SEMICONDUCTOR CHIP WITH OFFLOADED LOGIC

  • US 20160329312A1
  • Filed: 05/05/2015
  • Published: 11/10/2016
  • Est. Priority Date: 05/05/2015
  • Status: Active Application
First Claim
Patent Images

1. An apparatus, comprising:

  • an interposer;

    a first semiconductor chip mounted on the interposer; and

    a second semiconductor chip mounted on, and electrically connected to the first semiconductor chip by the interposer, the second semiconductor chip including offloaded logic of the first semiconductor chip.

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