PROCESS FOR PRODUCING A MICROFLUIDIC CIRCUIT WITHIN A THREE-DIMENSIONAL INTEGRATED STRUCTURE, AND CORRESPONDING STRUCTURE

  • US 20160343638A1
  • Filed: 12/03/2015
  • Published: 11/24/2016
  • Est. Priority Date: 05/19/2015
  • Status: Active Grant
First Claim
Patent Images

1. A process, comprising:

  • producing a three-dimensional integrated structure comprising;

    forming a first element and a second element, each first and second element having an interconnection part comprising metallization levels encased in an insulating region,producing in the first element at least one via passing through a substrate of the first element;

    producing in the insulating region of each interconnection part a metal block;

    producing in the first element at least one additional via passing through the substrate of the first element and contacting the metal block in the insulating region of the first element;

    firmly attaching the first and second elements to one another by attaching their respective interconnection parts and respective metal blocks to each other, andthen removing metal contained in said at least one additional via and in the metal blocks by etching from a rear face of the substrate of the first element so as to form a thermal cooling system comprising a cavity in place of the blocks and at least one through passage in place of said at least one additional through via.

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