METHOD AND APPARATUS FOR PRODUCING AN ELECTRONIC DEVICE

• US 20160050762A1
• Filed: 08/13/2015
• Published: 02/18/2016
• Est. Priority Date: 08/13/2014
• Status: Active Grant

• Current Assignee: RR Donnelley & Sons Company
• Original Assignee: RR Donnelley & Sons Company
• Inventors: Cyman, Theodore F. Jr., Murzynowski, Alan R., Kanfoush, Daniel E.
• Granted Patent: US 9,996,788 B2
• Time in Patent Office: Days
• US Class Current: 1/1
• CPC Class Codes: B29C 2795/00 Printing on articles made from plastics or substances in a plastic state
• CPC Class Codes: B32B 38/14 Printing or colouring
• CPC Class Codes: B32B 38/145 Printing
• CPC Class Codes: B41M 7/0027 using protective coatings or layers by lamination or by fusion of the coatings or layers
• CPC Class Codes: G06K 19/077 Constructional details, e.g. mounting of circuits in the carrier
• CPC Class Codes: H05K 1/115 Via connections; Lands around holes or via connections H05K1/112 takes precedence
• CPC Class Codes: H05K 2201/10098 Components for radio transmission, e.g. radio frequency identification [RFID] tag, printed or non-printed antennas
• CPC Class Codes: H05K 2203/0522 Using an adhesive pattern
• CPC Class Codes: H05K 2203/1545 Continuous processing, i.e. involving rolls moving a band-like or solid carrier along a continuous production path
• CPC Class Codes: H05K 3/046 by selective transfer or selective detachment of a conductive layer
• CPC Class Codes: H05K 3/4685 Manufacturing of cross-over conductors

Abstract

A method and apparatus for producing an electronic device are disclosed. An adhesive material is jetted in a first pattern on a surface of a receiver substrate. A carrier having a metal foil disposed thereon is brought into contact with the first substrate such that a portion of the metal foil contacts the adhesive material. The adhesive material is activated using at least one of mechanical pressure and heat while the portion of the metal foil is in contact with the adhesive material. The first substrate and the second substrate are separated, whereby the portion of the metal foil is transferred to the first substrate.

Claims

1. A method of producing an electronic device, comprising the steps of:

jetting an adhesive material in a first pattern on a surface of a receiver substrate;

bringing a carrier having a metal foil disposed thereon into contact with the first substrate such that a portion of the metal foil contacts the adhesive material;

activating the adhesive material using at least one of mechanical pressure and heat while the portion of the metal foil is in contact with the adhesive material; and

separating the first substrate and the second substrate, whereby the portion of the metal foil is transferred to the first substrate.

2. The method of claim 1, further including the step of applying a further adhesive material in a second pattern on top of the transferred metal foil, depositing a further metallic material on top of the second pattern, wherein the further metallic material is conductively coupled to a portion of the transferred metallic material.

3. The method of claim 2, wherein the step of applying the further adhesive material includes the step of applying the further adhesive material such that no portion of the second pattern of the further adhesive material extends beyond the first pattern of adhesive material.

4. The method of claim 2, further including the step of forming a via from a top surface of the further adhesive material to the transferred metal foil.

5. The method of claim 4, wherein the first transferred metal foil and the further metallic material are conductively coupled through the via.

6. The method of claim 2, further including the step of applying a non-conductive material between the further adhesive material and the transferred metal foil.

7. The method of claim 6, wherein the non-conductive material has a thickness between 200 Angstroms and 10,000 Angstroms.

8. The method of claim 6, further including the steps of forming a first via from a top surface of the further adhesive material to a top surface of the non-conductive material, and forming a second via from a top surface of the non-conductive material to a top surface of the transferred metal foil, wherein first via and the second via combine to couple the top surface of the further adhesive material with the top surface of the metal foil.

9. The method of claim 7, wherein a diameter of the first via is substantially different that a diameter of the second via.

10. The method of claim 1, wherein the first pattern of the adhesive material has a thickness between 200 and 10,000 Angstroms.

11. An apparatus for producing an electronic device, comprising the steps of:

an adhesive applicator that jets an adhesive material in a first pattern on a surface of a receiver substrate;

a contacting apparatus that brings a carrier having a metal foil disposed thereon into contact with the first substrate such that a portion of the metal contacts the adhesive material;

an adhesive activator that applies at least one of mechanical pressure and heat to the adhesive material while the portion of the metal foil is in contact with the adhesive material; and

a separator to separate the first substrate and the second substrate, whereby the portion of the metal foil is transferred to the first substrate.

12. The apparatus of claim 11, including a further adhesive applicator that applies a further adhesive material in a second pattern on top of the transferred metal foil, a transferring apparatus to deposit a further metallic material on top of the second pattern, wherein the further metallic material is conductively coupled to a portion of the transferred metallic material.

13. The apparatus of claim 12, wherein the further adhesive applicator applies the further adhesive material such that no portion of the second pattern of the further adhesive material extends beyond the first pattern of adhesive material.

14. The apparatus of claim 13, wherein the further adhesive applicator jets the further adhesive material such that a via is formed from a top surface of the further adhesive material to the transferred metal foil.

15. The apparatus of claim 14, wherein the first transferred metal foil and the further metallic material are conductively coupled through the via.

16. The apparatus of claim 12, including an applicator that applies a non-conductive material between the further adhesive material and the transferred metal foil.

17. The apparatus of claim 16, wherein the non-conductive material has a thickness between 200 and 10,000 Angstroms.

18. The apparatus of claim 16, wherein a first via is formed from a top surface of the further adhesive material to a top surface of the non-conductive material, and a second via is formed from a top surface of the non-conductive material to a top surface of the transferred metal foil, wherein first via and the second via form a path from the top surface of the further adhesive material with the top surface of the metal foil.

19. The apparatus of claim 17, wherein the diameter of the first via is substantially different that the diameter of the second via.

20. The apparatus of claim 11, wherein the first pattern of the adhesive material has a thickness between 200 and 10,000 Angstroms.