HIGH CURRENT, LOW EQUIVALENT SERIES RESISTANCE PRINTED CIRCUIT BOARD COIL FOR POWER TRANSFER APPLICATION

• US 20160276095A1
• Filed: 05/30/2016
• Published: 09/22/2016
• Est. Priority Date: 02/20/2012
• Status: Active Grant

• Current Assignee: Futurewei Technologies Incorporated (Huawei Investment & Holding Co., Ltd.)
• Original Assignee: Futurewei Technologies Incorporated (Huawei Investment & Holding Co., Ltd.)
• Inventors: ZABACO, Jorge
• Granted Patent: US 9,837,201 B2
• Time in Patent Office: Days
• US Class Current: 1/1
• CPC Class Codes: H01F 17/0013 with stacked layers
• CPC Class Codes: H01F 2017/002 Details of via holes for interconnecting the layers
• CPC Class Codes: H01F 2027/2809 on stacked layers
• CPC Class Codes: H01F 27/2804 Printed windings
• CPC Class Codes: H01F 38/14 Inductive couplings for wireless supply or distribution of electric power using inductive coupling H02J50/10
• CPC Class Codes: H01F 41/041 Printed circuit coils apparatus or processes for manufacturing printed circuits in general H05K3/00
• CPC Class Codes: H02J 50/12 of the resonant type
• CPC Class Codes: H04B 5/79 for data transfer in combination with power transfer
• CPC Class Codes: Y10T 29/4902 Electromagnet, transformer or inductor

Abstract

An apparatus for a multilayer printed circuit board (PCB) coil, comprising: a first coil layer of a PCB; a plurality of vias coupled to and distributed to cover substantially the surface of the first coil layer within the PCB; and a second coil layer of the PCB and coupled to the vias to cover substantially the surface of the second coil layer, wherein the vias are positioned between the first coil layer and the second coil layer and enable substantially high current and low equivalent series resistance (ESR) for the multilayer PCB coil.

Claims

1. An apparatus for charging, comprising:

a layered structure of electric conductors on a printed circuit board (PCB), the layered structure positioned around a center core, the electric conductors winding around the center core for inductive coupling, wherein the layered structure comprises;

a first layer of the electric conductors around the center core, the first layer of the electric conductors form an electrically conductive trace comprising a plurality of loops around the center core;

a second layer of the electric conductors around the center core substantially overlaid with the first layer of the electric conductors on the PCB; and

a plurality of vias disposed between the first layer and the second layer, the vias conductively coupling the first layer of the electric conductors and the second layer of the electric conductors, wherein the plurality of the vias include a first via and a second via distributed separately along a length of the trace to electrically connect the trace of the first layer and the second layer of the conductors.

2. The apparatus of claim 1, wherein the trace is surrounded by one or more non-conductive materials.

3. The apparatus of claim 1, wherein the trace, the second layer and the vias have a common type of material.

4. The apparatus of claim 1 further comprising one or more other circuit components integrated with the first layer and the second layer on the PCB.

5. The apparatus of claim 1, wherein the apparatus is a component used in a wireless charging device.

6. The apparatus of claim 1, wherein the apparatus is a component used in a near-field transmission device.

7. The apparatus of claim 1, wherein the vias have a cylindrical shape and are vertical with respect to the first layer and the second layer.

8. The apparatus of claim 1, wherein at least some of the vias have different sizes that affect current flow and series resistance in the layered structure.