SYSTEMS AND METHODS FOR SEALING A PLURALITY OF RESERVOIRS OF A MICROCHIP ELEMENT WITH A SEALING GRID

• US 20160354780A1
• Filed: 08/19/2016
• Published: 12/08/2016
• Est. Priority Date: 08/25/2011
• Status: Active Grant

• Current Assignee: DARE MB Incorporated
• Original Assignee: Microchips Biotech, Inc. (Keratin Biosciences, Inc.)
• Inventors: Farra, Robert
• Granted Patent: US 10,427,153 B2
• Time in Patent Office: Days
• US Class Current: 1/1
• CPC Class Codes: A61B 2562/12 Manufacturing methods specially adapted for producing sensors for in-vivo measurements
• CPC Class Codes: A61B 2562/168 Fluid filled sensor housings
• CPC Class Codes: A61B 5/076 Permanent implantations telemetry using implanted circuitry A61B5/0031; implanted stimulators for therapy A61N1/3605, A61N1/362, A61N1/372
• CPC Class Codes: A61B 5/4839 combined with drug delivery
• CPC Class Codes: A61B 5/6861 Capsules, e.g. for swallowing or implanting
• CPC Class Codes: A61K 9/0097 Micromachined devices; Microelectromechanical systems [MEMS]; Devices obtained by lithographic treatment of silicon; Devices comprising chips intradermal microneedle arrays A61K9/0021; MEMS in general B81B7/02
• CPC Class Codes: A61M 2205/0244 Micromachined materials, e.g. made from silicon wafers, microelectromechanical systems [MEMS] or comprising nanotechnology
• CPC Class Codes: A61M 2207/00 Methods of manufacture, assembly or production
• CPC Class Codes: A61M 31/002 Devices for releasing a drug at a continuous and controlled rate for a prolonged period of time artificial gland structures or devices A61F2/022; intra-uterine contraceptive devices A61F6/14; tampons for introducing into the vagina A61F13/20, A61L15/00; suppositories or bougies for intra-vaginal or intra-uterine application A61K9/02; physical forms of medicinal preparations for sustained or differential drug release A61K9/20, A61K9/50
• CPC Class Codes: B01L 2200/0689 Sealing
• CPC Class Codes: B01L 2200/12 Specific details about manufacturing devices
• CPC Class Codes: B01L 2300/042 Caps; Plugs
• CPC Class Codes: B01L 2300/0819 Microarrays; Biochips
• CPC Class Codes: B01L 2300/0848 Specific forms of parts of containers
• CPC Class Codes: B01L 2300/0858 Side walls
• CPC Class Codes: B01L 2300/12 Specific details about materials
• CPC Class Codes: B01L 3/502707 characterised by the manufacture of the container or its components by shaping or joining plastic parts B29C59/00, B29C65/00; by laminating B32B37/00; manufacture of microstructural devices in general B81C
• CPC Class Codes: B01L 3/502715 characterised by interfacing components, e.g. fluidic, electrical, optical or mechanical interfaces
• CPC Class Codes: B23K 20/00 Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
• CPC Class Codes: Y10T 29/49126 Assembling bases

Abstract

Systems and methods for sealing a plurality of reservoirs of a microchip element with a sealing grid are provided. For example, in one embodiment, a microchip element comprises a primary substrate having a plurality of reservoirs defined therein. The microchip element also includes a single continuous sealing groove defined in the primary substrate that extends around each of the plurality of reservoirs. In addition, the microchip element includes a sealing substrate comprising a single continuous sealing protrusion extending therefrom. The single continuous sealing protrusion corresponds to and is configured to mate with the single continuous sealing groove to form a hermetic bond between the primary substrate and the sealing substrate. In this manner, the single continuous sealing groove and the single continuous sealing protrusion form a sealing grid about the plurality of reservoirs.

Claims

1. A microchip element, comprising:

a primary substrate comprising a plurality of reservoirs defined therein;

a sealing groove defined in the primary substrate and extending between and shared by at least two of the plurality of reservoirs; and

a sealing substrate comprising a sealing protrusion extending therefrom,

wherein the sealing protrusion corresponds to and is configured to mate with the sealing groove to form a hermetic bond between the primary substrate and the sealing substrate.

2. The microchip element of claim 1, wherein each of the plurality of reservoirs is defined by a closed end wall, an open end, and at least one sidewall extending between the closed end wall and the open end.

3. The microchip element of claim 2, wherein the sealing substrate comprises a first side, an opposed second side, and a plurality of apertures extending therethrough, wherein the first side comprises a plurality of electrically conductive reservoir cap which close off the plurality of apertures.

4. The microchip element of claim 3, wherein the sealing protrusion is disposed on the second side of the sealing substrate, and wherein the second side of the sealing substrate is hermetically bonded to the primary substrate, such that the open end of the plurality of reservoirs is in fluid communication with at least one aperture of the plurality of apertures.

