WIRING BOARD, FLEXIBLE DISPLAY PANEL AND DISPLAY DEVICE

• US 20160255719A1
• Filed: 12/03/2014
• Published: 09/01/2016
• Est. Priority Date: 07/17/2014
• Status: Active Grant

• Current Assignee: BOE Technology Group Co., Ltd.
• Original Assignee: BOE Technology Group Co., Ltd.
• Inventors: SONG, Song, NAGAYAMA, Kazuyoshi
• Granted Patent: US 9,795,031 B2
• Time in Patent Office: Days
• US Class Current: 1/1
• CPC Class Codes: G02F 1/13452 Conductors connecting driver circuitry and terminals of panels
• CPC Class Codes: H05K 1/0248 Skew reduction or using delay lines
• CPC Class Codes: H05K 1/0296 Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295 H05K1/11 takes precedence; lay-out adapted to mounted component configuration H05K1/18
• CPC Class Codes: H05K 1/0393 Flexible materials H05K1/038 takes precedence; specific organic compositions are classified in H05K1/0313 and subgroups
• CPC Class Codes: H05K 1/09 Use of materials for the conductive, e.g. metallic pattern
• CPC Class Codes: H05K 1/115 Via connections; Lands around holes or via connections H05K1/112 takes precedence
• CPC Class Codes: H05K 2201/0391 Using different types of conductors
• CPC Class Codes: H05K 2201/09227 Layout details of a plurality of traces, e.g. escape layout for Ball Grid Array [BGA] mounting
• CPC Class Codes: H05K 2201/09245 Crossing layout alternating conductors H05K2201/097
• CPC Class Codes: H05K 2201/09263 Meander
• CPC Class Codes: H05K 2201/09272 Layout details of angles or corners
• CPC Class Codes: H05K 2201/10128 Display
• CPC Class Codes: H05K 2201/10136 Liquid Crystal display [LCD]
• CPC Class Codes: H05K 3/06 the conductive material being removed chemically or electrolytically, e.g. by photo-etch process semi-additive methods H05K3/108

Abstract

The present disclosure discloses a wiring board used to connect a driving chip and a display panel, a flexible display panel and a display device. Signal output ends on the driving chip and signal input ends on the display panel may be arranged in pairs; and the wiring board may include fanout lines each of which is configured to connect a pair of signal output end and the signal input end. The wiring board may include a substrate; a plurality of segments of first connection lines having first resistivity is arranged on a first surface of the substrate; a plurality of segments of second connection lines having second resistivity is arranged on a second surface of the substrate opposite to the first surface. At least parts of the fanout lines are formed by connecting the first connection lines and the second connection lines.

Claims

1. A wiring board which is used to connect a driving chip and a display panel, wherein signal output ends on the driving chip and signal input ends on the display panel are arranged in pairs;

and the wiring board comprises fanout lines each of which is configured to connect a pair of the signal output end and the signal input end,

wherein the wiring board comprises a substrate;

a plurality of segments of first connection lines having first resistivity is arranged on a first surface of the substrate;

a plurality of segments of second connection lines having second resistivity is arranged on a second surface of the substrate opposite to the first surface; and

at least parts of the fanout lines are formed by connecting the first connection lines and the second connection lines.

2. The wiring board according to claim 1, wherein a predetermined angle is formed between at least parts of adjacent segments of the connection lines of the fanout lines.

3. The wiring board according to claim 2, wherein the predetermined angle ranges from 30 degrees to 150 degrees.

4. The wiring board according to claim 2, wherein the first connection lines and/or the second connection lines of the fanout lines are arranged at a certain angle with respect to electrode lines within the display panel.

5. The wiring board according to claim 1, wherein the first connection lines and the second connection lines of the fanout lines are connected via a via-hole.

6. The wiring board according to claim 1, wherein connection lines of a plurality of the fanout lines at least partially overlap each other at an identical location on the substrate.

7. The wiring board according to claim 1, wherein the first connection lines are each made of a material having the first resistivity;

and the second connection lines are each made of a material having the second resistivity other than the first resistivity.

8. The wiring board according to claim 7, wherein the first connection lines are copper lines;

and the second connection lines are iron lines.

9. The wiring board according to claim 1, wherein the substrate is made of a flexible material.

10. The wiring board according to claim 9, wherein the flexible material is resin or plastics.

11. The wiring board according to claim 1, wherein the plurality of segments of the connection lines of the fanout lines is formed from a conductive film layer by an etching process.

12. A flexible display panel, comprising the wiring board according to claim 1.

13. A display device, comprising the flexible display panel according to claim 12.

14. The wiring board according to claim 2, wherein the substrate is made of a flexible material.

15. The wiring board according to claim 3, wherein the substrate is made of a flexible material.

16. The wiring board according to claim 4, wherein the substrate is made of a flexible material.

17. The wiring board according to claim 5, wherein the substrate is made of a flexible material.

18. The wiring board according to claim 6, wherein the substrate is made of a flexible material.

19. The wiring board according to claim 7, wherein the substrate is made of a flexible material.

20. The wiring board according to claim 8, wherein the substrate is made of a flexible material.