ORGANIC LIGHT-EMITTING DIODE PACKAGING STRUCTURE, METHOD FOR PACKAGING ORGANIC LIGHT-EMITTING DIODE, AND DISPLAY DEVICE

• US 20170040572A1
• Filed: 08/10/2015
• Published: 02/09/2017
• Est. Priority Date: 03/17/2015
• Status: Active Grant

• Current Assignee: BOE Technology Group Co., Ltd.
• Original Assignee: BOE Technology Group Co., Ltd.
• Inventors: GAO, Jing, ZHANG, Song
• Granted Patent: US 9,755,187 B2
• Time in Patent Office: Days
• US Class Current: 1/1
• CPC Class Codes: H10K 2102/101 comprising transparent conductive oxides [TCO]
• CPC Class Codes: H10K 2102/103 comprising indium oxides, e.g. ITO
• CPC Class Codes: H10K 2102/3026 Top emission
• CPC Class Codes: H10K 50/80 Constructional details
• CPC Class Codes: H10K 50/82 Cathodes
• CPC Class Codes: H10K 50/8445 multilayered coatings having a repetitive structure, e.g. having multiple organic-inorganic bilayers
• CPC Class Codes: H10K 71/00 Manufacture or treatment specially adapted for the organic devices covered by this subclass
• CPC Class Codes: H10K 71/60 Forming conductive regions or layers, e.g. electrodes

Abstract

The present disclosure provides an organic light-emitting diode packaging structure, a method for packaging an organic light-emitting diode and a display device. The packaging structure includes: a display area of an organic light-emitting diode arranged on a substrate; a cathode pattern arranged on the display area; a first inorganic blocking layer arranged on the cathode pattern; an organic buffer layer arranged on the first inorganic blocking layer, wherein the organic buffer layer is electrically connected at its edge to the cathode pattern in a peripheral area of the display area; and a second inorganic blocking layer, wherein the second inorganic blocking layer is connected directly at its edge to the substrate in the peripheral area of the display area, so as to cover all the other layers.

Claims

1. An organic light-emitting diode packaging structure, comprising:

a display area of an organic light-emitting diode arranged on a substrate;

a cathode pattern arranged on the display area;

a first inorganic blocking layer arranged on the cathode pattern;

a first organic buffer layer arranged on the first inorganic blocking layer, wherein the first organic buffer layer is electrically connected at its edge to the cathode pattern in a peripheral area of the display area; and

a second inorganic blocking layer, wherein the second inorganic blocking layer is connected directly at its edge to the substrate in the peripheral area of the display area, so as to cover all the other layers;

wherein the first inorganic blocking layer and the second inorganic blocking layer are both transparent, and the first organic buffer layer is conductive and transparent.

2. The packaging structure according to claim 1, wherein a plurality of inorganic blocking layers and a plurality of organic buffer layers are arranged alternately above the cathode pattern and between the cathode pattern and the second inorganic blocking layer, and each organic buffer layer is electrically connected at its edge to the cathode pattern in the peripheral area of the display area;

wherein the plurality of inorganic blocking layers comprises the first inorganic blocking layer, and the plurality of organic buffer layers comprises the first organic buffer layer.

3. The packaging structure according to claim 2, wherein each organic buffer layer is electrically connected at its edge to the cathode pattern directly in the peripheral area of the display area, or

a first one of the organic buffer layers which is closest to the cathode pattern is electrically connected at its edge to the cathode pattern directly in the peripheral area of the display area, and the organic buffer layers excepting the first one of the organic buffer layers are electrically connected at their edges to the cathode pattern indirectly in the peripheral area of the display area.

4. The packaging structure according to claim 1, wherein the first inorganic blocking layer and the second inorganic blocking layer are made of one or more of Al₂O₃, TiO₂, ZrO₂, MgO, HFO₂, Ta₂O₅, Si₃N₄, AlN, SiN, SiNO, SiO, SiO₂, SiC, SiCNx, ITO and IZO.