5. The microchip element of claim 1, wherein the sealing substrate comprises a silicon substrate.

6. The microchip element of claim 1, wherein the primary substrate comprises a polymer or a glass or other ceramic material.

7. The microchip element of claim 6, wherein the primary substrate comprises a metal coating over at least a part of the polymer, glass or other ceramic material of the primary substrate.

8. The microchip element of claim 7, wherein the metal coating coats the at least one sidewall and/or the closed end wall of the at least one reservoir.

9. The microchip element of claim 1, further comprising reservoir contents positioned within at least one reservoir of the plurality of reservoirs.

10. The microchip element of claim 1, wherein the sealing protrusion comprises gold or another metal.

11. The microchip element of claim 1, wherein the sealing groove comprises gold or another metal.

12. A microchip element, comprising:

a sealing substrate;

a primary substrate;

a plurality of reservoirs defined within the primary substrate and/or within the sealing substrate;

a sealing grid comprising a single continuous sealing groove and a single continuous sealing protrusion extending around each of the plurality of reservoirs; and

wherein the single continuous sealing protrusion corresponds to and is configured to mate with the single continuous sealing groove to form a hermetic bond between the primary substrate and the sealing substrate.

13. The microchip element of claim 12, wherein each of the plurality of reservoirs is defined by a closed end wall, an open end, and at least one sidewall extending between the closed end wall and the open end.

14. The microchip element of claim 13, wherein the sealing substrate comprises a first side, an opposed second side, and a plurality of apertures extending therethrough, wherein the first side comprises a plurality of electrically conductive reservoir cap which close off the plurality of apertures.

15. The microchip element of claim 14, wherein the single continuous sealing protrusion is disposed on the second side of the sealing substrate, and wherein the second side of the sealing substrate is hermetically bonded to the primary substrate, such that the open end of the plurality of reservoirs is in fluid communication with at least one aperture of the plurality of apertures.

16. The microchip element of claim 12, further comprising reservoir contents positioned within at least one reservoir of the plurality of reservoirs.

18. The method of claim 12, wherein the sealing substrate comprises a silicon substrate.

19. The method of claim 12, wherein the primary substrate comprises a polymer or a glass or other ceramic material.

20. The method of claim 12, wherein the single continuous sealing protrusion and the single continuous sealing groove comprise gold or another metal.

17. A method of making a microchip device element, the method comprising:

microfabricating a sealing substrate having a first side, an opposed second side, and a plurality of apertures extending therethrough, wherein the first side comprises a plurality of electrically conductive reservoirs cap which close off the plurality of apertures, wherein the second side comprises a single continuous sealing protrusion extending therefrom;

casting or molding a primary substrate having a plurality of reservoirs which are each defined by a closed end wall, an open end, at least one sidewall extending between the closed end wall and the open end, and a single continuous sealing groove disposed around the plurality of reservoirs;

providing reservoir contents within at least one reservoir of the plurality of reservoirs; and

bonding the sealing substrate to the primary substrate by compression cold welding the single continuous sealing protrusion together with the single continuous sealing groove such that the open end of the plurality of reservoirs are in fluid communication with at least one aperture of the plurality of apertures.

21. A method of hermetically sealing an array of reservoirs, the method comprising:

obtaining a sealing substrate having a first side, an opposed second side, and a plurality of apertures extending therethrough, wherein the first side comprises a plurality of electrically conductive reservoirs cap which close off the plurality of apertures, wherein the second side comprises a single continuous sealing protrusion extending therefrom and surrounding each of the apertures;

obtaining a primary substrate having a plurality of reservoirs which are each defined by a closed end wall, an open end, at least one sidewall extending between the closed end wall and the open end, and a single continuous sealing groove disposed around each of the plurality of reservoirs; and

compressing the sealing substrate to the primary substrate to force the single continuous sealing protrusion into the single continuous sealing groove to plastically deform the continuous sealing protrusion and form a cold weld and hermetically seal each of the plurality of reservoirs, with the open end of the plurality of reservoirs in fluid communication with at least one aperture of the plurality of apertures.

22. The method of claim 21, further comprising, before compressing, locating reservoir contents within at least one reservoir of the plurality of reservoirs.

23. The method of claim 21, wherein the continuous sealing protrusion comprises gold or another biocompatible metal and the continuous sealing groove has a surface which comprises gold or another biocompatible metal.

24. The method of claim 21, wherein the primary substrate is formed of silicon, the sealing substrate is formed of silicon, or both the primary and sealing substrates are formed of silicon.

25. An implantable medical device comprising:

an array of hermetically sealed reservoirs defined by two substrate portions which are bonded together by a continuous protrusion mated with a continuous groove, which surrounds each of the hermetically sealed reservoirs.

26. The device of claim 25, wherein the hermetically sealed reservoirs comprise a drug or a biosensor.