CONDUCTIVE PATTERN FORMATION METHOD, CONDUCTIVE PATTERN-BEARING SUBSTRATE, AND TOUCH PANEL SENSOR

• US 20160246394A1
• Filed: 05/03/2016
• Published: 08/25/2016
• Est. Priority Date: 10/03/2011
• Status: Active Grant

• Current Assignee: Resonac Corp. (Resonac Holdings Corp.)
• Original Assignee: Hitachi Chemical Company Limited (Resonac Holdings Corp.)
• Inventors: Yamazaki, Hiroshi, Igarashi, Yoshimi
• Granted Patent: US 9,817,499 B2
• Time in Patent Office: Days
• US Class Current: 1/1
• CPC Class Codes: G03F 7/0005 Production of optical devices or components in so far as characterised by the lithographic processes or materials used therefor
• CPC Class Codes: G03F 7/027 Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds G03F7/075 takes precedence
• CPC Class Codes: G03F 7/09 characterised by structural details, e.g. supports, auxiliary layers supports for printing plates in general B41N
• CPC Class Codes: G03F 7/092 characterised by backside coating or layers, by lubricating-slip layers or means, by oxygen barrier layers or by stripping-release layers or means
• CPC Class Codes: G03F 7/095 having more than one photosensitive layer G03F7/075 takes precedence
• CPC Class Codes: G03F 7/0952 comprising silver halide or silver salt based image forming systems, e.g. for camera speed exposure
• CPC Class Codes: G03F 7/0955 one of the photosensitive systems comprising a non-macromolecular photopolymerisable compound having carbon-to-carbon double bonds, e.g. ethylenic compounds
• CPC Class Codes: G03F 7/2022 Multi-step exposure, e.g. hybrid; backside exposure; blanket exposure, e.g. for image reversal; edge exposure, e.g. for edge bead removal; corrective exposure
• CPC Class Codes: G06F 2203/04112 Electrode mesh in capacitive digitiser: electrode for touch sensing is formed of a mesh of very fine, normally metallic, interconnected lines that are almost invisible to see. This provides a quite large but transparent electrode surface, without need for ITO or similar transparent conductive material
• CPC Class Codes: G06F 3/041 Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
• CPC Class Codes: G06F 3/0445 using two or more layers of sensing electrodes, e.g. using two layers of electrodes separated by a dielectric layer
• CPC Class Codes: G06F 3/0446 using a grid-like structure of electrodes in at least two directions, e.g. using row and column electrodes
• CPC Class Codes: H05K 1/0274 Optical details, e.g. printed circuits comprising integral optical means H05K1/0269 takes precedence; coupling light guides with opto-electronic components G02B6/42
• CPC Class Codes: H05K 1/0313 Organic insulating material
• CPC Class Codes: H05K 1/036 Multilayers with layers of different types
• CPC Class Codes: H05K 1/09 Use of materials for the conductive, e.g. metallic pattern
• CPC Class Codes: H05K 2201/0275 Fibers and reinforcement materials
• CPC Class Codes: H05K 3/06 the conductive material being removed chemically or electrolytically, e.g. by photo-etch process semi-additive methods H05K3/108
• CPC Class Codes: Y10T 428/24802 Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]

Abstract

A conductive pattern formation method of the present invention includes a first exposure step of radiating active light in a patterned manner to a photosensitive layer including a photosensitive resin layer provided on a substrate and a conductive film provided on a surface of the photosensitive resin layer on a side opposite to the substrate; a second exposure step of radiating active light, in the presence of oxygen, to some or all of the portions of the photosensitive layer not exposed at least in the first exposure step; and a development step of developing the photosensitive layer to form a conductive pattern following the second exposure step.

Claims

1. A conductive film substrate comprising:

a. a substrate; and

b. a cured resin layer on the substrate, the cured resin layer comprising a first surface opposite the substrate, the first surface having a portion including a conductive film and a portion without a conductive film,

wherein the conductive film comprises at least one of an organic conductive material and conductive fiber.

2. The conductive film substrate according to claim 1, wherein the step difference Ha between the portion including the conductive film and the portion without the conductive film is 1 μ

m or less.

3. The conductive film substrate according to claim 1, wherein the step difference Ha between the portion including the conductive film and the portion without the conductive film is 0.7 μ

m or less.

4. The conductive film substrate according to claim 1, wherein the step difference Ha between the portion including the conductive film and the portion without the conductive film is 0.5 μ

m or less.

5. The conductive film substrate according to claim 1, wherein the conductive film comprises conductive fiber.

6. The conductive film substrate according to claim 1, wherein the conductive film comprises silver fiber.

7. A conductive film substrate comprising:

a. a substrate; and

b. a cured resin layer on the substrate, the cured resin layer comprising a first surface opposite the substrate, the first surface having a portion including a conductive film and a portion without a conductive film,

wherein a minimum optical transmittance of the conductive film substrate in a wavelength band of 450 to 650 nm is 80% or higher.

8. The conductive film substrate according to claim 7, wherein the step difference Ha between the portion including the conductive film and the portion without the conductive film is 1 μ

m or less.

9. The conductive film substrate according to claim 7, wherein the step difference Ha between the portion including the conductive film and the portion without the conductive film is 0.7 μ

m or less.

10. The conductive film substrate according to claim 7, wherein the step difference Ha between the portion including the conductive film and the portion without the conductive film is 0.5 μ

m or less.

11. The conductive film substrate according to claim 7, wherein the conductive film comprises conductive fiber.

12. The conductive film substrate according to claim 7, wherein the conductive film comprises silver fiber.