SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
First Claim
1. A semiconductor package comprising:
- a package substrate on which a semiconductor chip is mounted;
a molding layer that covers the package substrate and molds the semiconductor chip; and
a marking film disposed on the molding layer and configured to form a discoloration region in response to an electromagnetic wave,wherein the marking film comprises a thermoreactive layer which includes a carbon black.
1 Assignment
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Accused Products
Abstract
A semiconductor package including a marking film and a method of fabricating the same are provided wherein a marking film including a thermoreactive layer may be applied to a molding layer to protect a semiconductor chip under the molding layer and to efficiently perform a marking process. The thickness of the molding layer may thereby be reduced so the entire thickness of the semiconductor package may be reduced. Also, it is possible to prevent warpage of the semiconductor package through the marking film, provide the surface of the semiconductor package with gloss and freely adjust the color of the surface of the semiconductor package.
3 Citations
20 Claims
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1. A semiconductor package comprising:
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a package substrate on which a semiconductor chip is mounted; a molding layer that covers the package substrate and molds the semiconductor chip; and a marking film disposed on the molding layer and configured to form a discoloration region in response to an electromagnetic wave, wherein the marking film comprises a thermoreactive layer which includes a carbon black. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11)
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13. A semiconductor package comprising:
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a package substrate on which a semiconductor chip is mounted; a molding layer that covers the package substrate and molds the semiconductor chip; and a marking film disposed on the molding layer and configured to form a discoloration region in response to an electromagnetic wave, wherein the marking film includes a thermoreactive layer, the thermoreactive layer comprising a carbonizable polymer and a light absorber, and the carbonizable polymer is selected from the group consisting of acrylic, phenolic, epoxy, urethane, polyamide and polyolefin, and the light absorber is selected from the group consisting of a carbon black, titanium black, Fe3O4, and a mordant black - View Dependent Claims (12, 14, 15, 16, 17, 18)
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19. A semiconductor package comprising:
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a package substrate on which a semiconductor chip is mounted; a molding layer that covers the package substrate and molds the semiconductor chip; and a marking film disposed on the molding layer and configured to form a discoloration region in response to an electromagnetic wave, wherein the marking film comprises a thermoreactive layer and a reflection layer, the thermoreactive layer including a carbon black and the reflection layer including reflectors that reflects the electromagnetic wave. - View Dependent Claims (20)
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Specification