COMPOSITION FOR PACKAGING ELECTRONIC DEVICE, PACKAGING METHOD, AND OLED DISPLAY APPARATUS

• US 20160296907A1
• Filed: 10/17/2014
• Published: 10/13/2016
• Est. Priority Date: 07/14/2014
• Status: Active Grant

• Current Assignee: BOE Technology Group Co., Ltd.
• Original Assignee: BOE Technology Group Co., Ltd.
• Inventors: HONG, Rui, WANG, Dan, FUJINO, Seiji
• Granted Patent: US 9,789,466 B2
• Time in Patent Office: Days
• US Class Current: 1/1
• CPC Class Codes: B01J 20/06 comprising oxides or hydroxides of metals not provided for in group B01J20/04
• CPC Class Codes: B01J 20/10 comprising silica or silicate
• CPC Class Codes: B01J 20/165 Natural alumino-silicates, e.g. zeolites
• CPC Class Codes: C03C 2205/00 Compositions applicable for the manufacture of vitreous enamels or glazes
• CPC Class Codes: C03C 3/21 containing titanium, zirconium, vanadium, tungsten or molybdenum
• CPC Class Codes: C03C 8/08 containing phosphorus
• CPC Class Codes: C03C 8/24 Fusion seal compositions being frit compositions having non-frit additions, i.e. for use as seals between dissimilar materials, e.g. glass and metal; Glass solders
• CPC Class Codes: H10K 50/8426 Peripheral sealing arrangements, e.g. adhesives, sealants
• CPC Class Codes: H10K 50/846 comprising getter material or desiccants
• CPC Class Codes: H10K 71/00 Manufacture or treatment specially adapted for the organic devices covered by this subclass

Abstract

A composition for packaging an electronic device comprises a matrix and an adsorption material having a water vapor adsorption capability, and the adsorption material includes attapulgite and/or zeolite. By adding attapulgite and/or zeolite which have an adsorption effect to modify the formulation of the frit, the compositions for packaging an electronic device can effectively reduce the influence of water vapor on the electronic device, thereby effectively extending the lifetime of the packaged electronic device.

Claims

1. A composition for packaging an electronic device, comprising a matrix and an adsorption material having a water vapor adsorption capability, wherein, the adsorption material comprises attapulgite and/or zeolite.

2. The composition for packaging the electronic device according to claim 1, wherein, the attapulgite has a molecular formula of

(MgCaFe)₅Si₈O₂₀(OH)₂(OH₂)₄.4H₂O.

3. The composition for packaging the electronic device according to claim 1, wherein, the zeolite has a general molecular formula of A[(AlO₂)x(SiO₂)y]·

nH₂O,

wherein, A is K⁺, Ca⁺, Na⁺ or Ba⁺;

y/x is a value of 1-5;

n is a number of water molecules and is a positive integer not larger than 4.

4. The composition for packaging the electronic device according to claim 1, wherein, a molar percent content of the attapulgite is 5 to 15%, and/or that of the zeolite is 4 to 10%.

5. The composition or packaging the electronic device according to claim 1, wherein, a total molar percent content of the attapulgite and the zeolite is 11-20%.

6. The composition for packaging the electronic device according to claim 1, wherein, the matrix comprises at least one of V₂O₅, P₂O₅, TeO₂ and any combination thereof.

7. The composition for packaging the electronic device according to claim 6, wherein, a molar percent content of V₂O₅ is 45-52%, a molar percent content of P₂O₅ is 20-32%, and a molar percent content of TeO₂ is 5-9%.

8. The composition for packaging the electronic device according to claim 6, wherein, the matrix further comprises at least one selected from a group consisting of Al₂O₃, SnO, SnO₂, SiO₂, WO₃, ZrO, TiO, CuO, MoO₃, and ceramic material.

9. The composition for packaging the electronic device according to claim 8, wherein, a total molar percent content of the at least one selected from a group consisting of Al₂O₃, SnO, SnO₂, SiO₂, WO₃, ZrO, TiO, CuO, MoO₃, and ceramic material is 2-4%.

10. An OLED display apparatus, comprising a packaging substrate and a base substrate, wherein, the base substrate is provided with an OLED display device thereon, the packaging substrate and the base substrate are bonded and sealed by the composition for packaging the electronic device according to claim 1.

11. A method for packaging an electronic device, comprising packaging the electronic device with a composition for packaging the electronic device comprising an adsorption material having a water vapor adsorption capability, wherein, the adsorption material comprises attapulgite and/or zeolite.

12. The method for packaging the electronic device according to claim 11, comprising the following steps:

S1);

formulating attapulgite and/or zeolite, a matrix and a solvent to form a viscous paste, the solvent being organic matter, the matrix and attapulgite and/or zeolite being inorganic matter;

S2);

coating the paste on an edge region of a packaging substrate to generate a packaging pattern;

S3);

drying the packaging substrate from S2) to remove the organic matter from the paste to obtain the remaining inorganic matter;

S4);

assembling the packaging substrate from S3) with the base substrate provided with the electronic device; and

S5);

sintering the inorganic matter to form a packaging film which bonds and seals the packaging substrate and the base substrate.

13. The method for packaging the electronic device according to claim 12, wherein, in S1), the attapulgite and/or zeolite have the following particle size:

D₁₀;

0.8±

0.2 μ

m;

D₅₀;

1.6±

0.5 μ

m;

D₉₀;

3.3±

1 μ

m or D_max;

8.0±

1 μ

m.

14. The method for packaging the electronic device according to claim 12, wherein, the matrix comprises at least one of V₂O₅, P₂O₅, TeO₂ and any combination thereof.

15. The method for packaging the electronic device according to claim 12, wherein, the solvent comprises ethyl cellulose, methyl cellulose, nitrocellulose, hydroxymethyl cellulose, acrylate, methacrylate or epoxy resin.

16. The method for packaging the electronic device according to claim 12, wherein, the paste has a viscosity of 20-160 Pa·

s.

17. The method for packaging the electronic device according to claim 12, wherein, in S3), the packaging substrate is dried at a temperature in a range of 400 to 500°

C. for 20-40 min.

18. The method for packaging the electronic device according to claim 12, wherein, in S5), the inorganic matter is molten by laser heating, and then cooled and cured to finish the sintering.

19. The method for packaging the electronic device according to claim 18, wherein, the laser has a power of 5 to 40 W and a speed of 5 to 30 mm/s.

20. The method for packaging the electronic device according to claim 12, wherein, the packaging film formed by the inorganic matter has a thickness of 4 to 10 μ

m.