METHOD OF MANUFACTURING ELECTRONIC COMPONENT

• US 20160189863A1
• Filed: 11/16/2015
• Published: 06/30/2016
• Est. Priority Date: 12/24/2014
• Status: Active Grant

• Current Assignee: Samsung Electro-Mechanics Co., Ltd. (Samsung Group)
• Original Assignee: Samsung Electro-Mechanics Co., Ltd. (Samsung Group)
• Inventors: AHN, Kyung Han, PARK, Moon Soo, YOON, Jong Sik, LEE, Dong Hwan, CHA, Hye Yeon, LEE, Jong Ho
• Granted Patent: US 10,102,969 B2
• Time in Patent Office: Days
• US Class Current: 1/1
• CPC Class Codes: H01F 17/0013 with stacked layers
• CPC Class Codes: H01F 17/04 with magnetic core
• CPC Class Codes: H01F 2017/048 with encapsulating core, e.g. made of resin and magnetic powder
• CPC Class Codes: H01F 41/046 structurally combined with ferromagnetic material
• CPC Class Codes: Y10T 29/49078 Laminated

Abstract

A method of manufacturing an electronic component having high inductance (L) and an excellent quality (Q) factor and direct current (DC)-bias characteristics includes forming a magnetic body in which internal coil parts are embedded, and forming a cover part including a magnetic metal plate on at least one of upper and lower portions of the magnetic body.

Claims

1. A method of manufacturing an electronic component, comprising:

forming a magnetic body in which internal coil parts are embedded; and

forming a cover part including a magnetic metal plate on at least one of upper and lower portions of the magnetic body.

2. The method of claim 1, further comprising:

pulverizing the magnetic metal plate to have a plurality of metal fragments.

3. The method of claim 2, wherein the pulverizing of the magnetic metal plate to have the plurality of metal fragments comprises:

stacking thermosetting resin layers on at least one of upper and lower portions of the magnetic metal plate to form a laminate; and

pulverizing the magnetic metal plate into the plurality of metal fragments by compressing the laminate.

4. The method of claim 3, wherein a thermosetting resin of the thermosetting resin layer fills a space between adjacent metal fragments of the pulverized magnetic metal plate.

5. The method of claim 2, wherein the magnetic metal plate is pulverized such that adjacent metal fragments have shapes corresponding to each other.

6. The method of claim 2, wherein the magnetic metal plate is pulverized such that the metal fragments have regular shapes.

7. The method of claim 2, wherein the magnetic metal plate is pulverized such that the metal fragments have atypical shapes.

8. The method of claim 2, wherein an area of an upper surface or a lower surface of the metal fragment ranges from 20 μ

m² to 5,000 μ

m².

9. The method of claim 1, wherein the cover part comprises a plurality of stacked magnetic metal plates.

10. The method of claim 9, wherein the cover part comprises the magnetic metal plates and thermosetting resin layers which are alternately stacked.

11. The method of claim 10, wherein a thickness of each thermosetting resin layer is 1.0 to 2.5 times a thickness of each magnetic metal plate.

12. The method of claim 10, wherein a thickness of each thermosetting resin layer is 1.5 to 2.0 times a thickness of each magnetic metal.

13. The method of claim 1, wherein a thickness of the magnetic metal plate ranges from 5 μ

m to 50 μ

m.

14. The method of claim 1, wherein a thickness of the cover part ranges from 10% to 30% of a thickness of the magnetic body.

15. The method of claim 1, wherein a surface roughness of the cover part including the magnetic metal plate is equal to or less than 0.5 μ

m.

16. The method of claim 1, wherein a permeability of the magnetic metal plate is about two to ten times greater than that of magnetic metal powder particles dispersed in the magnetic body.

17. A method of manufacturing an electronic component, comprising:

stacking a magnetic metal plate and thermosetting resin layers on at least one of upper and lower portions of the magnetic metal plate to form a laminate;

compressing the laminate to pulverize the magnetic metal plate into a plurality of metal fragments; and

forming the laminate in which the magnetic metal plate is pulverized, on at least one of upper and lower portions of a magnetic body in which internal coil parts are embedded.

18. The method of claim 17, wherein in the compressing of the laminate, a thermosetting resin of the thermosetting resin layers fills a space between adjacent metal fragments.

19. The method of claim 17, wherein the compressing of the laminate comprises:

forming the laminate on a support film and forming a cover film on the laminate; and

compressing the support film and the cover film against each other so as to pulverize the magnetic metal plate interposed therebetween.

20. The method of claim 17, wherein the magnetic metal plate is pulverized such that adjacent metal fragments have shapes corresponding to each other.

21. A method of manufacturing an electronic component, comprising:

forming a magnetic body embedded with internal coil parts; and

forming a cover part including a pulverized magnetic metal plate on at least one of upper and lower portions of the magnetic body.

22. The method of claim 21, wherein the cover part further includes thermosetting resin layers surrounding the pulverized magnetic metal plate.

23. The method of claim 22, wherein a thermosetting resin of the thermosetting resin layer fills a space between adjacent metal fragments of the pulverized magnetic metal plate.

24. The method of claim 22, wherein the forming of the cover part including the pulverized magnetic metal plate comprises:

stacking the thermosetting resin layers on opposite surfaces of a non-pulverized magnetic metal plate to form a laminate;

pulverizing the non-pulverized magnetic metal plate into the plurality of metal fragments by compressing the laminate; and

disposing the compressed laminate on at least one of upper and lower portions of the magnetic body to form the cover part.

25. The method of claim 24, wherein the pulverizing of the non-pulverized magnetic metal plate comprises:

forming the laminate on a support film and forming a cover film on the laminate;

compressing the support film and the cover film against each other so as to pulverize the laminate interposed therebetween; and

removing the support film and the cover film from the laminate.

26. The method of claim 24, wherein the non-pulverized magnetic metal plate is formed of crystalline metal or amorphous metal including at least one selected from the group consisting of iron (Fe), silicon (Si), boron (B), chromium (Cr), aluminum (Al), copper (Cu), niobium (Nb), and nickel (Ni).

27. The method of claim 22, wherein the forming of the cover part including the pulverized magnetic metal plate comprises:

stacking the thermosetting resin layers on opposite surfaces of a non-pulverized magnetic metal plate to form a laminate on at least one of the upper and lower portions of the magnetic body; and

pulverizing the non-pulverized magnetic metal plate into the plurality of metal fragments by compressing the laminate so as to convert the laminate to the cover part.