective action.

2. (canceled)

8. (canceled)

13. A method for assembling an electronic device, the method comprising:

performing a first adjustment to a first surface of a first component, the first adjustment removing a protrusion of the first surface;

performing a second adjustment to a second surface of the first component, the second adjustment adding a material to the second surface such that the second surface is approximately level;

attaching a second component to the first surface of the first component; and

attaching a third component to the second surface of the first component, wherein the first adjustment and the second adjustment are located by an automated inspection system.

14. The method as recited in claim 13, wherein the first adjustment comprises a laser that laser ablates the first surface, and wherein the second adjustment comprises a print head of a printing machine, the print head printing a resin material onto the second surface.

15. The method as recited in claim 13, wherein performing the first adjustment comprises an automated inspection machine communicating with the laser, and wherein performing the second adjustment comprises the automated inspection system communicating with a printing machine.

16. The method as recited in claim 13, wherein the first adjustment places the first surface within a predetermined tolerance.

17. A non-transitory computer readable storage medium storing instructions that, when executed by a processor, cause the processor to implement a method for providing a corrective action to an enclosure of an electronic device, the non-transitory computer readable storage medium comprising:

computer code for scanning the enclosure with an automated inspection system, the automated inspection system capable of locating a dimension of the enclosure, the dimension not within a predetermined tolerance of the enclosure;

computer code for forming a comparison between a dimension of the enclosure and a predetermined tolerance of the enclosure; and

computer code for sending the comparison to a tool, the comparison signaling a tool to perform the corrective action to the dimension based on the comparison, wherein performing the corrective action to the dimension causes the dimension to be least within the predetermined tolerance by removing a protrusion on a first surface of the enclosure configured to receive a first component of the electronic device and adding a material to a second surface of the enclosure configured to receive a second component different from the first component.

20. The non-transitory computer readable storage medium as recited in claim 17, further comprising, subsequent to the signaling the tool to perform the corrective action, computer code for performing a second scan with the inspection system, the second scan providing feedback based on the corrective action.

18-19. -19. (canceled)