METAL OXIDE-POLYMER COMPOSITE PARTICLES FOR CHEMICAL MECHANICAL PLANARIZATION

• US 20160319160A1
• Filed: 12/16/2014
• Published: 11/03/2016
• Est. Priority Date: 12/20/2013
• Status: Active Grant

• Current Assignee: Cabot Corporation
• Original Assignee: Cabot Corporation
• Inventors: Prevo, Brian G., Hampden-Smith, Mark J., Fomitchev, Dmitry, Kutsovsky, Yakov E.
• Granted Patent: US 9,982,166 B2
• Time in Patent Office: Days
• US Class Current: 1/1
• CPC Class Codes: B24B 37/044 characterised by the composition of the lapping agent
• CPC Class Codes: B24B 37/245 Pads with fixed abrasives
• CPC Class Codes: C08F 130/08 containing silicon
• CPC Class Codes: C08K 3/36 Silica
• CPC Class Codes: C09G 1/02 containing abrasives or grinding agents abrasives as such C09K3/14; polishing of semi-conductors H01L
• CPC Class Codes: C09G 1/16 on natural or synthetic resins
• CPC Class Codes: C09G 1/18 on other substances
• CPC Class Codes: C09K 3/1436 Composite particles, e.g. coated particles
• CPC Class Codes: C09K 3/1445 the coating consisting exclusively of metals
• CPC Class Codes: C09K 3/1463 Aqueous liquid suspensions

Abstract

CMP processes, tools and slurries utilize metal oxide-polymer composite particles that include metal oxide particles and a polymer core. The metal oxide particles are modified with a modifying agent and are partially or fully embedded within the polymer core. Using these processes, tools and slurries can enhance removal rates, reduce defectivity and increase cleanability with respect to comparable systems and substrates.

Claims

1. A process for removing material from a substrate through chemical and abrasive actions, the process comprising:

removing material from a substrate with a polishing pad or slurry composition, wherein the polishing pad, or the slurry composition, or both include metal oxide-polymer composite particles that comprise a plurality of metal oxide particles and a polymer core, to produce a processed surface, wherein;

the metal oxide particles are modified with a modifying agent, and

at least a portion of the metal oxide particles are partially embedded within the polymer core and project out from the polymer core.

2. The process of claim 1, further comprising cleaning the processed surface.

3. The process of claim 1, wherein the metal oxide particles are modified with a modifying agent via which the metal oxide particles are covalently attached to the polymer in the polymer core.

4. The process of claim 1, wherein the polymer core includes a polymer that is the same or different from the modifying agent.

5. The process of claim 1, wherein a portion of the metal oxide particles are partially or fully embedded within the polymer core.

6. The process of claim 1, wherein the metal oxide-polymer composite particles further include one or more ingredients selected from the group consisting of a CMP chemical etchant, a CMP processing accelerator, and a CMP passivating agent.

7. The process of claim 1, wherein the CMP slurry composition further comprises a surfactant, a rheological agent, a corrosion inhibitor, an oxidizing agent, a chelating agent, a complexing agent, particles other than the metal oxide-polymer composite particles, or any combination thereof.

8. A CMP slurry composition comprising metal oxide-polymer composite particles dispersed in an aqueous media, the metal oxide-polymer composite particles including a plurality of metal oxide particles and a polymer core, wherein:

the metal oxide particles are modified with a modifying agent, and

at least a portion of the metal oxide particles are partially embedded within the polymer core and project out from the polymer core.

9. The CMP slurry composition of claim 8, wherein the metal oxide particles are modified with a modifying agent via which the metal oxide particles are covalently attached to the polymer in the polymer core.

10. The CMP slurry composition of claim 8, wherein the polymer core comprises a polymer or copolymer of the modifying agent.

11. The CMP slurry composition of claim 8, wherein the metal oxide-polymer composite particles are treated with at least one additional modifying agent.

12. The CMP slurry composition of claim 8, wherein the metal oxide-polymer particles have a volume average diameter within the range of from about 20 nm to about 500 nm.

13. The CMP slurry composition of claim 8, wherein the polymer core comprises polymers of styrene, unsubstituted or substituted acrylates or methacrylates, olefins, vinyl esters, and acrylonitrile and copolymers and mixtures of the above.

14. The CMP slurry composition of claim 8, wherein the metal oxide particles comprise precipitated, pyrogenic, or sol gel metal oxide particles, or mixtures of two or more of these.

15. The CMP slurry composition of claim 8, wherein the metal oxide particles are selected from the group consisting of silica, alumina, ceria, titania, zirconia, zinc oxide, an iron oxide, niobium oxide, vanadium oxide, tungsten oxide, tin oxide, barium oxide, strontium oxide, calcium oxide, magnesium oxide, a phosphorus oxide, mixtures and mixed oxides of any two or more of these.

16. The CMP slurry composition of claim 8, wherein the metal oxide includes fumed silica.

17. The CMP slurry composition of claim 8, wherein the metal oxide-polymer composite particles further comprise one or more ingredients selected from the group consisting of a CMP chemical etchant, a CMP processing accelerator, and a CMP passivating agent.

18. The CMP slurry composition of claim 8, wherein the polymer core includes an inorganic material that is different in composition from the metal oxide.

24. The CMP slurry composition of claim 8, wherein a portion of the metal oxide particles are fully embedded within the polymer core.

19. A CMP polishing pad comprising metal oxide-polymer composite particles that include a plurality of metal oxide particles and a polymer core, wherein:

the metal oxide particles are modified with a modifying agent, and

at least a portion of the metal oxide particles are partially embedded within the polymer core and project out from the polymer core.

20. The CMP polishing pad of claim 19, wherein the metal oxide particles are modified with a modifying agent via which the metal oxide particles are covalently attached to the polymer in the polymer core.

21. The CMP polishing pad of claim 19, wherein the metal oxide-polymer composite particles further include one or more ingredients selected from the group consisting of a CMP chemical etchant, a CMP processing accelerator, and a CMP passivating agent.

25. The CMP polishing pad of claim 19, wherein a portion of the metal oxide particles are fully embedded within the polymer core.

22. A metal oxide-polymer composite particle comprising:

a plurality of metal oxide particles;

a polymer core; and

one or more ingredients selected from the group consisting of a CMP chemical etchant, a CMP processing accelerator, and a CMP passivating agent,

wherein at least a portion of the metal oxide particles are partially embedded within the polymer core and project out from the polymer core.

23. The metal oxide-polymer composite particle of claim 22, wherein a portion of the metal oxide particles are fully embedded within the polymer core.