COMPONENT ARRANGEMENT
First Claim
1. A component arrangement comprising:
- a carrier, wherein at least one electronic component is formed in the carrier;
a first metallization layer above the carrier, wherein the first metallization layer comprises a first metallic coupling structure, which is coupled to the at least one electronic component;
a second metallization layer above the first metallization layer, wherein the second metallization layer comprises a second metallic coupling structure, wherein the first metallic coupling structure is coupled to the second metallic coupling structure by at least one via;
a plurality of additional vias, which extend at least between the first metallization layer and the second metallization layer and which are electrically conductively coupled to one another in such a way that they form a coil comprising a coil region situated at an angle with respect to the main processing surface of the carrier;
a third metallization layer above the second metallization layer, wherein the third metallization layer comprises a third metallic coupling structure, wherein the second metallic coupling structure is coupled to the third metallic coupling structure by at least one via; and
wherein some of the additional vias extend at least between the first metallization layer and the third metallization layer;
wherein the coil comprises a plurality of coil turns;
wherein the at least two coil turns define the coil region;
wherein the plurality of additional vias extend at least between the first metallization layer and the second metallization layer in such a way that the coil region is situated substantially perpendicularly to the main processing surface of the carrier.
1 Assignment
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Accused Products
Abstract
Various embodiments may relate to a component arrangement, including a carrier, wherein at least one electronic component is formed in the carrier, a first metallization layer over the carrier, wherein the first metallization layer has a first metallic coupling structure, which is electrically coupled to the at least one electronic component, a second metallization layer over the first metallization layer, wherein the second metallization layer has a second metallic coupling structure, wherein the first metallic coupling structure is coupled to the second metallic coupling structure by means of at least one via, and a plurality of additional vias, which extend at least between the first metallization layer and the second metallization layer and are electrically conductively coupled to one another in such a way that they form a coil, which has a coil region which is at an angle to the main processing surface of the carrier.
12 Citations
10 Claims
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1. A component arrangement comprising:
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a carrier, wherein at least one electronic component is formed in the carrier; a first metallization layer above the carrier, wherein the first metallization layer comprises a first metallic coupling structure, which is coupled to the at least one electronic component; a second metallization layer above the first metallization layer, wherein the second metallization layer comprises a second metallic coupling structure, wherein the first metallic coupling structure is coupled to the second metallic coupling structure by at least one via; a plurality of additional vias, which extend at least between the first metallization layer and the second metallization layer and which are electrically conductively coupled to one another in such a way that they form a coil comprising a coil region situated at an angle with respect to the main processing surface of the carrier; a third metallization layer above the second metallization layer, wherein the third metallization layer comprises a third metallic coupling structure, wherein the second metallic coupling structure is coupled to the third metallic coupling structure by at least one via; and wherein some of the additional vias extend at least between the first metallization layer and the third metallization layer; wherein the coil comprises a plurality of coil turns; wherein the at least two coil turns define the coil region; wherein the plurality of additional vias extend at least between the first metallization layer and the second metallization layer in such a way that the coil region is situated substantially perpendicularly to the main processing surface of the carrier. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
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Specification