Resonant Compensating Loop for Shielding of Metal for Magnetically Coupled NFC and/or RFID Devices, and Methods of Making and Using the Same

• US 20160181695A1
• Filed: 12/22/2014
• Published: 06/23/2016
• Est. Priority Date: 12/22/2014
• Status: Active Grant

• Current Assignee: Ensurge Micropower ASA
• Original Assignee: Thin Film Electronics ASA
• Inventors: MUKHERJEE, Somnath
• Granted Patent: US 9,755,309 B2
• Time in Patent Office: Days
• US Class Current: 1/1
• CPC Class Codes: H01L 22/12 for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions electrical measurement of diffusions H01L22/14
• CPC Class Codes: H01Q 1/2216 used in interrogator/reader equipment
• CPC Class Codes: H01Q 7/00 Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop

Abstract

A near field communication device, and methods of manufacturing and using the same are disclosed. The near field communication device includes a receiver configured to convert a received near field signal to an electric signal, a transmitter configured to generate a transmittable near field signal, a dielectric substrate within a housing, an antenna on the dielectric substrate, and a compensating loop within the housing and coupled to the antenna. The antenna is configured to receive the received near field signal and to transmit or broadcast the transmittable near field signal. The compensating loop is electromagnetically coupled to the antenna and advantageously mitigates or counteracts an electromagnetic effect of metal on or near a surface of the dielectric substrate opposite from the antenna.

Claims

1. A near field communication device, comprising:

a) a receiver configured to convert a first near field signal to an electric signal;

b) a transmitter configured to generate a second near field signal;

c) a dielectric substrate within a housing;

d) an antenna on said dielectric substrate, said antenna receiving said first near field signal and transmitting or broadcasting said second near field signal; and

e) a compensating loop within said housing and coupled to said antenna.

2. The device of claim 1, wherein said antenna is between said dielectric substrate and said compensating loop.

3. The device of claim 2, further comprising an insulating or dielectric layer between said antenna and said compensating loop.

4. The device of claim 1, wherein said dielectric substrate comprises fiberglass, epoxy, silicon dioxide, silicon nitride, silicon oxynitride, aluminum oxide, tantalum oxide, zirconium oxide, a polysiloxane, parylene, polyethylene, polypropylene, an undoped polyimide, a polycarbonate, a polyamide, a polyether, a copolymer thereof, or a fluorinated derivative thereof.

5. The device of claim 1, wherein said antenna comprises a radio frequency (RF) antenna, and said compensating loop resonates at a frequency at or near that of the antenna.

6. The device of claim 1, wherein each of said antenna and said compensating loop comprises an electrically conducting coil.

7. The device of claim 1, wherein said compensating loop comprises a metal sheet, ring or other geometrical shape substantially similar to that of the antenna.

8. The device of claim 1, wherein said compensating loop is magnetically or inductively coupled to said antenna.

9. The device of claim 7, wherein said compensating loop mitigates or counteracts an electromagnetic effect of metal on or near a surface of said dielectric substrate opposite from said antenna.

10. The device of claim 1, wherein said compensating loop is between said dielectric substrate and said antenna.

15. The method of claim 1, wherein forming said antenna comprises depositing a first metal layer on said first surface of said dielectric substrate, then patterning and etching said first metal layer.

25. A method of monitoring at least one parameter of a semiconductor manufacturing process, comprising:

a) conducting the semiconductor manufacturing process;

b) monitoring one or more physical parameters of the semiconductor process; and

c) transmitting data or information from a monitor configured to monitor the semiconductor process, and reading the data or information with a reader configured to receive the data or information from the monitor,

wherein the monitor and/or reader comprises the near field communication device of claim 1.

26. The method of claim 25, wherein the semiconductor process comprises a chemical-mechanical (CMP) polishing process.

27. The method of claim 26, wherein the one or more parameters comprises a temperature of a semiconductor wafer and/or an amount of material removed during polishing.

11. A method of manufacturing a near field communication device, comprising:

a) forming an antenna on a dielectric substrate, said antenna receiving a first near field signal and transmitting or broadcasting a second near field signal, and coupled to a receiver and a transmitter; and

b) forming a compensating loop configured to be electromagnetically coupled to said antenna, that mitigates or counteracts an electromagnetic effect of metal on or near a surface of said dielectric substrate;

wherein said antenna, said dielectric substrate and said compensating loop are formed or placed in a housing of the near field communication device.

12. The method of claim 11, wherein said antenna is between said dielectric substrate and said compensating loop.

13. The method of claim 11, further comprising forming said dielectric substrate.

14. The method of claim 12, wherein said dielectric substrate comprises fiberglass/epoxy, silicon dioxide, silicon nitride, silicon oxynitride, aluminum oxide, tantalum oxide, zirconium oxide, a polysiloxane, parylene, polyethylene, polypropylene, an undoped polyimide, a polycarbonate, a polyamide, a polyether, a copolymer thereof, or a fluorinated derivative thereof.

16. The method of claim 11, wherein forming said antenna comprises printing a metal coil or ring on said dielectric substrate.

17. The method of claim 11, further comprising forming a dielectric layer on said antenna, before forming said compensating loop.

18. The method of claim 17, wherein forming said compensating loop comprises depositing a second metal layer on said dielectric layer, then patterning and etching said second metal layer.

19. The method of claim 17, wherein forming said compensating loop comprises printing a metal coil or ring on said dielectric layer.

20. The method of claim 16, wherein said metal coil or ring comprises a copper coil or ring.

21. The method of claim 11, wherein forming said compensating loop comprises (i) depositing a first metal layer on or over said dielectric substrate, then patterning and etching said first metal layer, or (ii) printing a metal coil or ring on said dielectric substrate.

22. The method of claim 21, further comprising forming a dielectric layer on said compensating loop, before forming said antenna.

23. The method of claim 22, wherein forming said antenna comprises (i) depositing a second metal layer on said dielectric layer, then patterning and etching said second metal layer, or (ii) printing a metal coil or ring on said dielectric layer.

24. The method of claim 11, wherein said compensating loop is magnetically or inductively coupled to said antenna.