INTERPOSERS WITH CIRCUIT MODULES ENCAPSULATED BY MOLDABLE MATERIAL IN A CAVITY, AND METHODS OF FABRICATION
First Claim
1. An assembly comprising:
- a substrate whose top side comprises a cavity comprising a bottom wall;
one or more contact pads under the bottom wall;
a plurality of levels overlying one another in the cavity, each level comprising one or more dies laterally encapsulated by an encapsulant layer made of cured resin at least partially cured separately from the encapsulant layer of any other level; and
electrically conductive wiring passing through a plurality of the encapsulant layers and through the bottom wall to connect one or more of the dies to the one or more contact pads under the bottom wall, the electrically conductive wiring connecting at least one die overlying more than one of the encapsulant layers to at least one contact pad under the bottom wall.
2 Assignments
0 Petitions
Accused Products
Abstract
Stacked dies (110) are encapsulated in an interposer'"'"'s cavity (304) by multiple encapsulant layers (524) formed of moldable material. Conductive paths (520, 623) connect the dies to the cavity'"'"'s bottom all (304B) and, through TSVs passing through the bottom wall, to a conductor below the interposer. The conductive paths can be formed in segments each of which is formed in a through-hole (514) in a respective encapsulant layer. Each segment can be formed by electroplating onto a lower segment; the electroplating current can be provided from below the interposer through the TSVs and earlier formed segments. Other features are also provided.
5 Citations
20 Claims
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1. An assembly comprising:
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a substrate whose top side comprises a cavity comprising a bottom wall; one or more contact pads under the bottom wall; a plurality of levels overlying one another in the cavity, each level comprising one or more dies laterally encapsulated by an encapsulant layer made of cured resin at least partially cured separately from the encapsulant layer of any other level; and electrically conductive wiring passing through a plurality of the encapsulant layers and through the bottom wall to connect one or more of the dies to the one or more contact pads under the bottom wall, the electrically conductive wiring connecting at least one die overlying more than one of the encapsulant layers to at least one contact pad under the bottom wall. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
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11. An assembly comprising:
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a substrate whose top side comprises a cavity comprising a bottom wall; one or more contact pads under the bottom wall; a plurality of levels overlying one another in the cavity, each level comprising one or more dies laterally encapsulated by an encapsulant layer comprising organic polymer; and electrically conductive wiring passing through a plurality of the encapsulant layers and through the bottom wall to connect one or more of the dies to the one or more contact pads under the bottom wall, the electrically conductive wiring connecting at least one die overlying more than one of the encapsulant layers to at least one contact pad under the bottom wall; wherein the electrically conductive wiring comprises a plurality of vertical segments each of which passes through a respective one of the encapsulant layers and is electrically connected, by the electrically conductive wiring, to the at least one die and to the at least one contact pad; and wherein the electrical wiring comprises, at a top of each vertical segment, a contact pad physically contacting the vertical segment and the encapsulant layer through which the vertical segment passes, the contact pad being wider than the vertical segment. - View Dependent Claims (12, 13, 14, 15, 16, 17)
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18. An assembly comprising:
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a substrate whose top side comprises a cavity comprising a bottom wall; one or more contact pads under the bottom wall; a plurality of levels overlying one another in the cavity, each level comprising one or more dies laterally encapsulated by an encapsulant layer comprising organic polymer; electrically conductive wiring passing through a plurality of the encapsulant layers and through the bottom wall to connect one or more of the dies to the one or more contact pads under the bottom wall, the electrically conductive wiring connecting at least one die overlying more than one of the encapsulant layers to at least one contact pad under the bottom wall; and wherein the electrically conductive wiring comprises a plurality of vertical segments each of which passes through a respective one of the encapsulant layers and is electrically connected, by the electrically conductive wiring, to the at least one die and to the at least one contact pad; and wherein the electrical wiring comprises, at a bottom of each vertical segment, a contact pad physically contacting the vertical segment and the encapsulant layer through which the vertical segment passes, the contact pad being wider than the vertical segment. - View Dependent Claims (19, 20)
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Specification