THIN CAPPING FOR MEMS DEVICES
1 Assignment
0 Petitions
Accused Products
Abstract
A device includes a base substrate (700) with a micro component (702) attached thereto. Suitably it is provided with routing elements (704) for conducting signals to and from the component (702). It also includes spacer members (706) which also can act as conducting structures for routing signals vertically. There is a capping structure (708) of a glass material, provided above the base substrate (700), bonded via the spacer members (706), preferably by eutectic bonding, wherein the capping structure (708) includes vias (710) including metal for providing electrical connection through the capping structure. The vias can be made by a stamping/pressing method entailing pressing needles under heating to soften the glass and applying pressure, to a predetermined depth in the glass. However, other methods are possible, e-g- drilling, etching, blasting.
4 Citations
37 Claims
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1-19. -19. (canceled)
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20. A method of making a micro-device with a capping structure, comprising:
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providing a base substrate on which there is a micro-electronic and/or micro-mechanic component attached or integrated; providing a cap substrate of a glass material, i.e. a non-crystalline or amorphous material and that exhibits a glass transition when heated towards the liquid state, preferably a material selected from borofloat glasses, quartz, metallic alloys, AlOx, and polymers; making micro-depressions in said cap substrate to a predetermined depth; metallizing only the walls of the depressions in the cap substrate; providing electrical connection through the cap substrate; bonding together the base substrate and the cap substrate, such that there is an electrical contact between the component on the base substrate and the metallized depressions in the cap substrate. - View Dependent Claims (21, 22, 23, 24, 25, 26, 27, 28, 29, 30, 31)
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32. A device comprising a base substrate (200;
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300;
400;
500;
600;
700) with a micro component (14;
312;
702;
802) attached thereto;
routing elements (704) for conducting signals to and from said component (14;
312;
702;
802);
spacer members (706) which also can act as conducting structures for routing signals vertically;
a capping structure (708) of a glass material, provided above the base substrate (700), bonded via said spacer members (19;
706), preferably by eutectic bonding, wherein the capping structure (708) comprises vias (22;
306, 308;
710) comprising metal only on the walls thereof for providing electrical connection through said capping structure, wherein the component (14;
312;
702;
802) comprises a free-hanging or protruding element, or a membrane, i.e. a movable element (16), said component being selected from the group consisting of a RF switch, a resonator and a pressure sensing element. - View Dependent Claims (33, 34, 35, 36, 37)
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300;
Specification