ENHANCED CHANNEL MOBILITY THREE-DIMENSIONAL MEMORY STRUCTURE AND METHOD OF MAKING THEREOF
First Claim
1. A method of manufacturing a monolithic three-dimensional memory device, comprising:
- forming a stack including an alternating plurality of first material layers and second material layers over a substrate;
forming an opening that vertically extends through the stack;
forming a semiconductor channel comprising an amorphous or polycrystalline semiconductor material over a sidewall of the opening, wherein the semiconductor channel extends through the stack; and
diffusing a metallic material through at least a portion of the semiconductor channel, wherein the metallic material induces crystallization of the amorphous or polycrystalline semiconductor material in the semiconductor channel into a crystalline semiconductor material portion.
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Accused Products
Abstract
A stack including an alternating plurality of first material layers and second material layers is provided. A memory opening is formed and at least a contiguous semiconductor material portion including a semiconductor channel is formed therein. The contiguous semiconductor material portion includes an amorphous or polycrystalline semiconductor material. A metallic material portion is provided at a bottom surface of the semiconductor channel, at a top surface of the semiconductor channel, or on portions of an outer sidewall surface of the semiconductor channel. An anneal is performed to induce diffusion of a metal from the metallic material portion through the semiconductor channel, thereby inducing conversion of the amorphous or polycrystalline semiconductor material into a crystalline semiconductor material. The crystalline semiconductor material has a relatively large grain size due to the catalytic crystallization process, and can provide enhanced charge carrier mobility.
13 Citations
41 Claims
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1. A method of manufacturing a monolithic three-dimensional memory device, comprising:
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forming a stack including an alternating plurality of first material layers and second material layers over a substrate; forming an opening that vertically extends through the stack; forming a semiconductor channel comprising an amorphous or polycrystalline semiconductor material over a sidewall of the opening, wherein the semiconductor channel extends through the stack; and diffusing a metallic material through at least a portion of the semiconductor channel, wherein the metallic material induces crystallization of the amorphous or polycrystalline semiconductor material in the semiconductor channel into a crystalline semiconductor material portion. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25, 26, 27, 28, 29, 30)
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31. A three-dimensional memory device, comprising:
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a stack including an alternating plurality of insulator layers and electrically conductive layers and located over a top surface of a substrate; an opening extending through the stack; a memory film located in the opening; a contiguous semiconductor material portion located over the memory film in the opening and comprising a semiconductor channel that includes a portion that extends substantially perpendicular to the top surface of the substrate; and a metal semiconductor alloy region in contact with a bottom surface of the contiguous semiconductor material portion. - View Dependent Claims (32, 33, 34, 35, 36, 37, 38, 39, 40, 41)
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Specification