SYSTEMS AND METHODS FOR BREAKAWAY RFID TAGS

• US 20160157348A1
• Filed: 02/02/2016
• Published: 06/02/2016
• Est. Priority Date: 06/21/2006
• Status: Active Grant

• Current Assignee: Smartrac Technology Fletcher, Inc. (Avery Dennison Corporation)
• Original Assignee: Neology Incorporated (OEP Technologie BV)
• Inventors: Elizondo, Paul, Azevedo, John
• Granted Patent: US 9,501,736 B2
• Time in Patent Office: Days
• US Class Current: 1/1
• CPC Class Codes: G06K 19/0723 the record carrier comprising an arrangement for non-contact communication, e.g. wireless communication circuits on transponder cards, non-contact smart cards or RFIDs
• CPC Class Codes: G06K 19/07796 arrangements on the record carrier to allow stacking of a plurality of similar record carriers, e.g. to avoid interference between the non-contact communication of the plurality of record carriers
• CPC Class Codes: G06K 19/07798 part of the antenna or the integrated circuit being adapted for rupturing or breaking, e.g. record carriers functioning as sealing devices for detecting not-authenticated opening of containers electronic seals G09F3/03
• CPC Class Codes: G06K 7/0008 General problems related to the reading of electronic memory record carriers, independent of its reading method, e.g. power transfer
• CPC Class Codes: G06K 7/10029 the collision being resolved in the time domain, e.g. using binary tree search or RFID responses allocated to a random time slot
• CPC Class Codes: G06K 7/10039 interrogator driven, i.e. synchronous
• CPC Class Codes: G06K 7/10475 arrangements to facilitate interaction with further interrogation devices, e.g. such that at least two interrogation devices may function and cooperate in a network of such devices
• CPC Class Codes: G06Q 10/08 Logistics, e.g. warehousing, loading or distribution; Inventory or stock management
• CPC Class Codes: H04J 3/0641 Change of the master or reference, e.g. take-over or failure of the master
• CPC Class Codes: H05K 1/02 Details
• CPC Class Codes: H05K 1/0266 Marks, test patterns or identification means
• CPC Class Codes: H05K 1/0268 for electrical inspection or testing
• CPC Class Codes: H05K 1/142 Arrangements of planar printed circuit boards in the same plane, e.g. auxiliary printed circuit insert mounted in a main printed circuit
• CPC Class Codes: H05K 2201/0909 Preformed cutting or breaking line
• CPC Class Codes: H05K 2201/09127 PCB or component having an integral separable or breakable part
• CPC Class Codes: H05K 3/30 Assembling printed circuits with electric components, e.g. with resistor

Abstract

A breakaway RFID tag is configured such that it comprises part of a Printed Circuit Board Assembly (PCB). Thus, the breakaway RFID tag can be used to track the PCB as it migrates through a manufacturing process. In one embodiment, the RFID tag can be assembled first and then used to track the PCB as it is populated with components and installed into larger assemblies and ultimately into the end device. Once the PCB is installed into a larger assembly or the end device, the breakaway RFID tag is configured such that it can be broken off and attached to the outside of the larger assembly or end device.

Claims

1. A trackable printed circuit board (PCB), comprising:

a main circuit area which is manufactured through a PCB process including a plurality of processing steps;

a breakaway radio frequency identification (RFID) tag, wherein the breakaway RFID tag is configured to be scanned during the PCB process when the breakaway RFID tag is attached to the main circuit area and store information associated with the plurality of processing steps; and

a breakable portion connecting the main circuit area and the RFID tag, wherein the breakable portion is configured to allow the breakaway RFID tag to be detached from the main circuit area.

2. The trackable PCB of claim 1, wherein the breakaway RFID tag is scanned before each of the plurality of processing steps.

3. The trackable PCB of claim 1, wherein the breakaway RFID tag is scanned after each of the plurality of processing steps.

4. The trackable PCB of claim 1, wherein the plurality of processing steps include one or more assembly steps for assembling multiple components onto the main circuit area.

5. The trackable PCB of claim 1, wherein the plurality of processing steps include a repair step for performing a repair operation on the trackable PCB at a repair station.

6. The trackable PCB of claim 5, wherein the breakaway RFID tag is scanned when the trackable PCB enters the repair station.

7. The trackable PCB of claim 5, wherein the breakaway RFID tag is scanned when the trackable PCB exits the repair station.

8. The trackable PCB of claim 1, wherein the stored information includes identification information of the breakaway RFID tag and a time when the breakaway RFID tag is scanned.

9. The trackable PCB of claim 1, wherein the breakaway RFID tag comprises:

a printed antenna; and

an integrated circuit (IC) pad configured to receive an RFID transponder IC.

10. The trackable PCB of claim 9, wherein the breakaway RFID tag further comprises an RFID transponder disposed on the IC pad.

11. The trackable PCB of claim 1, wherein the breakable portion is perforated with holes so that the breakaway RFID tag can be easily snapped-off from the trackable PCB.

12. The trackable PCB of claim 1, wherein the breakaway RFID tag comprises a passive RFID tag.

13. The trackable PCB of claim 1, wherein the breakaway RFID tag comprises an active RFID tag.

14. A method for manufacturing a printed circuit board (PCB), comprising:

fabricating a breakaway radio frequency identification (RFID) tag of the PCB, wherein the RFID tag includes a printed antenna and an RFID transponder intergrade circuit (IC);

manufacturing a main circuit area of the PCB through a PCB process including a plurality of processing steps, wherein manufacturing the main circuit area further includes scanning the breakaway RFID tag after each of the plurality of processing steps and storing information associated with the plurality of processing steps using the breakaway RFID tag; and

manufacturing a breakable portion of the PCB which connects the main circuit area and the RFID tag, wherein the breakable portion is configured to allow the breakaway RFID tag to be detached from the main circuit area.

15. The method of claim 14, wherein the plurality of processing steps include one or more assembly steps for assembling multiple components onto the main circuit area.

16. The method of claim 14, wherein the plurality of processing steps include a repair step for performing a repair operation on the PCB at a repair station.

17. The method of claim 16, wherein scanning the breakaway RFID tag includes scanning the breakaway RFID tag when the PCB enters the repair station.

18. The method of claim 16, wherein scanning the breakaway RFID tag includes scanning the breakaway RFID tag when the PCB exits the repair station.

19. The method of claim 14, wherein storing information associated with the plurality of processing steps includes storing identification information of the breakaway RFID tag and a time when the breakaway RFID tag is scanned.

20. The method of claim 14, wherein the method further comprises after the PCB has been manufactured, detaching the breakaway RFID tag from the main circuit area and attaching the breakaway RFID tag to the exterior of an assembly comprising the PCB where the breakaway RFID tag maintains its tracking function.