MEMS Pressure Sensor and Microphone Devices Having Through-Vias and Methods of Forming Same
First Claim
1. A micro-electromechanical (MEMS) device comprising:
- a MEMS chip comprising;
a first conductive layer comprising a first membrane for a microphone device;
a first MEMS structure and a second MEMS structure over the first conductive layer, wherein the first MEMS structure is disposed over the first membrane; and
a second conductive layer comprising a second membrane for a pressure sensor device, wherein the second membrane is disposed over the first MEMS structure;
a carrier chip bonded to the MEMS chip, the carrier chip comprising a cavity exposed to an ambient environment, wherein the cavity includes the first membrane and a first surface of the second membrane; and
a cap chip bonded to a surface of the MEMS chip opposing the carrier chip, and wherein the cap chip and the MEMS chip define a second sealed cavity and a third sealed cavity, and wherein;
the second MEMS structure is disposed in the second sealed cavity; and
a second surface of the second membrane is exposed to a sealed pressure level of the third sealed cavity.
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Abstract
A method embodiment includes providing a MEMS wafer. A portion of the MEMS wafer is patterned to provide a first membrane for a microphone device and a second membrane for a pressure sensor device. A carrier wafer is bonded to the MEMS wafer. The carrier wafer is etched to expose the first membrane and a first surface of the second membrane to an ambient environment. A MEMS structure is formed in the MEMS wafer. A cap wafer is bonded to a side of the MEMS wafer opposing the carrier wafer to form a first sealed cavity including the MEMS structure and a second sealed cavity including a second surface of the second membrane for the pressure sensor device. The cap wafer comprises an interconnect structure. A through-via electrically connected to the interconnect structure is formed in the cap wafer.
2 Citations
20 Claims
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1. A micro-electromechanical (MEMS) device comprising:
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a MEMS chip comprising; a first conductive layer comprising a first membrane for a microphone device; a first MEMS structure and a second MEMS structure over the first conductive layer, wherein the first MEMS structure is disposed over the first membrane; and a second conductive layer comprising a second membrane for a pressure sensor device, wherein the second membrane is disposed over the first MEMS structure; a carrier chip bonded to the MEMS chip, the carrier chip comprising a cavity exposed to an ambient environment, wherein the cavity includes the first membrane and a first surface of the second membrane; and a cap chip bonded to a surface of the MEMS chip opposing the carrier chip, and wherein the cap chip and the MEMS chip define a second sealed cavity and a third sealed cavity, and wherein; the second MEMS structure is disposed in the second sealed cavity; and a second surface of the second membrane is exposed to a sealed pressure level of the third sealed cavity. - View Dependent Claims (2, 3, 4, 5, 6, 7)
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8. A package comprising:
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a device chip, wherein the device chip comprises; a first conductive layer comprising a first membrane for a first device; a first micro-electromechanical (MEMS) structure over and aligned with the first membrane; and a second conductive layer comprising a second membrane for a second device different than the first device, wherein the second membrane is disposed over and aligned with the first MEMS structure, and wherein opposing surfaces of the second membrane are exposed to different pressure levels; and a cap bonded to the device chip, wherein the cap comprises; a substrate; interconnect structures disposed between the substrate and the device chip; and through-vias extending through the substrate and electrically connected to the interconnect structures. - View Dependent Claims (9, 10, 11, 12, 13, 14)
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15. A device comprising:
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a device chip comprising; a conductive layer providing a first membrane for a first device and a second membrane for a second device different than the first device; a first micro-electromechanical (MEMS) structure over and aligned with the first membrane; and a second MEMS structure over and aligned with the second membrane; and a carrier bonded to the device chip, wherein the carrier exposes a first surface of the first membrane and a second surface of the second membrane to ambient pressure; and a cap bonded to an opposing surface of the device chip as the carrier, wherein the cap comprises a through via extending through a substrate, and wherein the cap and the device chip define; a first sealed cavity extending into the substrate, wherein the first MEMS structure and a third surface of the first membrane are disposed in the first sealed cavity; and a second sealed cavity extending into the substrate, wherein the second MEMS structure and a fourth surface of the second membrane are disposed in the second sealed cavity. - View Dependent Claims (16, 17, 18, 19, 20)
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Specification