HIGH PERFORMANCE TWO-PHASE COOLING APPARATUS

  • US 20160216042A1
  • Filed: 01/19/2016
  • Published: 07/28/2016
  • Est. Priority Date: 01/22/2015
  • Status: Active Grant
First Claim
Patent Images

1. A thermal ground plane, comprising:

  • a metal substrate comprising a plurality of microstructures, forming a wicking structure ;

    a vapor cavity, in communication with the plurality of microstructures;

    at least one intermediate substrate shaped to increase the effective aspect ratio of the wicking structure in at least one region of the wicking structure; and

    a fluid contained within the thermal ground plane for transporting thermal energy from at least one region of the thermal ground plane to another region of the thermal ground plane, wherein the fluid is driven by capillary forces.

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