DYNAMIC TRANSACTION CARD WITH EMV INTERFACE AND METHOD OF MANUFACTURING

• US 20160307081A1
• Filed: 04/14/2016
• Published: 10/20/2016
• Est. Priority Date: 04/14/2015
• Status: Active Grant

• Current Assignee: Capital One Services LLC (Capital One Financial Corporation)
• Original Assignee: Capital One Services LLC (Capital One Financial Corporation)
• Inventors: WURMFELD, David, LOCKE, Tyler, KOEPPEL, Adam
• Granted Patent: US 9,990,795 B2
• Time in Patent Office: Days
• US Class Current: 1/1
• CPC Class Codes: G06K 19/0772 Physical layout of the record carrier
• CPC Class Codes: G06Q 20/341 Active cards, i.e. cards including their own processing means, e.g. including an IC or chip
• CPC Class Codes: G07F 7/10 together with a coded signal , e.g. in the form of personal identification information, like personal identification number [PIN] or biometric data

Abstract

A dynamic transaction card with EuroPay-Mastercard-Visa (“EMV”)technology that includes an EMV interface connecting EMV contacts and an EMV processor to enable a multifunctional dynamic transaction card. A method of manufacturing a dynamic transaction card with an EMV interface connecting EMV contacts and an EMV processor. A dynamic transaction card with an EMV interface may be manufactured using a separate printed circuit board (PCB) layout with EMV contact patterns placed into the top surface of a molding to create the dynamic transaction card. The edges of the EMV contact patterns would be incorporated through holes, which are trimmed to scallops, to allow for surface mounting. The EMV interface may then include a connection between the EMV contact patterns and the EMV microprocessor such that the EMV microprocessor does not have to be placed directly beneath the EMV contact patterns.

Claims

1. A dynamic transaction card comprising:

a top surface layer having a EuroPay-MasterCard-Visa (“

EMV”

) contact pattern;

a backing layer;

an EMV microprocessor located between the top surface layer and the backing layer; and

an EMV interface connecting the EMV contact pattern and the EMV microprocessor, wherein;

the EMV contact pattern is no layered on top of the EMV microprocessor;

and the EMV interface provides access t- signals transmitted between the EMV microprocessor and an EMV terminal.

2. The dynamic transaction card of claim 1, wherein the EMV interface comprises conductive connections.

3. The dynamic transaction card of claim 1, wherein the EMV contact pattern interacts with an EMV terminal configured to read the EMV microprocessor.

4. The dynamic transaction card of claim 1, wherein the top surface layer is constructed out of polyethylene terephthalate, polyethylene, high-density polyethylene, polyvinyl chloride, polyvinylidene chloride, low-density polyethylene, polypropylene, polystyrene, high impact polystyrene, polyamides, acrylonitrile butadiene styrene, polyethylene/acrylonitrile butadiene styrene polycarbonate, and/or polycarbonate/acrylonitrile butadiene styrene.

5. The dynamic transaction card of claim 1, wherein the edges of the EMV contact patterns are constructed as holes in the top surface layer.

6. The dynamic transaction card of claim 5, wherein the edges of the EMV contact patterns are trimmed to scallops to provide surface mounting.

7. The dynamic transaction card of claim 1, further comprising a potting layer around the EMV microprocessor to secure the microprocessor and/or provide water resistance.

8. The dynamic transaction card of claim 7, wherein the potting layer is constructed out of a light guide, acrylic, resin, polycarbonate, epoxies, glass, and/or injection molding.

9. The dynamic transact on card of claim 1, wherein the top surface layer and/or the backing layer are consti led out of a plastic material.

21. The dynamic transaction card of claim 1, wherein a portion of the top surface layer other than the EMV contact pattern and/or the backing layer are constructed out of a plastic material.

10. A method of manufacturing a dynamic transaction card:

combining a top surface layer and an EMV contact pattern;

interlaying dynamic transaction card internal components on top of the top surface layer and EMV contact pattern combination, wherein the dynamic transaction card internal components comprise an EMV microprocessor and an EMV interface connecting the EMV microprocessor to the EMV contact pattern, and wherein the EMV microprocessor is not layered directly beneath the EMV contact pattern and the EMV interface provides access to signals transmitted between the EMV microprocessor and an EMV terminal;

securing, using a molding, the dynamic transaction card internal components of the dynamic transaction card.

11. The method of claim 10, wherein the EMV interface comprises conductive connections.

12. The method of claim 10, wherein the EMV contact pattern interacts with an EMV terminal configured to read the EMV microprocessor.

13. The method of claim 10, wherein the surface layer is constructed out of polyethylene terephthalate, polyethylene, high-density polyethylene, polyvinyl chloride, polyvinylidene chloride, low-density polyethylene, polypropylene, polystyrene, high impact polystyrene, polyamides, acrylonitrile butadiene styrene, polyethylene/acrylonitrile butadiene styrene polycarbonate, and/or polycarbontrile butadiene styrene.

14. The method of claim 10, further comprising constructing the edges of the EMV contact patterns as holes in the surface layer.

15. The m hod of claim 14, further comprising trimming the edges of the EMV contact patterns to scallops to provide surface mounting.

16. The method of claim 10, wherein molding comprises reaction injection molding (RIM).

17. The method of claim 10, further comprising securing, using a potting layer, the dynamic transaction card internal components of the dynamic transaction card.

18. The method of claim 17, wherein the potting layer is constructed out of a light guide, acrylic, resin, polycarbonate, epoxies, glass, and/or injection molding.

19. The method of claim 10, further comprising securing a backing onto the dynamic transaction card.

20. The method of claim 19, further comprising molding the top surface layer and the backing to secure the components.