INSULATED ACCELEROMETER ASSEMBLY FOR HIGH VOLTAGE ENVIRONMENT

• US 20170059608A1
• Filed: 08/27/2015
• Published: 03/02/2017
• Est. Priority Date: 08/27/2015
• Status: Active Grant

• Current Assignee: GE Infrastructure Technology, LLC (General Electric Company)
• Original Assignee: General Electric Company
• Inventors: Jordan, Lawrence Edmund, Laskey, Timothy Joseph, Castillo, Cesar Everardo, Longwell, Ronald Irving, Wardell, David John
• Granted Patent: US 9,939,458 B2
• Time in Patent Office: Days
• US Class Current: 1/1
• CPC Class Codes: G01P 1/023 for acceleration measuring devices
• CPC Class Codes: G01P 15/125 by capacitive pick-up
• CPC Class Codes: H02K 11/20 for measuring, monitoring, testing, protecting or switching rectifiers H02K11/04; power electronics H02K11/33

Abstract

An insulated accelerometer assembly for a vibrated component in a high voltage environment may include: an accelerometer; a high dielectric strength potting compound encapsulating the accelerometer; a structurally supporting insulator layer such as a glass epoxy layer or mica layer(s) surrounding at least a portion of the high dielectric strength potting compound; and a conductive layer over at least a portion of the glass epoxy layer.

Claims

1. An insulated accelerometer assembly for a vibrated component in a high voltage environment, the assembly comprising:

an accelerometer;

a high dielectric strength potting compound encapsulating the accelerometer;

a structurally supporting insulator layer surrounding at least a portion of the high dielectric strength potting compound; and

a conductive layer over at least a portion of the structurally supporting insulator layer.

2. The assembly of claim 1, wherein the structurally supporting insulator layer includes a mica layer.

3. The assembly of claim 2, wherein the mica layer includes a plurality of mica layers.

4. The assembly of claim 2, wherein the accelerometer includes a lead extending therefrom, and wherein the high dielectric strength potting compound extends partially along the lead, and the mica layer extends over the high dielectric strength potting compound over the lead.

5. The assembly of claim 1, wherein the structurally supporting insulator layer includes a glass epoxy layer.

6. The assembly of claim 5, wherein the glass epoxy layer extends beyond an end of the high dielectric strength potting compound.

7. The assembly of claim 1, wherein the conductive layer includes at least one conductive silicon carbide coating.

8. The assembly of claim 7, wherein the at least one conductive silicon carbide coating includes a plurality of coatings having different conductivity levels.

9. The assembly of claim 7, wherein the at least one conductive silicon carbide coating includes a plurality of surface portions having different surface roughness.

10. The assembly of claim 1, wherein the accelerometer includes a lead extending therefrom, and wherein the high dielectric strength potting compound extends partially along the lead.

11. The assembly of claim 1, wherein the conductive layer includes a plurality of portions having different conductivity levels.

12. The assembly of claim 1, wherein the conductive layer extends partially along the lead.

13. The assembly of claim 1, further comprising an air gap positioned between the accelerometer and the high dielectric strength potting compound.

14. The assembly of claim 1, wherein the accelerometer includes a Micro Electro-Mechanical system (MEMs) capacitive circuit.

15. The assembly of claim 1, wherein the vibrated component is a stator end winding of a generator.

17. The dynamoelectric machine of claim 15, wherein the structurally supporting insulator layer includes one of:

a glass epoxy layer and a mica layer.

18. The dynamoelectric machine of claim 15, wherein structurally supporting insulator layer includes a glass epoxy layer that extends beyond an end of the high dielectric strength potting compound.

19. The dynamoelectric machine of claim 15, wherein the accelerometer includes a lead extending therefrom, and wherein the high dielectric strength potting compound extends partially along the lead.

20. The dynamoelectric machine of claim 15, wherein the conductive layer includes a plurality of portions having different conductivity levels.

16. A dynamoelectric machine comprising:

a rotor;

a stator including a plurality of stator end windings;

an insulated accelerometer assembly coupled to at least one of the plurality of stator end windings, the assembly including;

an accelerometer;

a high dielectric strength potting compound encapsulating the accelerometer;

a structurally supporting insulator layer surrounding at least a portion of the high dielectric strength potting compound; and

a conductive layer over at least a portion of the glass epoxy layer.