REDISTRIBUTION LAYER FOR SUBSTRATE CONTACTS
First Claim
1. A structure with an interconnection layer for redistribution of electrical connections, comprising:
- a substrate;
a plurality of first electrical connections disposed on the substrate in a first arrangement;
an insulating layer disposed on the substrate over the first electrical connections;
a plurality of second electrical connections disposed on the insulating layer in a second arrangement and disposed on a side of the insulating layer opposite the plurality of first electrical connections, each second electrical connection of the plurality of second electrical connections electrically connected to a respective first electrical connection;
an integrated circuit disposed on the substrate and electrically connected to the first electrical connections,wherein the first electrical connections in the first arrangement are more closely spaced than the second electrical connections in the second arrangement.
3 Assignments
0 Petitions
Accused Products
Abstract
A structure with an interconnection layer for redistribution of electrical connections includes a plurality of first electrical connections disposed on a substrate in a first arrangement. An insulating layer is disposed on the substrate over the first electrical connections. A plurality of second electrical connections is disposed on the insulating layer on a side of the insulating layer opposite the plurality of first electrical connections in a second arrangement. Each second electrical connection is electrically connected to a respective first electrical connection. An integrated circuit is disposed on the substrate and is electrically connected to the first electrical connections. The first electrical connections in the first arrangement have a greater spatial density than the second electrical connections in the second arrangement.
69 Citations
40 Claims
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1. A structure with an interconnection layer for redistribution of electrical connections, comprising:
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a substrate; a plurality of first electrical connections disposed on the substrate in a first arrangement; an insulating layer disposed on the substrate over the first electrical connections; a plurality of second electrical connections disposed on the insulating layer in a second arrangement and disposed on a side of the insulating layer opposite the plurality of first electrical connections, each second electrical connection of the plurality of second electrical connections electrically connected to a respective first electrical connection; an integrated circuit disposed on the substrate and electrically connected to the first electrical connections, wherein the first electrical connections in the first arrangement are more closely spaced than the second electrical connections in the second arrangement. - View Dependent Claims (4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 17, 18, 19, 20, 25, 27)
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2-3. -3. (canceled)
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16. (canceled)
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21-24. -24. (canceled)
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26. (canceled)
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28-37. -37. (canceled)
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38. A method of making a display incorporating a structure with an interconnection layer for redistributing electrical connections, comprising:
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disposing one or more inorganic light emitter(s) on a substrate, the light emitter(s) electrically connected to first electrical connections on the substrate in a first arrangement; disposing an insulating layer on the substrate over the first electrical connections; and disposing a plurality of second electrical connections on the insulating layer in a second arrangement on a side of the insulating layer opposite the plurality of first electrical connections, each second electrical connection of the plurality of second electrical connections electrically connected to a respective connection of the first electrical connections, wherein the first electrical connections in the first arrangement are more closely spaced than the second electrical connections in the second arrangement. - View Dependent Claims (39)
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40-45. -45. (canceled)
Specification