Biocompatible Bonding Method and Electronics Package Suitable for Implantation
First Claim
1. An implantable electronic device comprising:
- a hermetic electronics control unit having contacts;
a first portion of electrically conductive adhesive bonded to the contacts;
a second portion of electrically conductive adhesive bonded to the first portion of electrically conductive adhesive;
a flexible circuit including bond pads, the bond pads bonded to the second portion of electrically conductive adhesive.
2 Assignments
0 Petitions
Accused Products
Abstract
The invention is directed to a method of bonding a hermetically sealed electronics package to an electrode or a flexible circuit and the resulting electronics package that is suitable for implantation in living tissue, for a retinal or cortical electrode array to enable restoration of sight to certain non-sighted individuals. The hermetically sealed electronics package is directly bonded to the flex circuit or electrode by electroplating a biocompatible material, such as platinum or gold, effectively forming a plated rivet-shaped connection, which bonds the flex circuit to the electronics package. The resulting electronic device is biocompatible and is suitable for long-term implantation in living tissue.
8 Citations
7 Claims
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1. An implantable electronic device comprising:
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a hermetic electronics control unit having contacts; a first portion of electrically conductive adhesive bonded to the contacts; a second portion of electrically conductive adhesive bonded to the first portion of electrically conductive adhesive; a flexible circuit including bond pads, the bond pads bonded to the second portion of electrically conductive adhesive. - View Dependent Claims (2, 3, 4, 5, 6, 7)
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Specification