5. The packaging structure according to claim 1, wherein the organic buffer layer is made of an organic transparent conductive resin.

6. The packaging structure according to claim 5, wherein the organic transparent conductive resin comprises a transparent matrix resin and conductive molecules and/or conductive particles.

7. A display device, comprising the organic light-emitting diode packaging structure according to claim 1.

17. The packaging structure according to claim 2, wherein the organic buffer layer is made of an organic transparent conductive resin.

18. The packaging structure according to claim 3, wherein the organic buffer layer is made of an organic transparent conductive resin.

19. The packaging structure according to claim 4, wherein the organic buffer layer is made of an organic transparent conductive resin.

20. The display device according to claim 7, wherein a plurality of inorganic blocking layers and a plurality of organic buffer layers are arranged alternately above the cathode pattern and between the cathode pattern and the second inorganic blocking layer, and each organic buffer layer is electrically connected at its edge to the cathode pattern in the peripheral area of the display area;

wherein the plurality of inorganic blocking layers comprises the first inorganic blocking layer, and the plurality of organic buffer layers comprises the first organic buffer layer.

8. A method for packaging an organic light-emitting diode, comprising:

forming a first inorganic blocking layer on a substrate comprising a display area of the organic light-emitting diode on which a cathode pattern is arranged;

forming a first organic buffer layer on the first inorganic blocking layer, wherein the first organic buffer layer is electrically connected at its edge to the cathode pattern in a peripheral area of the display area;

forming a second inorganic blocking layer, wherein the second inorganic blocking layer is connected directly at its edge to the substrate in the peripheral area of the display area, so as to cover all the other layers;

wherein the first inorganic blocking layer and the second inorganic blocking layer are both transparent, and the first organic buffer layer is conductive and transparent.

9. The method according to claim 8, further comprising:

forming a plurality of inorganic blocking layers and a plurality of organic buffer layers alternately above the cathode pattern and between the cathode pattern and the second inorganic blocking layer, wherein

each organic buffer layer is electrically connected at its edge to the cathode pattern in the peripheral area of the display area,

the plurality of inorganic blocking layers comprises the first inorganic blocking layer, and

the plurality of organic buffer layers comprises the first organic buffer layer.

10. The method according to claim 8, wherein the step of forming the inorganic blocking layers comprises:

depositing SiNx, SiCN and/or SiOx by vacuum deposition or magnetron sputtering; and

forming the inorganic blocking layers by an etching patterning process using a mask.

11. The method according to claim 8, wherein the first inorganic blocking layer and the second inorganic blocking layer are made of one or more of Al₂O₃, TiO₂, ZrO₂, MgO, HFO₂, Ta₂O₅, Si₃N₄, AlN, SiN, SiNO, SiO, SiO₂, SiC, SiCNx, ITO and IZO.

12. The method according to claim 8, wherein the organic buffer layer is made of an organic transparent conductive resin.

13. The method according to claim 12, wherein the step of forming the organic buffer layer comprises:

processing the organic transparent conductive resin into a thin film by spin coating, or slot die coating, or spraying, or plasma enhanced chemical vapor deposition (PECVD), or vacuum thermal evaporation, or printing, and then thermo-curing the thin film.

14. The method according to claim 12, wherein the organic transparent conductive resin is formed by mixing 1-60 parts by mass of a transparent matrix resin, 1-25 parts by mass of polyaniline doped with an organic acid, and 1-20 parts by mass of a crosslinked monomer into 30-95 parts by mass of methylbenzene and stirring a resultant mixture to dissolve the transparent matrix resin, polyaniline doped with the organic acid and the crosslinked monomer with methylbenzene completely;

or

by mixing a conductive particle with a high polymer monomer, a dispersant and a surfactant uniformly.

15. The method according to claim 14, wherein the conductive particle is nanoscale SiO₂ mixed with antimony or nanoscale indium tin oxide or nano-silver.

16. The method according to claim 15, wherein a size of the conductive particle is 20-100 nm.