Method and Device for Printing on Heated Substrates

• US 20160229209A1
• Filed: 04/18/2016
• Published: 08/11/2016
• Est. Priority Date: 05/18/2009
• Status: Active Grant

• Current Assignee: XJet Ltd.
• Original Assignee: XJet Ltd.
• Inventors: Kritchman, Eliahu M., ROZVAL, Yigal, DEBI, Meir, GOTHAIT, Hanan
• Granted Patent: US 10,232,655 B2
• Time in Patent Office: Days
• US Class Current: 1/1
• CPC Class Codes: B05C 11/10 Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material B05C1/0813, B05C5/0225, B05C17/002 and B05C19/06 take precedence
• CPC Class Codes: B41J 2/015 characterised by the jet generation process B41J2/215 takes precedence
• CPC Class Codes: B41J 2/14 Structure thereof only for on-demand ink jet heads
• CPC Class Codes: B41J 2202/08 dealing with thermal variations, e.g. cooling
• CPC Class Codes: B41J 29/377 Cooling or ventilating arrangements

Abstract

A printing device for dispending material on a heated substrate is provided. The device may include a printing head having one or more nozzles and a heat shield that partially masks a side of the printing head that faces the heated substrate when printing so as to reduce heat transfer from the substrate to the printing head. The shield includes a slot aligned with the one or more nozzles to enable passage of material from the one or more nozzles to the heated substrate.

Claims

1-14. -14. (canceled)

15. A printing device for depositing material on a heated substrate, the device comprising:

a substrate surface;

at least one print head spaced from the substrate surface and including a plurality of nozzles configured to print metallic material;

a heat shield including a shield plate and a shield frame for maintaining the shield plate at a fixed position between the substrate surface and the at least one print head; and

one or more coolant ducts positioned within the heat shield for flowing coolant fluid, wherein the coolant fluid is circulated to a reservoir for conveying heat away from the heat shield and preventing heat from the heated substrate from overheating the at least one print head.

16. The printing device of claim 15, wherein the heated surface is configured to be heated to a temperature of about 100-300°

C.

17. The printing device of claim 15, wherein the one or more coolant ducts are engraved within the shield frame.

18. The printing device of claim 15, wherein the one or more coolant ducts surround the at least one print head.

19. The printing device of claim 15, wherein the one or more coolant ducts includes a plurality of coolant ducts independent from each other.

20. The printing device of claim 15, wherein the one or more coolant ducts includes a plurality of coolant ducts coupled to each other.

21. The printing device of claim 15, wherein the shield frame provides thermal mass to form a heat sink for conducting heat away from the shield plate.

22. The printing device of claim 15, wherein a thickness of the shield plate is between 0.2 to 0.5 mm.

23. The printing device of claim 15, wherein an outward surface of the shield plate is reflective to thermal infrared radiation.

24. The printing device of claim 15, wherein an inward surface of the shield plate facing the at least one print head is coated with a non-wetting coating.

25. The printing device of claim 15, further including an air duct configured to induce movement of air between the heat shield and the at least one print head.

26. The printing device of claim 15, further including an air suction unit coupled to an air opening in a side of the heat shield that faces the heated substrate when printing.

27. The printing device of claim 15, wherein the shield plate being distinct from the at least one print head and including a plurality of slots, wherein each slot is configured for alignment with at least one nozzle, and the plurality of slots being arranged in the shield plate to enable metal from the at least one nozzle to pass through a corresponding slot for deposition atop the heated substrate.

28. A method for depositing material on a heated substrate, the method comprising:

providing a heat shield located at a fixed position between a substrate and at least one print head including a plurality of nozzles configured to print metallic material;

heating the substrate; and

circulating coolant fluid, through one or more coolant ducts positioned within the heat shield, to a reservoir for conveying heat away from the heat shield and preventing heat from the heated substrate from overheating the at least one print head.

29. The method of claim 29, further comprising:

heating the substrate to a temperature of about 100-300°

C.

30. The method of claim 29, wherein the one or more coolant ducts are engraved within the shield frame.

31. The method of claim 29, wherein the one or more coolant ducts surround the heat shield.

32. The method of claim 29, wherein the one or more coolant ducts includes a plurality of coolant ducts independent from each other.

33. The method of claim 29, wherein the one or more coolant ducts includes a plurality of coolant ducts coupled to each other.