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ADAPTIVE PROCESSES FOR IMPROVING INTEGRITY OF SURFACES

  • US 20160029496A1
  • Filed: 09/30/2015
  • Published: 01/28/2016
  • Est. Priority Date: 07/23/2014
  • Status: Active Grant
First Claim
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1. A method for assembling a first part of an electronic device with a second part of the electronic device, the method comprising:

  • scanning the first part to determine a first surface profile;

    scanning the second part to determine a second surface profile;

    receiving a material on the second part, based upon the first surface profile and the second surface profile, the material allowing the first part to be positioned on the material such that the first part is co-planar with the respect to the second part; and

    securing the first part with the material.

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