REFLECTIVE SENSING MODULE

• US 20160296117A1
• Filed: 03/18/2016
• Published: 10/13/2016
• Est. Priority Date: 04/09/2015
• Status: Active Grant

• Current Assignee: Dyi-Chung Hu
• Original Assignee: Dyi-Chung Hu
• Inventors: HU, Dyi-Chung
• Granted Patent: US 9,737,215 B2
• Time in Patent Office: Days
• US Class Current: 1/1
• CPC Class Codes: A61B 2562/0238 Optical sensor arrangements for performing transmission measurements on body tissue
• CPC Class Codes: A61B 2562/12 Manufacturing methods specially adapted for producing sensors for in-vivo measurements
• CPC Class Codes: A61B 2562/164 the sensor is mounted in or on a conformable substrate or carrier
• CPC Class Codes: A61B 5/0059 using light, e.g. diagnosis by transillumination, diascopy, fluorescence A61B5/0093, A61B5/1455, A61B5/02416 and A61B5/0261 take precedence
• CPC Class Codes: A61B 5/02427 Details of sensor
• CPC Class Codes: A61B 5/02433 for infrared radiation
• CPC Class Codes: A61B 5/6824 Arm or wrist
• CPC Class Codes: A61B 5/6831 Straps, bands or harnesses

Abstract

A reflective sensing module is disclosed which can be embedded in a wristband for sensing a health information of a person wearing it. The health information can be wireless transmitted directly or indirectly to the internet for a further process. The reflective sensing module comprises a top glass, a bottom circuitry configured on a bottom surface of the top glass, a light chip and a sensor chip are electrically coupled with the bottom circuitry of the top glass; wherein the light chip emits light beams upwards passing through the top glass to an object; the sensor chip detects reflective light beams downwards passing through the top glass for a further process.

Claims

1. A reflective sensing module, comprises:

a top cover;

a bottom circuitry configured on a bottom surface of the top cover;

a light chip electrically coupled to the bottom circuitry of the top cover; and

a sensor chip electrically coupled to the bottom circuitry of the top cover;

wherein

the light chip is able to emit light beams upwards passing through the top cover to an object;

the sensor chip is able to detect reflective light beams downwards passing through the top cover for a further processing.

2. A reflective sensing module as claimed in claim 1, further comprises:

a molding compound enclosing the light chip and the sensor chip;

a bottom circuitry configured on a bottom surface of the molding compound;

a plurality of via metal passing through the molding compound, electrically coupled the bottom circuitry of the top cover with the bottom circuitry of the molding compound.

3. A reflective sensing module as claimed in claim 2, further comprises:

a redistribution circuit configured on bottom of the bottom circuitry of the molding compound,

a plurality of bottom pad configured on bottom of the redistribution circuitry; and

a plurality of solder balls, each configured on one corresponding bottom pad.

4. A reflective sensing module as claimed in claim 1, further comprises:

a molding compound enclosing the light chip and the sensor chip; and

exposing a bottom surface of the light chip and the sensor chip;

a plurality of bottom pad configured on bottom of the molding compound; and

a plurality of solder balls, each configured on one corresponding bottom pad.

5. A reflective sensing module as claimed in claim 1, further comprises:

a first Fresnel lens configured on top of the light chip; and

a second Fresnel lens configure on top of the sensor chip.

6. A wristband comprising:

a reflective sensing module as claimed in claim 5;

a flexible circuit board electrically coupled to reflective sensing module;

a control chip electrically coupled to the flexible circuit board; and

a flexible molding compound enclosing the reflective sensing module and the control chip.