METHOD FOR FILM FORMATION, AND PATTERN-FORMING METHOD

• US 20160314984A1
• Filed: 04/21/2016
• Published: 10/27/2016
• Est. Priority Date: 04/24/2015
• Status: Active Grant

• Current Assignee: JSR Corporation
• Original Assignee: JSR Corporation
• Inventors: Abe, Tsubasa, MATSUMURA, Yuushi, Wakamatsu, Goji, Nosaka, Naoya, Takimoto, Yoshio
• Granted Patent: US 9,958,781 B2
• Time in Patent Office: Days
• US Class Current: 1/1
• CPC Class Codes: C08G 8/22 Resorcinol
• CPC Class Codes: C08G 8/30 by unsaturated compounds, e.g. terpenes
• CPC Class Codes: C09D 161/14 Modified phenol-aldehyde condensates
• CPC Class Codes: G03F 7/0041 providing an etching agent upon exposure G03F7/075 takes precedence; photolytic halogen compounds G03F7/0295
• CPC Class Codes: G03F 7/094 Multilayer resist systems, e.g. planarising layers
• CPC Class Codes: G03F 7/11 having cover layers or intermediate layers, e.g. subbing layers G03F7/091 - G03F7/093, B41N3/03 take precedence
• CPC Class Codes: H01L 21/0271 comprising organic layers

Abstract

A method comprises applying a composition on a substrate to form a coating film on the substrate. The coating film is heated in an atmosphere in which an oxygen concentration is less than 1% by volume and a temperature is higher than 450° C. and 800° C. or lower, to form a film on the substrate. The composition comprises a compound comprising an aromatic ring. The oxygen concentration in the atmosphere during the heating of the coating film is preferably no greater than 0.1% by volume. The temperature in the atmosphere during the heating of the coating film is preferably 500° C. or higher and 600° C. or lower.

Claims

1. A method comprising:

applying a composition on a substrate to form a coating film on the substrate; and

heating the coating film in an atmosphere in which an oxygen concentration is less than 1% by volume and a temperature is higher than 450°

C. and 800°

C. or lower, to form a film on the substrate,

wherein the composition comprises a compound comprising an aromatic ring.

2. The method according to claim 1, wherein the oxygen concentration in the atmosphere during the heating of the coating film is no greater than 0.1% by volume.

3. The method according to claim 1, wherein the temperature in the atmosphere during the heating of the coating film is 500°

C. or higher and 600°

C. or lower.

4. The method according to claim 1, wherein the compound is a resin comprising the aromatic ring in a main chain of the resin, an aromatic ring-containing compound having a molecular weight of no less than 600 and no greater than 3000, or a combination thereof.

5. The method according to claim 4, wherein the resin is a polycondensed compound.

6. A pattern-forming method comprising:

applying a composition on an upper face side of a substrate to form a coating film on the upper face side of the substrate;

heating the coating film in an atmosphere in which an oxygen concentration is less than 1% by volume and a temperature is higher than 450°

C. and 800°

C. or lower, to form a resist underlayer film on the upper face side of the substrate,

forming a resist pattern on an upper face side of the resist underlayer film; and

forming a pattern by a plurality of times of etching operations using the resist pattern as a mask such that the substrate has a pattern,

wherein the composition comprises a compound comprising an aromatic ring.

7. The pattern-forming method according to claim 6, wherein the oxygen concentration in the atmosphere during the heating of the coating film is no greater than 0.1% by volume.

8. The pattern-forming method according to claim 6, wherein the temperature in the atmosphere during the heating of the coating film is 500°

C. or higher and 600°

C. or lower.

9. The pattern-forming method according to claim 6, wherein the compound is a resin comprising the aromatic ring in a main chain of the resin, an aromatic ring-containing compound having a molecular weight of no less than 600 and no greater than 3000, or a combination thereof.

10. The pattern-forming method according to claim 9, wherein the resin is a polycondensed compound.