TOUCH SENSOR ASSEMBLY AND METHOD OF MANUFACTURING SAME

• US 20160188093A1
• Filed: 12/21/2015
• Published: 06/30/2016
• Est. Priority Date: 12/24/2014
• Status: Active Grant

• Current Assignee: LG Electronics, Inc. (LG Corporation)
• Original Assignee: LG Electronics, Inc. (LG Corporation)
• Inventors: KIM, Hyunki, PARK, Seungje
• Granted Patent: US 10,180,748 B2
• Time in Patent Office: Days
• US Class Current: 1/1
• CPC Class Codes: F25D 2400/361 Interactive visual displays
• CPC Class Codes: F25D 29/005 Mounting of control devices
• CPC Class Codes: G06F 2203/04103 Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
• CPC Class Codes: G06F 3/0414 using force sensing means to determine a position
• CPC Class Codes: G06F 3/0416 Control or interface arrangements specially adapted for digitisers
• CPC Class Codes: H03K 17/962 Capacitive touch switches
• CPC Class Codes: H03K 2217/960755 Constructional details of capacitive touch and proximity switches
• CPC Class Codes: H03K 2217/960785 with illumination

Abstract

A touch sensor assembly may include a sensor mounting portion formed at a insulating substrate, and a soldering spot provided at the sensor mounting portion, wherein a touch sensor is stably fixed to the sensor mounting portion by the soldering spot. In addition, the touch sensor assembly according to an embodiment of the present disclosure includes a copper coating film coated on a insulating substrate, and a top layer printed on the copper coating film, wherein the copper coating film is protected by the top layer.

Claims

1. A touch sensor assembly comprising:

an insulating substrate formed of a resin material;

a copper provided over an upper surface of the insulating substrate to form a printed circuit;

a protective layer provided over an upper surface of the conductive layer;

a sensor mounting region formed by the upper surface of the conductive layer, which is exposed through the top layer;

at least one solder contact provided on the upper surface of the sensor mounting portion;

a touch sensor including a metal plate, and a ceramic element installed on an upper surface of the metal plate, wherein a lower surface of the metal plate is attached to an upper surface of the sensor mounting region using the at least one solder contact; and

a conductive foil covering the top layer and the touch sensor.

2. The touch sensor assembly of claim 1, further comprising a spacer provided between the top layer and the conductive foil.

3. The touch sensor assembly of claim 2, wherein the solder contact comprises a gel-typed solder cream.

4. The touch sensor assembly of claim 2, wherein a hole is formed at the sensor support region to form a sensor support, the sensor support having a diameter smaller than a diameter of the metal plate and greater than a diameter of the ceramic element.

5. The touch sensor assembly of claim 4, wherein the spacer includes a sensor hole at a position where the touch sensor is attached, and the sensor hole has a diameter greater than the diameter of the metal plate.

6. The touch sensor assembly of claim 5, wherein an outer diameter of the sensor mounting region is formed to have a size correspond to a diameter of the sensor hole, and an inner diameter of the sensor mounting region is formed to have a size correspond to the diameter of the sensor support.

7. The touch sensor assembly of claim 3, wherein the at least one solder contact comprises a plurality of solder contacts.

8. The touch sensor assembly of claim 1, further comprising a sensor housing configured to accommodate the insulating substrate, wherein the sensor housing includes:

a housing body in which the insulating substrate is provided therein; and

a housing cover which is coupled with the housing body.

9. The touch sensor assembly of claim 8, further comprising an elastic member mounted on a lower surface of the insulating substrate, and providing a restoring force against a touch pressure transferred to the touch sensor.

10. The touch sensor assembly of claim 1, wherein the touch sensor includes a piezo sensor.

11. The touch sensor assembly of claim 5, further comprising a cover film attached at a rear surface of the insulating substrate to cover the hole.

12. The touch sensor assembly of claim 4, further comprising a conductive line formed on an lower surface of the conductive foil, the conductive line having:

an outer guide line with a diameter corresponding to the diameter of the metal plate;

an inner guide line formed within the outer guide line and having a diameter corresponding to the diameter of the ceramic element;

a center conductive line which extends at the center of the conductive foil in a lengthwise direction of the conductive foil and connects the inner guide line and the outer guide line; and

a circumferential conductive line in a grid shape formed on an inner side of the inner guide line and an outer side of the outer guide line.

13. A touch sensor assembly comprising:

an insulating substrate formed of a resin material;

a conductive layer printed on an upper surface of the insulating substrate to form a printed circuit;

a protective layer provided over an upper surface of the conductive layer;

a sensor mounting area formed by the upper surface of the conductive layer, which is exposed through the top layer;

a touch sensor including a metal plate in contact with an upper surface of the sensor mounting area, and a ceramic element provided on an upper surface of the metal plate;

a conductive foil covering the protective layer and the touch sensor; and

a spacer interposed between the protective layer and the conductive foil,

wherein the spacer includes;

a sensor hole which is formed at a position corresponding to the sensor mounting area; and

a vent hole which extends from an edge of the sensor hole and discharges bubbles during attachment of the spacer.

14. The touch sensor assembly of claim 13, wherein the spacer further includes:

a first through hole formed at one side of the spacer; and

a second through hole formed at the other side of the spacer,

wherein the first through hole and the second through hole are spaced apart from each other in a lengthwise direction of the spacer.

15. The touch sensor assembly of claim 14, wherein the conductive foil includes a third through hole and a fourth through hole which are formed at positions respectively corresponding to positions of the first and second through holes of the spacer.

16. The touch sensor assembly of claim 13, wherein the vent hole extends in a lengthwise direction of the spacer and is aligned with a line passing through the center of the sensor hole.

17. The touch sensor assembly of claim 13, wherein a diameter of the sensor hole is formed to have a size corresponding to an outer diameter of the sensor mounting area.

18. The touch sensor assembly of claim 17, wherein a hole is provided in the sensor mounting area to form a sensor support, and an inner diameter of the sensor mounting area is formed to have a size corresponding to a diameter of the sensor support.

19. The touch sensor assembly of claim 13, further comprising at least one solder contact provided on an upper surface of the sensor mounting region to fix the touch sensor to the sensor support area, at least one solder contact being a cream prior to curing.

20. The touch sensor assembly of claim 18, further comprising a cover film attached onto a rear surface of the insulating substrate to cover the hole.

21. The touch sensor assembly of claim 13, further comprising a conductive line formed on a lower surface of the conductive foil.

22. A method of manufacturing a touch sensor assembly, comprising:

providing a base for a printed circuit board (PCB) using an insulating substrate formed of a resin material;

forming a copper coating or film on a surface of the insulating substrate;

printing a protective layer on an upper surface of the copper coating film other than a sensor mounting region;

forming a sensor support at a center of the sensor mounting region;

coating a solder cream onto the sensor mounting region to form a solder contact;

mounting a touch sensor on the sensor mounting region and covering the sensor support; and

pressing and heating the touch sensor and fixing the touch sensor onto the sensor mounting region.

23. The method of claim 22, further comprising attaching a spacer onto an upper surface of the protective layer, wherein the touch sensor is exposed through a sensor hole formed in the spacer.

24. The method of claim 23, further comprising attaching a conductive foil having a conductive line on a lower surface is formed onto an upper surface of the spacer,

wherein the conductive line connects all common contact points formed on the insulating substrate, and

wherein the touch sensor is covered by the conductive foil.